TW200624998A - Photomask-blank, photomask and fabrication method thereof - Google Patents

Photomask-blank, photomask and fabrication method thereof

Info

Publication number
TW200624998A
TW200624998A TW094131545A TW94131545A TW200624998A TW 200624998 A TW200624998 A TW 200624998A TW 094131545 A TW094131545 A TW 094131545A TW 94131545 A TW94131545 A TW 94131545A TW 200624998 A TW200624998 A TW 200624998A
Authority
TW
Taiwan
Prior art keywords
light
silicon
film
photomask
shieldable
Prior art date
Application number
TW094131545A
Other languages
English (en)
Other versions
TWI375114B (en
Inventor
Hiroki Yoshikawa
Yukio Inazuki
Yoshinori Kinase
Satoshi Okazaki
Takashi Haraguchi
Masahide Iwakata
Yuichi Fukushima
Original Assignee
Shinetsu Chemical Co
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005220587A external-priority patent/JP4413828B2/ja
Priority claimed from JP2005220562A external-priority patent/JP4405443B2/ja
Application filed by Shinetsu Chemical Co, Toppan Printing Co Ltd filed Critical Shinetsu Chemical Co
Publication of TW200624998A publication Critical patent/TW200624998A/zh
Application granted granted Critical
Publication of TWI375114B publication Critical patent/TWI375114B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
    • G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B44C1/222—Removing surface-material, e.g. by engraving, by etching using machine-driven mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/66—Chemical treatment, e.g. leaching, acid or alkali treatment
    • C03C25/68—Chemical treatment, e.g. leaching, acid or alkali treatment by etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/54—Absorbers, e.g. of opaque materials
    • G03F1/58—Absorbers, e.g. of opaque materials having two or more different absorber layers, e.g. stacked multilayer absorbers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31616—Next to polyester [e.g., alkyd]
TW94131545A 2004-10-22 2005-09-13 Photomask-blank, photomask and fabrication method thereof TWI375114B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004308445 2004-10-22
JP2004308430 2004-10-22
JP2005220587A JP4413828B2 (ja) 2004-10-22 2005-07-29 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法
JP2005220562A JP4405443B2 (ja) 2004-10-22 2005-07-29 フォトマスクブランクおよびフォトマスクならびにこれらの製造方法

Publications (2)

Publication Number Publication Date
TW200624998A true TW200624998A (en) 2006-07-16
TWI375114B TWI375114B (en) 2012-10-21

Family

ID=35276606

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94131545A TWI375114B (en) 2004-10-22 2005-09-13 Photomask-blank, photomask and fabrication method thereof

Country Status (7)

Country Link
US (1) US7625676B2 (zh)
EP (2) EP1936437B1 (zh)
KR (2) KR101204632B1 (zh)
CN (1) CN1763632B (zh)
DE (1) DE602005017861D1 (zh)
SG (1) SG130985A1 (zh)
TW (1) TWI375114B (zh)

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TWI406085B (zh) * 2008-02-27 2013-08-21 Hoya Corp 光罩基板、光罩及該等之製造方法
US8992788B2 (en) 2011-11-18 2015-03-31 Shin-Etsu Chemical Co., Ltd. Evaluation of etching conditions for pattern-forming film
TWI485507B (zh) * 2009-09-29 2015-05-21 Ulvac Inc 光罩製造方法
TWI551940B (zh) * 2010-06-29 2016-10-01 Ｈｏｙａ股份有限公司 遮罩基板與多階調遮罩及該等製造方法

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US7771913B2 (en) * 2006-04-04 2010-08-10 Shin-Etsu Chemical Co., Ltd. Resist composition and patterning process using the same
JP5294227B2 (ja) * 2006-09-15 2013-09-18 Ｈｏｙａ株式会社 マスクブランク及び転写マスクの製造方法
JP4466881B2 (ja) * 2007-06-06 2010-05-26 信越化学工業株式会社 フォトマスクブランク、レジストパターンの形成方法、及びフォトマスクの製造方法
JP2009063638A (ja) * 2007-09-04 2009-03-26 Fujitsu Microelectronics Ltd フォトマスクの製造方法及び半導体装置の製造方法
JP5348866B2 (ja) * 2007-09-14 2013-11-20 Ｈｏｙａ株式会社 マスクの製造方法
US8216745B2 (en) * 2007-11-01 2012-07-10 Ulvac Coating Corporation Half-tone mask, half-tone mask blank and method for manufacturing half-tone mask
JP5393972B2 (ja) * 2007-11-05 2014-01-22 Ｈｏｙａ株式会社 マスクブランク及び転写用マスクの製造方法
WO2010050447A1 (ja) 2008-10-29 2010-05-06 Hoya株式会社 フォトマスクブランク、フォトマスク及びその製造方法
TWI457697B (zh) * 2009-01-15 2014-10-21 Shinetsu Chemical Co 光罩製造方法，空白光罩與乾式蝕刻法
CN102365584B (zh) 2009-01-29 2014-07-30 迪吉福来克斯有限公司 用于在光聚合物表面上产生光掩模的工艺
JP4941684B2 (ja) * 2009-03-27 2012-05-30 信越化学工業株式会社 フォトマスクブランク及びその加工方法
JP5658435B2 (ja) * 2009-03-31 2015-01-28 リンテック株式会社 マスクフィルム用部材、それを用いたマスクフィルムの製造方法及び感光性樹脂印刷版の製造方法
JP5201361B2 (ja) * 2009-05-15 2013-06-05 信越化学工業株式会社 フォトマスクブランクの加工方法
JP5257256B2 (ja) * 2009-06-11 2013-08-07 信越化学工業株式会社 フォトマスクの製造方法
TWI426565B (zh) * 2009-10-15 2014-02-11 Au Optronics Corp 顯示面板及薄膜電晶體之閘極絕緣層的重工方法
JP2011123426A (ja) * 2009-12-14 2011-06-23 Toppan Printing Co Ltd フォトマスクブランク及びフォトマスクの製造方法
JP5704754B2 (ja) 2010-01-16 2015-04-22 Hoya株式会社 マスクブランク及び転写用マスクの製造方法
KR101152618B1 (ko) * 2010-02-12 2012-06-05 주식회사 에스앤에스텍 하프톤형 위상반전 블랭크 마스크, 하프톤형 위상반전 포토 마스크 및 그의 제조 방법
KR101197250B1 (ko) * 2010-04-23 2012-11-05 주식회사 에스앤에스텍 블랭크 마스크, 포토 마스크 및 그의 제조 방법
JP5682493B2 (ja) 2010-08-04 2015-03-11 信越化学工業株式会社 バイナリーフォトマスクブランク及びバイナリーフォトマスクの製造方法
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WO2012070209A1 (ja) * 2010-11-22 2012-05-31 信越化学工業株式会社 フォトマスクブランクおよびフォトマスクの製造方法ならびにクロム系材料膜
KR101883025B1 (ko) * 2010-12-24 2018-07-27 호야 가부시키가이샤 마스크 블랭크 및 그 제조 방법, 및 전사용 마스크 및 그 제조 방법
JP5464186B2 (ja) * 2011-09-07 2014-04-09 信越化学工業株式会社 フォトマスクブランク、フォトマスク及びその製造方法
CN103858210B (zh) * 2011-09-28 2016-07-06 凸版印刷株式会社 反射型掩模坯、反射型掩模及它们的制造方法
JP5541265B2 (ja) * 2011-11-18 2014-07-09 信越化学工業株式会社 エッチングマスク膜の評価方法
JP5795991B2 (ja) * 2012-05-16 2015-10-14 信越化学工業株式会社 フォトマスクブランク、フォトマスクの製造方法、および位相シフトマスクの製造方法
JP5868905B2 (ja) * 2013-07-03 2016-02-24 信越化学工業株式会社 フォトマスクブランクの製造方法およびフォトマスクブランク
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JP2006078825A (ja) 2004-09-10 2006-03-23 Shin Etsu Chem Co Ltd フォトマスクブランクおよびフォトマスクならびにこれらの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406085B (zh) * 2008-02-27 2013-08-21 Hoya Corp 光罩基板、光罩及該等之製造方法
TWI485507B (zh) * 2009-09-29 2015-05-21 Ulvac Inc 光罩製造方法
TWI551940B (zh) * 2010-06-29 2016-10-01 Ｈｏｙａ股份有限公司 遮罩基板與多階調遮罩及該等製造方法
US8992788B2 (en) 2011-11-18 2015-03-31 Shin-Etsu Chemical Co., Ltd. Evaluation of etching conditions for pattern-forming film
TWI488001B (zh) * 2011-11-18 2015-06-11 Shinetsu Chemical Co 圖型形成膜之蝕刻條件的評估方法

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KR20120089227A (ko) 2012-08-09
EP1936437A2 (en) 2008-06-25
KR101374498B1 (ko) 2014-03-13
EP1936437A3 (en) 2008-07-16
EP1650600B1 (en) 2009-11-25
EP1936437B1 (en) 2014-06-25
CN1763632B (zh) 2011-02-16
CN1763632A (zh) 2006-04-26
TWI375114B (en) 2012-10-21
US7625676B2 (en) 2009-12-01
SG130985A1 (en) 2007-04-26
US20060088774A1 (en) 2006-04-27
KR20060049091A (ko) 2006-05-18
DE602005017861D1 (de) 2010-01-07
EP1650600A3 (en) 2006-05-31
KR101204632B1 (ko) 2012-11-23
EP1650600A2 (en) 2006-04-26

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