WO2008133108A1 - エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途 - Google Patents

エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途 Download PDF

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Publication number
WO2008133108A1
WO2008133108A1 PCT/JP2008/057344 JP2008057344W WO2008133108A1 WO 2008133108 A1 WO2008133108 A1 WO 2008133108A1 JP 2008057344 W JP2008057344 W JP 2008057344W WO 2008133108 A1 WO2008133108 A1 WO 2008133108A1
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WO
WIPO (PCT)
Prior art keywords
production
resin composition
same
curable resin
epoxy silicone
Prior art date
Application number
PCT/JP2008/057344
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English (en)
French (fr)
Inventor
Yoshito Kuroda
Masako Yokoyama
Hiroji Oda
Original Assignee
Asahi Kasei Chemicals Corporation
Asahi Kasei Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corporation, Asahi Kasei Kabushiki Kaisha filed Critical Asahi Kasei Chemicals Corporation
Priority to CN2008800123748A priority Critical patent/CN101657490B/zh
Priority to KR1020097019544A priority patent/KR101186779B1/ko
Priority to JP2009511809A priority patent/JP5335670B2/ja
Priority to US12/593,170 priority patent/US8222348B2/en
Priority to EP08740430A priority patent/EP2138525B1/en
Publication of WO2008133108A1 publication Critical patent/WO2008133108A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

　下記一般式（１）で表される化合物及び下記一般式（２）で表される化合物を少なくとも含む、平均組成式（３）で表されるエポキシシリコーンであって、［ｇ／（ａ＋ｂ＋ｃ＋ｄ＋ｅ＋ｆ＋ｇ＋ｈ＋ｉ＋ｊ）］の値が０．０２０以下の範囲であることを特徴とするエポキシシリコーン。
PCT/JP2008/057344 2007-04-17 2008-04-15 エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途 WO2008133108A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800123748A CN101657490B (zh) 2007-04-17 2008-04-15 环氧硅酮及其制造方法、以及使用该环氧硅酮的固化性树脂组合物及其用途
KR1020097019544A KR101186779B1 (ko) 2007-04-17 2008-04-15 에폭시실리콘 및 그 제조 방법, 및 그것을 이용한 경화성 수지 조성물과 그 용도
JP2009511809A JP5335670B2 (ja) 2007-04-17 2008-04-15 エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
US12/593,170 US8222348B2 (en) 2007-04-17 2008-04-15 Epoxy silicone and process for producing same, and curable mix composition using same and use thereof
EP08740430A EP2138525B1 (en) 2007-04-17 2008-04-15 Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-107714 2007-04-17
JP2007107713 2007-04-17
JP2007-107713 2007-04-17
JP2007107714 2007-04-17

Publications (1)

Publication Number Publication Date
WO2008133108A1 true WO2008133108A1 (ja) 2008-11-06

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ID=39925566

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PCT/JP2008/057344 WO2008133108A1 (ja) 2007-04-17 2008-04-15 エポキシシリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途

Country Status (7)

Country Link
US (1) US8222348B2 (ja)
EP (1) EP2138525B1 (ja)
JP (1) JP5335670B2 (ja)
KR (1) KR101186779B1 (ja)
CN (1) CN101657490B (ja)
TW (1) TWI375695B (ja)
WO (1) WO2008133108A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009270027A (ja) * 2008-05-08 2009-11-19 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びこれを用いた樹脂層付き基材の製造方法
JP2012041381A (ja) * 2010-08-12 2012-03-01 Asahi Kasei Chemicals Corp エポキシ変性シリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
KR101443264B1 (ko) 2013-04-19 2014-09-19 주식회사 씨엘디 전자 장치 및 이의 제조 방법
WO2014181754A1 (ja) * 2013-05-08 2014-11-13 旭化成ケミカルズ株式会社 硬化性樹脂組成物及びその硬化物、光半導体用封止材及びダイボンディング材、並びに光半導体発光素子
JP2014218679A (ja) * 2014-08-25 2014-11-20 旭化成ケミカルズ株式会社 シリコーン組成物、硬化性組成物及びそれを用いた発光部品

Families Citing this family (12)

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JP5700759B2 (ja) * 2010-05-25 2015-04-15 日本化薬株式会社 硬化性樹脂組成物、及びその硬化物
TWI475050B (zh) * 2011-03-30 2015-03-01 Asahi Kasei Chemicals Corp 有機聚矽氧烷、其製造方法及含有有機聚矽氧烷之硬化性樹脂組成物
EP2980123B1 (en) * 2013-03-29 2019-05-29 Idemitsu Kosan Co., Ltd Polyorganosiloxane and polycarbonate-polyorganosiloxane copolymer
US9508659B2 (en) 2013-07-01 2016-11-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus to protect a wafer edge
JP6195413B2 (ja) * 2014-03-05 2017-09-13 信越化学工業株式会社 放射線硬化性シリコーン組成物
KR102538886B1 (ko) * 2017-05-24 2023-06-01 닛산 가가쿠 가부시키가이샤 에폭시변성 폴리실록산을 함유하는 가접착제
EP3563927A1 (en) * 2018-04-30 2019-11-06 Hexion Research Belgium SA Purification of high performance epoxy resins via membrane filtration technology
CN112341755B (zh) * 2019-08-07 2023-01-17 北京科化新材料科技有限公司 耐黄变透明环氧树脂封装材料及其制备方法和应用
CN112391034B (zh) * 2019-08-13 2022-12-09 北京科化新材料科技有限公司 一种环氧树脂复合材料及其制备方法与应用
CN114163613B (zh) * 2020-09-10 2024-03-12 北京科化新材料科技有限公司 封装材料及其制备方法以及应用
CN112409401B (zh) * 2020-11-20 2022-04-19 北京硅研新材科技有限公司 含硅氢的倍半硅氧烷及其相应聚合物的制备方法
TW202300545A (zh) * 2021-06-22 2023-01-01 美商陶氏有機矽公司 可雙重固化聚矽氧組成物

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JPH0484444A (ja) 1990-07-27 1992-03-17 Toshiba Chem Corp 導電性ペースト
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See also references of EP2138525A4

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009270027A (ja) * 2008-05-08 2009-11-19 Asahi Kasei E-Materials Corp 感光性樹脂組成物及びこれを用いた樹脂層付き基材の製造方法
JP2012041381A (ja) * 2010-08-12 2012-03-01 Asahi Kasei Chemicals Corp エポキシ変性シリコーン及びその製造方法、並びに、それを用いた硬化性樹脂組成物とその用途
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
US9243007B2 (en) 2011-03-30 2016-01-26 Asahi Kasei Chemicals Corporation Organopolysiloxane, method for producing the same, and curable resin composition containing the organopolysiloxane
WO2013140601A1 (ja) * 2012-03-23 2013-09-26 株式会社Adeka ケイ素含有硬化性樹脂組成物
KR101443264B1 (ko) 2013-04-19 2014-09-19 주식회사 씨엘디 전자 장치 및 이의 제조 방법
WO2014181754A1 (ja) * 2013-05-08 2014-11-13 旭化成ケミカルズ株式会社 硬化性樹脂組成物及びその硬化物、光半導体用封止材及びダイボンディング材、並びに光半導体発光素子
JPWO2014181754A1 (ja) * 2013-05-08 2017-02-23 旭化成株式会社 硬化性樹脂組成物及びその硬化物、光半導体用封止材及びダイボンディング材、並びに光半導体発光素子
US10208206B2 (en) 2013-05-08 2019-02-19 Asahi Kasei Chemicals Corporation Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element
JP2014218679A (ja) * 2014-08-25 2014-11-20 旭化成ケミカルズ株式会社 シリコーン組成物、硬化性組成物及びそれを用いた発光部品

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CN101657490B (zh) 2012-07-04
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US20100120975A1 (en) 2010-05-13
CN101657490A (zh) 2010-02-24
TWI375695B (en) 2012-11-01
JPWO2008133108A1 (ja) 2010-07-22
EP2138525B1 (en) 2012-12-26
KR101186779B1 (ko) 2012-09-27
TW200906916A (en) 2009-02-16
EP2138525A4 (en) 2012-03-14
US8222348B2 (en) 2012-07-17

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