JP2013225595A - リードフレーム及び半導体パッケージ並びにそれらの製造方法 - Google Patents
リードフレーム及び半導体パッケージ並びにそれらの製造方法 Download PDFInfo
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Abstract
【解決手段】本半導体パッケージは、半導体チップが搭載されるチップ搭載部、及び外部接続端子となる端子部を備えたリードフレームと、前記チップ搭載部に搭載され、前記端子部と電気的に接続された半導体チップと、前記端子部を前記半導体チップ側の面である一方の面から他方の面に厚さ方向に貫通する貫通溝と、前記端子部の前記一方の面側の前記貫通溝の端部を塞ぐ蓋部と、前記端子部の前記他方の面及び前記貫通溝の内側面を露出するように前記半導体チップを封止する樹脂部と、を有し、前記端子部の前記他方の面及び前記貫通溝の前記内側面がめっき膜で被覆されている。
【選択図】図1
Description
接続信頼性を向上させる対策としては、例えば、外部接続端子にスルーホールを形成し、樹脂封止の際にスルーホール中に樹脂が入らないようにするため、スルーホール内にはんだ材料や金、銀等の導電材料を充填する技術が提案されている。この技術では、個片化後に外部接続端子の一部としてスルーホール内に充填された導電材料を半導体パッケージの側面から露出させ、接続信頼性を向上させようと試みている。
[第1の実施の形態に係る半導体パッケージの構造]
まず、第1の実施の形態に係る半導体パッケージの構造について説明する。図1は、第1の実施の形態に係る半導体パッケージを例示する図であり、図1(a)は平面図、図1(b)は図1(a)のA−A線に沿う断面図である。図1を参照するに、半導体パッケージ10は、大略すると、リードフレーム20と、めっき膜30と、蓋部40と、接合部50と、半導体チップ60と、金属線70(ボンディングワイヤ)と、樹脂部80とを有する。なお、便宜上、図1(a)において、蓋部40を梨地模様で示している。又、図1(a)において、めっき膜30は図示が省略されており、樹脂部80は透明とされている。
次に、第1の実施の形態に係る半導体パッケージの製造方法について説明する。図3〜図5は、第1の実施の形態に係る半導体パッケージの製造工程を例示する図である。
第2の実施の形態では、第1の実施の形態とは異なる構造の半導体パッケージの例を示す。なお、第2の実施の形態において、既に説明した実施の形態と同一構成部品についての説明は省略する。
まず、第2の実施の形態に係る半導体パッケージの構造について説明する。図6は、第2の実施の形態に係る半導体パッケージを例示する図であり、図6(a)は平面図、図6(b)は図6(a)のA−A線に沿う断面図である。なお、便宜上、図6(a)において、蓋部40を梨地模様で示している。又、図6(a)において、めっき膜30は図示が省略されており、樹脂部80は透明とされている。
次に、第2の実施の形態に係る半導体パッケージの製造方法について説明する。図7〜図9は、第2の実施の形態に係る半導体パッケージの製造工程を例示する図である。
第3の実施の形態では、第1の実施の形態とは異なる構造の半導体パッケージの他の例を示す。なお、第3の実施の形態において、既に説明した実施の形態と同一構成部品についての説明は省略する。
まず、第3の実施の形態に係る半導体パッケージの構造について説明する。図10は、第3の実施の形態に係る半導体パッケージを例示する図であり、図10(a)は平面図、図10(b)は図10(a)のA−A線に沿う断面図である。なお、便宜上、図10(a)において、蓋部40Bを梨地模様で示している。又、図10(a)において、めっき膜30は図示が省略されており、樹脂部80は透明とされている。
次に、第3の実施の形態に係る半導体パッケージの製造方法について説明する。図11は、第3の実施の形態に係る半導体パッケージの製造工程を例示する図である。
第4の実施の形態では、第1の実施の形態とは異なる構造の半導体パッケージの更に他の例を示す。なお、第4の実施の形態において、既に説明した実施の形態と同一構成部品についての説明は省略する。
まず、第4の実施の形態に係る半導体パッケージの構造について説明する。図12は、第4の実施の形態に係る半導体パッケージを例示する図であり、図12(a)は平面図、図12(b)は図12(a)のA−A線に沿う断面図である。なお、便宜上、図12(a)において、蓋部40C及び接合部50を梨地模様で示している。又、図12(a)において、めっき膜30は図示が省略されており、樹脂部80は透明とされている。
次に、第4の実施の形態に係る半導体パッケージの製造方法について説明する。図13は、第4の実施の形態に係る半導体パッケージの製造工程を例示する図である。
変形例1では、切断ラインの設定に関するバリエーションの例を示す。なお、変形例1において、既に説明した実施の形態と同一構成部品についての説明は省略する。又、変形例1は、第1の実施の形態に基づいて説明するが、変形例1は他の実施の形態にも適用可能である。
変形例2では、切断ラインの設定に関するバリエーションの他の例を示す。なお、変形例2において、既に説明した実施の形態と同一構成部品についての説明は省略する。又、変形例2は、第1の実施の形態に基づいて説明するが、変形例2は他の実施の形態にも適用可能である。
変形例3では、樹脂部80の形状のバリエーションの例を示す。なお、変形例3において、既に説明した実施の形態と同一構成部品についての説明は省略する。又、変形例3は、第1の実施の形態に基づいて説明するが、変形例3は他の実施の形態にも適用可能である。
20、200 リードフレーム
21 チップ搭載部
21a、22a 下面
22 端子部
22x 貫通溝
30、30A、30B めっき膜
40、40B、40C、400、400B、400C 蓋部
50 接合部
60 半導体チップ
70 金属線
80 樹脂部
80a 側面
80x 溝部
100 配線基板
110 パッド
150 メニスカス
210、220、230 領域
220x、220y、220z 貫通孔
Claims (10)
- 半導体チップが搭載されるチップ搭載部、及び外部接続端子となる端子部を備えたリードフレームと、
前記チップ搭載部に搭載され、前記端子部と電気的に接続された半導体チップと、
前記端子部を前記半導体チップ側の面である一方の面から他方の面に厚さ方向に貫通する貫通溝と、
前記端子部の前記一方の面側の前記貫通溝の端部を塞ぐ蓋部と、
前記端子部の前記他方の面及び前記貫通溝の内側面を露出するように前記半導体チップを封止する樹脂部と、を有し、
前記端子部の前記他方の面及び前記貫通溝の前記内側面がめっき膜で被覆されている半導体パッケージ。 - 前記端子部を複数有し、
複数の前記端子部に前記貫通溝が設けられ、
複数の前記貫通溝各々に対して1つずつ前記蓋部が設けられている請求項1記載の半導体パッケージ。 - 前記端子部を複数有し、
複数の前記端子部に前記貫通溝が設けられ、
隣接する少なくとも2つの前記貫通溝に対して1つの前記蓋部が設けられている請求項1記載の半導体パッケージ。 - 個片化される複数の領域を備え、
前記領域の各々は、
半導体チップが搭載されるチップ搭載部と、
外部接続端子となる端子部と、
前記チップ搭載部と前記端子部を支持する支持部と、
前記端子部を前記半導体チップが搭載される側の面である一方の面から他方の面に厚さ方向に貫通する貫通孔と、
前記端子部の前記一方の面側の前記貫通孔の端部を塞ぐ蓋部と、を有し、
前記貫通孔は、前記領域を個片化する際の切断ラインを跨ぐように形成されているリードフレーム。 - 前記端子部の前記他方の面及び前記貫通孔の内側面がめっき膜で被覆されている請求項4記載のリードフレーム。
- 前記端子部を複数有し、
複数の前記端子部に前記貫通孔が設けられ、
複数の前記貫通孔各々に対して1つずつ前記蓋部が設けられている請求項4又は5記載のリードフレーム。 - 前記端子部を複数有し、
複数の前記端子部に前記貫通孔が設けられ、
隣接する少なくとも2つの前記貫通孔に対して1つの前記蓋部が設けられている請求項4又は5記載のリードフレーム。 - 請求項4乃至7の何れか一項記載のリードフレームの前記チップ搭載部に前記半導体チップを搭載する工程と、
前記半導体チップと前記端子部とを電気的に接続する工程と、
前記めっき膜で被覆された前記端子部の前記他方の面及び前記貫通孔の前記内側面を露出するように前記半導体チップを樹脂で封止する工程と、
前記貫通孔を含む領域を厚さ方向に切断して、前記端子部に内側面がめっき膜で被覆されている貫通溝を形成する工程と、を有する半導体パッケージの製造方法。 - 金属板を加工し、半導体チップが搭載されるチップ搭載部、及び外部接続端子となる端子部であって前記半導体チップが搭載される側の面である一方の面から他方の面に厚さ方向に貫通する貫通孔を有する端子部を形成する工程と、
前記端子部の前記一方の面側に前記貫通孔の端部を塞ぐ蓋部を設ける工程と、を有するリードフレームの製造方法。 - 前記端子部の前記他方の面及び前記貫通孔の内側面にめっき膜を形成する工程を更に有する請求項9記載のリードフレームの製造方法。
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US13/855,840 US8853841B2 (en) | 2012-04-20 | 2013-04-03 | Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same |
TW102112628A TW201405723A (zh) | 2012-04-20 | 2013-04-10 | 引線框、半導體封裝以及該等裝置之製造方法 |
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