TW200738776A - Phenol resin, process for producing thereof, epoxy resin and use thereof - Google Patents

Phenol resin, process for producing thereof, epoxy resin and use thereof

Info

Publication number
TW200738776A
TW200738776A TW095144448A TW95144448A TW200738776A TW 200738776 A TW200738776 A TW 200738776A TW 095144448 A TW095144448 A TW 095144448A TW 95144448 A TW95144448 A TW 95144448A TW 200738776 A TW200738776 A TW 200738776A
Authority
TW
Taiwan
Prior art keywords
content
formula
producing
compound
resin
Prior art date
Application number
TW095144448A
Other languages
English (en)
Other versions
TWI402290B (zh
Inventor
Katsuhiko Oshimi
Shigeru Moteki
Takao Sunaga
Masataka Nakanishi
Sumio Ichimura
Original Assignee
Nippon Kayaku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kk filed Critical Nippon Kayaku Kk
Publication of TW200738776A publication Critical patent/TW200738776A/zh
Application granted granted Critical
Publication of TWI402290B publication Critical patent/TWI402290B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Epoxy Compounds (AREA)
TW095144448A 2005-11-30 2006-11-30 酚樹脂、其製造方法、環氧樹脂及其用途 TWI402290B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005345259 2005-11-30

Publications (2)

Publication Number Publication Date
TW200738776A true TW200738776A (en) 2007-10-16
TWI402290B TWI402290B (zh) 2013-07-21

Family

ID=38092227

Family Applications (2)

Application Number Title Priority Date Filing Date
TW095144448A TWI402290B (zh) 2005-11-30 2006-11-30 酚樹脂、其製造方法、環氧樹脂及其用途
TW101142591A TWI445726B (zh) 2005-11-30 2006-11-30 Epoxy resin, epoxy resin composition and hardened product thereof

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW101142591A TWI445726B (zh) 2005-11-30 2006-11-30 Epoxy resin, epoxy resin composition and hardened product thereof

Country Status (7)

Country Link
US (1) US7968672B2 (zh)
JP (1) JP5179194B2 (zh)
KR (1) KR101256699B1 (zh)
CN (1) CN101321800B (zh)
MY (1) MY143482A (zh)
TW (2) TWI402290B (zh)
WO (1) WO2007063894A1 (zh)

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CN102209742B (zh) * 2008-11-06 2013-03-27 日本化药株式会社 酚醛树脂混合物、环氧树脂混合物、环氧树脂组合物及固化物
TWI621638B (zh) * 2008-11-28 2018-04-21 味之素股份有限公司 Resin composition
US8743561B2 (en) * 2009-08-26 2014-06-03 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer-level molded structure for package assembly
JP5515583B2 (ja) * 2009-10-02 2014-06-11 宇部興産株式会社 フェノール樹脂及びエポキシ樹脂並びにエポキシ樹脂硬化物
JP2014159531A (ja) * 2013-02-20 2014-09-04 Mitsubishi Chemicals Corp エポキシ樹脂組成物、硬化物及び半導体封止材
CN103639887A (zh) * 2013-10-28 2014-03-19 中国计量学院 面向晶体基片表面加工的柔性气动抛光盘
CN107406580B (zh) * 2015-05-29 2020-01-24 住友电木株式会社 密封用树脂组合物、半导体装置和结构体
CN105510508B (zh) * 2016-02-15 2017-11-28 北京泛博科技有限责任公司 酚醛树脂中小分子残余物含量的检测方法

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JPH04210934A (ja) * 1990-01-29 1992-08-03 Dow Chem Co:The ビスフェノールの製造方法
JP3147182B2 (ja) * 1991-04-16 2001-03-19 大日本インキ化学工業株式会社 硬化性プリプレグ及びそれを硬化した成形品
JP2952094B2 (ja) 1991-10-30 1999-09-20 新日鐵化学株式会社 エポキシ化合物
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US5412057A (en) * 1994-02-15 1995-05-02 The Dow Chemical Company Mesogen-containing aromatic anhydride compounds
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JP3587570B2 (ja) * 1994-10-20 2004-11-10 三井化学株式会社 ベンジル化ポリフェノール、そのエポキシ樹脂、それらの製造方法および用途
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Also Published As

Publication number Publication date
JP5179194B2 (ja) 2013-04-10
US7968672B2 (en) 2011-06-28
KR101256699B1 (ko) 2013-04-19
CN101321800B (zh) 2011-05-04
TWI445726B (zh) 2014-07-21
JPWO2007063894A1 (ja) 2009-05-07
CN101321800A (zh) 2008-12-10
KR20080077963A (ko) 2008-08-26
TWI402290B (zh) 2013-07-21
MY143482A (en) 2011-05-31
TW201307422A (zh) 2013-02-16
US20090286929A1 (en) 2009-11-19
WO2007063894A1 (ja) 2007-06-07

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