TW200633567A - Method and apparatus for controlling spatial temperature distribution - Google Patents
Method and apparatus for controlling spatial temperature distributionInfo
- Publication number
- TW200633567A TW200633567A TW094142661A TW94142661A TW200633567A TW 200633567 A TW200633567 A TW 200633567A TW 094142661 A TW094142661 A TW 094142661A TW 94142661 A TW94142661 A TW 94142661A TW 200633567 A TW200633567 A TW 200633567A
- Authority
- TW
- Taiwan
- Prior art keywords
- temperature
- flat support
- heater
- controlled
- thermal insulator
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/2001—Maintaining constant desired temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/004,179 US20050211385A1 (en) | 2001-04-30 | 2004-12-02 | Method and apparatus for controlling spatial temperature distribution |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200633567A true TW200633567A (en) | 2006-09-16 |
TWI481297B TWI481297B (zh) | 2015-04-11 |
Family
ID=36295018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094142661A TWI481297B (zh) | 2004-12-02 | 2005-12-02 | 控制空間溫度分布之方法及裝置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20050211385A1 (zh) |
JP (3) | JP2008522446A (zh) |
KR (1) | KR101109440B1 (zh) |
CN (2) | CN101111934A (zh) |
SG (3) | SG158101A1 (zh) |
TW (1) | TWI481297B (zh) |
WO (1) | WO2006068805A1 (zh) |
Families Citing this family (74)
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US20050211385A1 (en) | 2001-04-30 | 2005-09-29 | Lam Research Corporation, A Delaware Corporation | Method and apparatus for controlling spatial temperature distribution |
US8038796B2 (en) | 2004-12-30 | 2011-10-18 | Lam Research Corporation | Apparatus for spatial and temporal control of temperature on a substrate |
US7525787B2 (en) * | 2005-09-30 | 2009-04-28 | Lam Research Corporation | Electrostatic chuck assembly with dielectric material and/or cavity having varying thickness, profile and/or shape, method of use and apparatus incorporating same |
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US7501605B2 (en) * | 2006-08-29 | 2009-03-10 | Lam Research Corporation | Method of tuning thermal conductivity of electrostatic chuck support assembly |
US7838800B2 (en) * | 2006-09-25 | 2010-11-23 | Tokyo Electron Limited | Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system |
US7723648B2 (en) * | 2006-09-25 | 2010-05-25 | Tokyo Electron Limited | Temperature controlled substrate holder with non-uniform insulation layer for a substrate processing system |
US8083855B2 (en) * | 2007-10-31 | 2011-12-27 | Lam Research Corporation | Temperature control module using gas pressure to control thermal conductance between liquid coolant and component body |
JP5222442B2 (ja) * | 2008-02-06 | 2013-06-26 | 東京エレクトロン株式会社 | 基板載置台、基板処理装置及び被処理基板の温度制御方法 |
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JP5270310B2 (ja) * | 2008-11-13 | 2013-08-21 | 東京エレクトロン株式会社 | 静電チャック及び基板処理装置 |
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CN108062124B (zh) * | 2016-11-08 | 2020-04-07 | 中微半导体设备(上海)股份有限公司 | 一种温控晶圆安装台及其温控方法 |
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-
2004
- 2004-12-02 US US11/004,179 patent/US20050211385A1/en not_active Abandoned
-
2005
- 2005-12-01 CN CNA2005800472891A patent/CN101111934A/zh active Pending
- 2005-12-01 SG SG200907998-9A patent/SG158101A1/en unknown
- 2005-12-01 JP JP2007544574A patent/JP2008522446A/ja active Pending
- 2005-12-01 SG SG10201408008QA patent/SG10201408008QA/en unknown
- 2005-12-01 KR KR1020077014977A patent/KR101109440B1/ko active IP Right Grant
- 2005-12-01 WO PCT/US2005/043801 patent/WO2006068805A1/en active Application Filing
- 2005-12-01 CN CN2010106228155A patent/CN102122607B/zh active Active
- 2005-12-01 SG SG10201609601XA patent/SG10201609601XA/en unknown
- 2005-12-02 TW TW094142661A patent/TWI481297B/zh active
-
2009
- 2009-05-06 US US12/436,443 patent/US8963052B2/en active Active
-
2011
- 2011-08-11 JP JP2011176261A patent/JP2011244011A/ja active Pending
-
2014
- 2014-03-18 JP JP2014055288A patent/JP2014146822A/ja active Pending
-
2015
- 2015-01-12 US US14/594,648 patent/US9824904B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN101111934A (zh) | 2008-01-23 |
JP2014146822A (ja) | 2014-08-14 |
CN102122607A (zh) | 2011-07-13 |
US20050211385A1 (en) | 2005-09-29 |
CN102122607B (zh) | 2013-03-20 |
US20090215201A1 (en) | 2009-08-27 |
JP2011244011A (ja) | 2011-12-01 |
US20150187619A1 (en) | 2015-07-02 |
WO2006068805A1 (en) | 2006-06-29 |
TWI481297B (zh) | 2015-04-11 |
WO2006068805A9 (en) | 2006-08-24 |
SG158101A1 (en) | 2010-01-29 |
SG10201408008QA (en) | 2015-01-29 |
US8963052B2 (en) | 2015-02-24 |
JP2008522446A (ja) | 2008-06-26 |
KR20070088758A (ko) | 2007-08-29 |
US9824904B2 (en) | 2017-11-21 |
KR101109440B1 (ko) | 2012-01-31 |
SG10201609601XA (en) | 2016-12-29 |
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