TW201405723A - 引線框、半導體封裝以及該等裝置之製造方法 - Google Patents

引線框、半導體封裝以及該等裝置之製造方法 Download PDF

Info

Publication number
TW201405723A
TW201405723A TW102112628A TW102112628A TW201405723A TW 201405723 A TW201405723 A TW 201405723A TW 102112628 A TW102112628 A TW 102112628A TW 102112628 A TW102112628 A TW 102112628A TW 201405723 A TW201405723 A TW 201405723A
Authority
TW
Taiwan
Prior art keywords
lead frame
terminal
terminal portion
semiconductor package
cover
Prior art date
Application number
TW102112628A
Other languages
English (en)
Chinese (zh)
Inventor
竹內之治
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201405723A publication Critical patent/TW201405723A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/458—Materials of insulating layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW102112628A 2012-04-20 2013-04-10 引線框、半導體封裝以及該等裝置之製造方法 TW201405723A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012097053A JP2013225595A (ja) 2012-04-20 2012-04-20 リードフレーム及び半導体パッケージ並びにそれらの製造方法

Publications (1)

Publication Number Publication Date
TW201405723A true TW201405723A (zh) 2014-02-01

Family

ID=49379343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102112628A TW201405723A (zh) 2012-04-20 2013-04-10 引線框、半導體封裝以及該等裝置之製造方法

Country Status (5)

Country Link
US (1) US8853841B2 (enExample)
JP (1) JP2013225595A (enExample)
KR (1) KR20130118781A (enExample)
CN (1) CN103378045A (enExample)
TW (1) TW201405723A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI781007B (zh) * 2021-06-28 2022-10-11 南韓商海成帝愛斯股份有限公司 包括其中形成有槽的引線的引線框架
TWI897650B (zh) * 2024-09-26 2025-09-11 強茂股份有限公司 孔壁形成側面可潤濕結構的封裝元件

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014188632A1 (ja) * 2013-05-23 2014-11-27 パナソニック株式会社 放熱構造を有する半導体装置および半導体装置の積層体
JP6269417B2 (ja) * 2014-09-26 2018-01-31 三菱電機株式会社 半導体装置
US20160172275A1 (en) * 2014-12-10 2016-06-16 Stmicroelectronics S.R.L. Package for a surface-mount semiconductor device and manufacturing method thereof
JP6840466B2 (ja) * 2016-03-08 2021-03-10 株式会社アムコー・テクノロジー・ジャパン 半導体パッケージ及び半導体パッケージの製造方法
JP6603169B2 (ja) * 2016-04-22 2019-11-06 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
US10153424B2 (en) * 2016-08-22 2018-12-11 Rohm Co., Ltd. Semiconductor device and mounting structure of semiconductor device
JP6800745B2 (ja) * 2016-12-28 2020-12-16 株式会社ディスコ 半導体パッケージの製造方法
JP6850202B2 (ja) * 2017-06-02 2021-03-31 株式会社三井ハイテック リードフレーム、リードフレームの製造方法および半導体装置の製造方法
JP7037368B2 (ja) * 2018-01-09 2022-03-16 ローム株式会社 半導体装置および半導体装置の製造方法
EP3736857A1 (en) * 2019-05-07 2020-11-11 Nexperia B.V. Through hole side wettable flank
CN112652583A (zh) * 2019-10-10 2021-04-13 珠海格力电器股份有限公司 一种封装器件及其生产方法
CN111106089B (zh) * 2019-11-29 2021-08-17 青岛歌尔微电子研究院有限公司 高密度管脚qfn的封装结构与方法
CN111987002A (zh) * 2020-09-04 2020-11-24 长电科技（滁州）有限公司 一种封装体成型方法
CN115083923B (zh) * 2021-03-11 2026-05-29 意法半导体股份有限公司 制造半导体器件的方法和相应的半导体器件
IT202100005759A1 (it) 2021-03-11 2022-09-11 St Microelectronics Srl Procedimento per fabbricare dispositivi a semiconduttore e dispositivo a semiconduttore corrispondente
JP7614985B2 (ja) * 2021-09-08 2025-01-16 Ｔｏｗａ株式会社 半導体装置の製造方法およびリードフレーム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002270627A (ja) * 2001-03-13 2002-09-20 New Japan Radio Co Ltd 半導体装置の製造方法
JP2004019465A (ja) * 2002-06-12 2004-01-22 Fuji Heavy Ind Ltd エンジンの圧縮圧力診断装置
WO2004082019A1 (ja) * 2003-03-11 2004-09-23 The Furukawa Electric Co. Ltd. プリント配線基板、その製造方法、リードフレームパッケージおよび光モジュール
US7195953B2 (en) * 2003-04-02 2007-03-27 Yamaha Corporation Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein
JP3915794B2 (ja) * 2003-04-02 2007-05-16 ヤマハ株式会社 半導体パッケージ、その製造方法、および、これに使用するリードフレーム
JP2006019465A (ja) * 2004-07-01 2006-01-19 Mitsui Chemicals Inc 半導体パッケージおよびその製造方法
US8501539B2 (en) * 2009-11-12 2013-08-06 Freescale Semiconductor, Inc. Semiconductor device package
JP5546363B2 (ja) * 2010-06-11 2014-07-09 ローム株式会社 半導体装置および半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI781007B (zh) * 2021-06-28 2022-10-11 南韓商海成帝愛斯股份有限公司 包括其中形成有槽的引線的引線框架
TWI897650B (zh) * 2024-09-26 2025-09-11 強茂股份有限公司 孔壁形成側面可潤濕結構的封裝元件

Also Published As

Publication number Publication date
JP2013225595A (ja) 2013-10-31
CN103378045A (zh) 2013-10-30
US8853841B2 (en) 2014-10-07
US20130277817A1 (en) 2013-10-24
KR20130118781A (ko) 2013-10-30

Similar Documents

Publication Publication Date Title
US8853841B2 (en) Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same
JP7228063B2 (ja) 半導体装置
JP5802695B2 (ja) 半導体装置、半導体装置の製造方法
JP6370071B2 (ja) 半導体装置及びその製造方法
JP2002076228A (ja) 樹脂封止型半導体装置
KR20060121823A (ko) 가역 리드리스 패키지, 및 이를 제조 및 사용하기 위한방법
JP2005057067A (ja) 半導体装置およびその製造方法
TWI634634B (zh) 半導體裝置及其製造方法
KR20150032493A (ko) 반도체 장치 및 그 제조 방법
JP2008211041A (ja) 半導体装置、リードフレームおよび半導体装置の製造方法
CN107039387B (zh) 引线框架、半导体装置及引线框架的制造方法
JP7144157B2 (ja) 半導体装置およびその製造方法
TWI775747B (zh) 半導體裝置之製造方法及半導體裝置
CN102214631A (zh) 用于半导体装置的引线框
JP4860939B2 (ja) 半導体装置
JP2006165411A (ja) 半導体装置およびその製造方法
CN113410201A (zh) 半导体装置、引线架以及半导体装置的制造方法
KR20210000777U (ko) 반도체 패키지
JP2010272734A (ja) 半導体装置及びその製造方法
TWI627714B (zh) 導線架及晶片封裝結構
JP2019102697A (ja) 半導体装置およびその製造方法
JP5285289B2 (ja) 回路装置およびその製造方法
JP2017183417A (ja) 半導体装置
JP2021100054A (ja) 半導体装置及びその製造方法
JP4994883B2 (ja) 樹脂封止型半導体装置