SK13472001A3 - Spôsob výroby viacvrstvovej platne stlačenými spojmi a kompozitnej fólie použitej v tejto doske - Google Patents
Spôsob výroby viacvrstvovej platne stlačenými spojmi a kompozitnej fólie použitej v tejto doske Download PDFInfo
- Publication number
- SK13472001A3 SK13472001A3 SK1347-2001A SK13472001A SK13472001A3 SK 13472001 A3 SK13472001 A3 SK 13472001A3 SK 13472001 A SK13472001 A SK 13472001A SK 13472001 A3 SK13472001 A3 SK 13472001A3
- Authority
- SK
- Slovakia
- Prior art keywords
- film
- layer
- functional copper
- copper foil
- foil
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 55
- 239000002131 composite material Substances 0.000 title claims abstract description 52
- 239000011888 foil Substances 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 174
- 239000011889 copper foil Substances 0.000 claims abstract description 87
- 229920005989 resin Polymers 0.000 claims abstract description 55
- 239000011347 resin Substances 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims description 77
- 229910052802 copper Inorganic materials 0.000 claims description 76
- 238000000926 separation method Methods 0.000 claims description 48
- 230000005855 radiation Effects 0.000 claims description 29
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 238000005553 drilling Methods 0.000 claims description 26
- 238000010521 absorption reaction Methods 0.000 claims description 23
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 17
- 230000001737 promoting effect Effects 0.000 claims description 16
- 238000007739 conversion coating Methods 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 10
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- 239000011651 chromium Substances 0.000 claims description 6
- 239000006229 carbon black Substances 0.000 claims description 5
- 238000002161 passivation Methods 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000002787 reinforcement Effects 0.000 claims description 3
- 230000002708 enhancing effect Effects 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 133
- 239000010410 layer Substances 0.000 description 133
- 229910052799 carbon Inorganic materials 0.000 description 17
- 239000000463 material Substances 0.000 description 17
- 238000000151 deposition Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 238000003475 lamination Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000003989 dielectric material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000012876 topography Methods 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- SQNZJJAZBFDUTD-UHFFFAOYSA-N durene Chemical compound CC1=CC(C)=C(C)C=C1C SQNZJJAZBFDUTD-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000024121 nodulation Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004172 quinoline yellow Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- MZWKCFGWAWRHDY-UHFFFAOYSA-N s-[2-(diethylamino)ethyl] 2,2-diphenylethanethioate;hydrochloride Chemical compound Cl.C=1C=CC=CC=1C(C(=O)SCCN(CC)CC)C1=CC=CC=C1 MZWKCFGWAWRHDY-UHFFFAOYSA-N 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LU90376A LU90376B1 (en) | 1999-03-23 | 1999-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
| LU90475 | 1999-11-19 | ||
| PCT/EP2000/002560 WO2000057680A1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SK13472001A3 true SK13472001A3 (sk) | 2002-04-04 |
Family
ID=26640373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SK1347-2001A SK13472001A3 (sk) | 1999-03-23 | 2000-03-23 | Spôsob výroby viacvrstvovej platne stlačenými spojmi a kompozitnej fólie použitej v tejto doske |
Country Status (19)
| Country | Link |
|---|---|
| US (1) | US6779262B1 (xx) |
| EP (1) | EP1172025B2 (xx) |
| JP (1) | JP2002540609A (xx) |
| KR (1) | KR100760432B1 (xx) |
| CN (1) | CN1193652C (xx) |
| AT (1) | ATE222046T1 (xx) |
| AU (1) | AU4108300A (xx) |
| CA (1) | CA2364918C (xx) |
| CZ (1) | CZ300550B6 (xx) |
| DE (1) | DE60000315T3 (xx) |
| EA (1) | EA003263B1 (xx) |
| ES (1) | ES2181653T5 (xx) |
| HK (1) | HK1043470B (xx) |
| HU (1) | HUP0200426A2 (xx) |
| IL (1) | IL145153A (xx) |
| MX (1) | MXPA01009619A (xx) |
| PL (1) | PL350939A1 (xx) |
| SK (1) | SK13472001A3 (xx) |
| WO (1) | WO2000057680A1 (xx) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW512467B (en) * | 1999-10-12 | 2002-12-01 | North Kk | Wiring circuit substrate and manufacturing method therefor |
| US6753483B2 (en) * | 2000-06-14 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
| SG98017A1 (en) | 2000-12-19 | 2003-08-20 | Inst Materials Research & Eng | Method of forming selective electronics plating on polymer surfaces |
| US6915473B2 (en) | 2001-05-14 | 2005-07-05 | Interdigital Technology Corporation | Method and system for implicit user equipment identification |
| LU90804B1 (fr) * | 2001-07-18 | 2003-01-20 | Circuit Foil Luxembourg Trading Sarl | Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards |
| EP1289354B1 (de) * | 2001-09-01 | 2005-11-30 | TRUMPF LASERTECHNIK GmbH | Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte |
| JP4006618B2 (ja) * | 2001-09-26 | 2007-11-14 | 日鉱金属株式会社 | キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板 |
| KR100536933B1 (ko) * | 2002-05-21 | 2005-12-14 | 가부시키가이샤 다이와 고교 | 층간 접속 구조 및 그 형성 방법 |
| US7282647B2 (en) * | 2002-12-23 | 2007-10-16 | Intel Corporation | Apparatus for improving coupling across plane discontinuities on circuit boards |
| ATE324926T1 (de) | 2003-10-24 | 2006-06-15 | Amaxa Gmbh | Verfahren zur herstellung eines elektrisch kontaktierbaren bereichs auf einem dotierten polymer und nach dem verfahren herstellbarer formkörper |
| US20060108336A1 (en) * | 2004-11-23 | 2006-05-25 | Northrop Grumman Corporation | Fabrication process for large-scale panel devices |
| FI20041525A (fi) * | 2004-11-26 | 2006-03-17 | Imbera Electronics Oy | Elektroniikkamoduuli ja menetelmä sen valmistamiseksi |
| US7834274B2 (en) * | 2005-12-30 | 2010-11-16 | Industrial Technology Research Institute | Multi-layer printed circuit board and method for fabricating the same |
| US7523545B2 (en) * | 2006-04-19 | 2009-04-28 | Dynamic Details, Inc. | Methods of manufacturing printed circuit boards with stacked micro vias |
| TW200804626A (en) * | 2006-05-19 | 2008-01-16 | Mitsui Mining & Smelting Co | Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she |
| KR100782402B1 (ko) * | 2006-10-24 | 2007-12-07 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
| KR100836653B1 (ko) * | 2006-10-25 | 2008-06-10 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
| TWI337058B (en) * | 2007-02-16 | 2011-02-01 | Unimicron Technology Corp | Circuit board process |
| JP5094323B2 (ja) * | 2007-10-15 | 2012-12-12 | 新光電気工業株式会社 | 配線基板の製造方法 |
| KR100882263B1 (ko) * | 2007-11-09 | 2009-02-06 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
| US8914974B2 (en) | 2008-10-30 | 2014-12-23 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for integrating an electronic component into a printed circuit board |
| CN101600298B (zh) * | 2009-07-09 | 2011-01-12 | 皆利士多层线路版(中山)有限公司 | 一种电路板的制作方法 |
| KR101086838B1 (ko) * | 2009-11-30 | 2011-11-24 | 엘지이노텍 주식회사 | 인쇄회로기판 제조용 캐리어 및 이를 이용한 인쇄회로기판의 제조방법 |
| US8020292B1 (en) | 2010-04-30 | 2011-09-20 | Ddi Global Corp. | Methods of manufacturing printed circuit boards |
| JP5982777B2 (ja) * | 2011-10-20 | 2016-08-31 | 日立化成株式会社 | プリント配線板の製造方法 |
| CN104160068B (zh) * | 2012-03-01 | 2017-05-24 | 三井金属矿业株式会社 | 带有载体箔的铜箔、带有载体箔的铜箔的制造方法、及用该带有载体箔的铜箔得到的激光打孔加工用覆铜层压板 |
| CN102821558B (zh) * | 2012-08-24 | 2015-08-19 | 电子科技大学 | 一种印制电路板盲孔的金属化方法 |
| JP5479551B2 (ja) * | 2012-09-14 | 2014-04-23 | 新光電気工業株式会社 | 配線基板の製造方法 |
| CN103857205A (zh) * | 2012-12-04 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | 电路板激光成孔方法 |
| US10194537B2 (en) | 2013-03-25 | 2019-01-29 | International Business Machines Corporation | Minimizing printed circuit board warpage |
| KR101540151B1 (ko) * | 2013-06-18 | 2015-07-28 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
| WO2015032103A1 (zh) * | 2013-09-09 | 2015-03-12 | 富国工业(惠阳)有限公司 | 一种多层线路板加工工艺 |
| US9365947B2 (en) | 2013-10-04 | 2016-06-14 | Invensas Corporation | Method for preparing low cost substrates |
| MY183238A (en) * | 2015-03-24 | 2021-02-18 | Mitsui Mining & Smelting Co Ltd | Ultra-thin copper foil with carrier, manufacturing method therefor, copper-clad laminate, and printed wiring board |
| JP6501627B2 (ja) * | 2015-06-03 | 2019-04-17 | 住友重機械工業株式会社 | レーザ加工装置 |
| CN109640518B (zh) * | 2019-01-30 | 2024-03-15 | 无锡深南电路有限公司 | 激光成孔方法、覆铜板和电路板 |
| CN111031690B (zh) * | 2019-12-31 | 2022-03-25 | 生益电子股份有限公司 | 一种pcb的制作方法 |
| JPWO2023286429A1 (xx) * | 2021-07-12 | 2023-01-19 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US354196A (en) † | 1886-12-14 | Safety-razor | ||
| US3674656A (en) | 1969-06-19 | 1972-07-04 | Circuit Foil Corp | Bonding treatment and products produced thereby |
| US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
| US4088544A (en) * | 1976-04-19 | 1978-05-09 | Hutkin Irving J | Composite and method for making thin copper foil |
| DE3103986A1 (de) | 1981-02-05 | 1982-09-09 | Reiner Dipl.-Phys. 8011 Vaterstetten Szepan | Verfahren zur herstellung von bohrloechern zur durchkontaktierung in elektronischen leiterplatten |
| US4398993A (en) | 1982-06-28 | 1983-08-16 | International Business Machines Corporation | Neutralizing chloride ions in via holes in multilayer printed circuit boards |
| US4489154A (en) * | 1983-12-22 | 1984-12-18 | E. I. Du Pont De Nemours And Company | Process for preparing a surprint proof |
| JPH0936550A (ja) † | 1995-07-19 | 1997-02-07 | Hitachi Chem Co Ltd | 多層プリント配線板の製造方法 |
| AU2993997A (en) * | 1996-05-01 | 1997-11-19 | Allied-Signal Inc. | New method of forming fine circuit lines |
| KR100222752B1 (ko) * | 1996-06-27 | 1999-10-01 | 이형도 | 레이저를 이용한 다층 인쇄회로기판의 제조방법 |
| JPH10190236A (ja) | 1996-12-26 | 1998-07-21 | Nippon Carbide Ind Co Inc | 多層配線板の製造方法 |
| JPH10224040A (ja) | 1997-01-31 | 1998-08-21 | Nippon Carbide Ind Co Inc | 多層配線板の製造方法 |
| JPH10321977A (ja) | 1997-05-23 | 1998-12-04 | Hitachi Chem Co Ltd | 多層プリント配線板 |
| TW469228B (en) | 1998-01-14 | 2001-12-21 | Mitsui Mining & Smelting Co | Method for producing multi-layer printed wiring boards having blind vias |
| EP0948247B1 (en) † | 1998-04-01 | 2005-08-31 | Mitsui Mining & Smelting Co., Ltd. | Method For Making A Multi-Layer Printed Wiring Board |
-
2000
- 2000-03-23 MX MXPA01009619A patent/MXPA01009619A/es active IP Right Grant
- 2000-03-23 HU HU0200426A patent/HUP0200426A2/hu unknown
- 2000-03-23 PL PL00350939A patent/PL350939A1/xx unknown
- 2000-03-23 CZ CZ20013257A patent/CZ300550B6/cs not_active IP Right Cessation
- 2000-03-23 IL IL14515300A patent/IL145153A/xx not_active IP Right Cessation
- 2000-03-23 CA CA002364918A patent/CA2364918C/en not_active Expired - Fee Related
- 2000-03-23 CN CNB008051844A patent/CN1193652C/zh not_active Expired - Lifetime
- 2000-03-23 DE DE60000315T patent/DE60000315T3/de not_active Expired - Lifetime
- 2000-03-23 EP EP00920545A patent/EP1172025B2/en not_active Expired - Lifetime
- 2000-03-23 WO PCT/EP2000/002560 patent/WO2000057680A1/en active IP Right Grant
- 2000-03-23 AU AU41083/00A patent/AU4108300A/en not_active Abandoned
- 2000-03-23 US US09/937,085 patent/US6779262B1/en not_active Expired - Fee Related
- 2000-03-23 JP JP2000607449A patent/JP2002540609A/ja active Pending
- 2000-03-23 ES ES00920545T patent/ES2181653T5/es not_active Expired - Lifetime
- 2000-03-23 SK SK1347-2001A patent/SK13472001A3/sk unknown
- 2000-03-23 AT AT00920545T patent/ATE222046T1/de active
- 2000-03-23 EA EA200100928A patent/EA003263B1/ru not_active IP Right Cessation
- 2000-03-23 KR KR1020017012161A patent/KR100760432B1/ko active IP Right Grant
-
2002
- 2002-07-08 HK HK02105066.6A patent/HK1043470B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| DE60000315D1 (de) | 2002-09-12 |
| CZ20013257A3 (cs) | 2002-01-16 |
| JP2002540609A (ja) | 2002-11-26 |
| CA2364918A1 (en) | 2000-09-28 |
| EA200100928A1 (ru) | 2002-04-25 |
| EP1172025A1 (en) | 2002-01-16 |
| AU4108300A (en) | 2000-10-09 |
| DE60000315T2 (de) | 2003-04-10 |
| CN1193652C (zh) | 2005-03-16 |
| HK1043470B (zh) | 2003-02-14 |
| EP1172025B2 (en) | 2006-04-26 |
| CN1344484A (zh) | 2002-04-10 |
| MXPA01009619A (es) | 2003-06-24 |
| PL350939A1 (en) | 2003-02-24 |
| US6779262B1 (en) | 2004-08-24 |
| KR20010108391A (ko) | 2001-12-07 |
| IL145153A (en) | 2005-05-17 |
| DE60000315T3 (de) | 2006-10-12 |
| HK1043470A1 (en) | 2002-09-13 |
| KR100760432B1 (ko) | 2007-09-20 |
| ES2181653T5 (es) | 2006-12-01 |
| IL145153A0 (en) | 2002-06-30 |
| CA2364918C (en) | 2009-04-14 |
| CZ300550B6 (cs) | 2009-06-10 |
| ES2181653T3 (es) | 2003-03-01 |
| HUP0200426A2 (en) | 2002-07-29 |
| WO2000057680A1 (en) | 2000-09-28 |
| EP1172025B1 (en) | 2002-08-07 |
| EA003263B1 (ru) | 2003-02-27 |
| ATE222046T1 (de) | 2002-08-15 |
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