TW201400463A - 陰離子硬化性化合物用硬化劑、硬化性組成物、硬化物及新穎咪唑系化合物及其用途 - Google Patents

陰離子硬化性化合物用硬化劑、硬化性組成物、硬化物及新穎咪唑系化合物及其用途 Download PDF

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Publication number
TW201400463A
TW201400463A TW102116795A TW102116795A TW201400463A TW 201400463 A TW201400463 A TW 201400463A TW 102116795 A TW102116795 A TW 102116795A TW 102116795 A TW102116795 A TW 102116795A TW 201400463 A TW201400463 A TW 201400463A
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TW
Taiwan
Prior art keywords
group
imidazole
compound
curing agent
curing
Prior art date
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TW102116795A
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English (en)
Chinese (zh)
Inventor
Kenji Kudo
Koji Arimitsu
Original Assignee
Nippon Synthetic Chem Ind
Univ Tokyo Science Foundation
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Application filed by Nippon Synthetic Chem Ind, Univ Tokyo Science Foundation filed Critical Nippon Synthetic Chem Ind
Publication of TW201400463A publication Critical patent/TW201400463A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D231/00—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings
    • C07D231/02—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings
    • C07D231/10—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members
    • C07D231/12—Heterocyclic compounds containing 1,2-diazole or hydrogenated 1,2-diazole rings not condensed with other rings having two or three double bonds between ring members or between ring members and non-ring members with only hydrogen atoms, hydrocarbon or substituted hydrocarbon radicals, directly attached to ring carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/06—Polythioethers from cyclic thioethers
    • C08G75/08—Polythioethers from cyclic thioethers from thiiranes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/50—Improvements relating to the production of bulk chemicals
    • Y02P20/55—Design of synthesis routes, e.g. reducing the use of auxiliary or protecting groups

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW102116795A 2012-05-10 2013-05-10 陰離子硬化性化合物用硬化劑、硬化性組成物、硬化物及新穎咪唑系化合物及其用途 TW201400463A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012108169 2012-05-10

Publications (1)

Publication Number Publication Date
TW201400463A true TW201400463A (zh) 2014-01-01

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Family Applications (1)

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TW102116795A TW201400463A (zh) 2012-05-10 2013-05-10 陰離子硬化性化合物用硬化劑、硬化性組成物、硬化物及新穎咪唑系化合物及其用途

Country Status (5)

Country Link
JP (1) JP6120661B2 (ja)
KR (1) KR102048969B1 (ja)
CN (1) CN104334601A (ja)
TW (1) TW201400463A (ja)
WO (1) WO2013168691A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679231B (zh) * 2015-03-30 2019-12-11 日商東京應化工業股份有限公司 感光性樹脂組成物、圖型形成方法、硬化膜、絕緣膜、彩色濾光片、及顯示裝置
TWI731027B (zh) * 2016-01-20 2021-06-21 日商捷客斯能源股份有限公司 聚醯亞胺薄膜之製造方法、聚醯亞胺薄膜、聚醯胺酸溶液及感光性組成物

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WO2015068660A1 (ja) * 2013-11-05 2015-05-14 日本合成化学工業株式会社 新規イミダゾール系化合物
JP2016079173A (ja) * 2014-10-15 2016-05-16 日本合成化学工業株式会社 新規ピリジン系化合物、それを用いたアニオン硬化性化合物用硬化剤、硬化性組成物及び硬化物
WO2016093254A1 (ja) * 2014-12-09 2016-06-16 東京応化工業株式会社 硬化性組成物
JP6437095B2 (ja) * 2015-03-27 2018-12-12 東京応化工業株式会社 感エネルギー性樹脂組成物
WO2017026448A1 (ja) * 2015-08-07 2017-02-16 東京応化工業株式会社 ポリイミド前駆体組成物
JP6767131B2 (ja) * 2016-02-26 2020-10-14 東京応化工業株式会社 カルボン酸エステルの製造方法、エステル化剤、及び開環付加触媒
JP6705262B2 (ja) * 2016-04-04 2020-06-03 三菱ケミカル株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、および硬化物
JP6774310B2 (ja) * 2016-11-17 2020-10-21 三菱ケミカル株式会社 アニオン硬化性化合物用硬化剤、硬化性組成物、硬化物、および新規なイミダゾール系化合物
CN106866937A (zh) * 2017-02-13 2017-06-20 南京工业大学 一种新型改性咪唑类环氧树脂潜伏性固化剂及其制备方法
CN107090647A (zh) * 2017-05-11 2017-08-25 安徽库仑环境科技有限公司 一种用于防霾窗的导静电纱网的制作方法
CN111108099B (zh) * 2017-09-29 2023-09-29 东京应化工业株式会社 化合物、环氧固化催化剂、以及化合物的制造方法
CN108329265B (zh) * 2018-01-17 2020-11-03 北京化工大学 一种含咪唑离子的光固化单体及其在自修复光固化材料中的应用
KR102251401B1 (ko) * 2018-11-08 2021-05-11 주식회사 엘지화학 액정 배향제 조성물, 이를 이용한 액정 배향막의 제조 방법, 및 이를 이용한 액정 배향막 및 액정표시소자
CN112126042A (zh) * 2020-09-25 2020-12-25 肇庆市海特复合材料技术研究院 一种改性咪唑类潜伏性环氧树脂固化剂的制备方法

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JPS6055071B2 (ja) * 1982-04-16 1985-12-03 四国化成工業株式会社 イミダゾリル琥珀酸化合物および該化合物を用いるエポキシ樹脂硬化方法
JPS6351373A (ja) * 1986-08-19 1988-03-04 Shikoku Chem Corp 新規な１―シアノエチルアミノエチル―２―置換イミダゾール化合物、該化合物の合成方法および該化合物を有効成分とするポリエポキシ樹脂硬化促進剤
JPH07242653A (ja) * 1994-03-02 1995-09-19 Daicel Chem Ind Ltd イミダゾール誘導体の光学異性体分離法
JP3559817B2 (ja) * 1994-06-16 2004-09-02 綜研化学株式会社 異方導電性接着剤および異方導電性接着シート
JPH09244241A (ja) * 1996-03-13 1997-09-19 Ibiden Co Ltd めっきレジスト組成物及びプリント配線板
JP3876954B2 (ja) 1998-04-17 2007-02-07 味の素株式会社 硬化性樹脂組成物
JP3404390B2 (ja) 2000-12-18 2003-05-06 コニシ株式会社 一液湿気硬化型エポキシ樹脂組成物
JP5270092B2 (ja) * 2004-09-27 2013-08-21 日本化薬株式会社 エポキシ樹脂組成物および物品
CN100569372C (zh) * 2005-01-04 2009-12-16 华南理工大学 1，3－二酯基咪唑离子液体及其制备方法
JP5053593B2 (ja) * 2005-08-23 2012-10-17 日本特殊陶業株式会社 スルーホール用充填剤及び多層配線基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI679231B (zh) * 2015-03-30 2019-12-11 日商東京應化工業股份有限公司 感光性樹脂組成物、圖型形成方法、硬化膜、絕緣膜、彩色濾光片、及顯示裝置
TWI731027B (zh) * 2016-01-20 2021-06-21 日商捷客斯能源股份有限公司 聚醯亞胺薄膜之製造方法、聚醯亞胺薄膜、聚醯胺酸溶液及感光性組成物

Also Published As

Publication number Publication date
JP6120661B2 (ja) 2017-04-26
WO2013168691A1 (ja) 2013-11-14
JP2013253233A (ja) 2013-12-19
KR20150018771A (ko) 2015-02-24
CN104334601A (zh) 2015-02-04
KR102048969B1 (ko) 2019-11-26

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