WO2015032103A1 - 一种多层线路板加工工艺 - Google Patents

一种多层线路板加工工艺 Download PDF

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Publication number
WO2015032103A1
WO2015032103A1 PCT/CN2013/083162 CN2013083162W WO2015032103A1 WO 2015032103 A1 WO2015032103 A1 WO 2015032103A1 CN 2013083162 W CN2013083162 W CN 2013083162W WO 2015032103 A1 WO2015032103 A1 WO 2015032103A1
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Prior art keywords
copper
circuit board
copper foil
substrate
wiring
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PCT/CN2013/083162
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English (en)
French (fr)
Inventor
周小平
许顺喜
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富国工业(惠阳)有限公司
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Priority to PCT/CN2013/083162 priority Critical patent/WO2015032103A1/zh
Publication of WO2015032103A1 publication Critical patent/WO2015032103A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Definitions

  • the invention relates to the technical field of circuit boards, and in particular to a processing technology of a multilayer circuit board.
  • the etching process uses a certain concentration of sulfuric acid to etch the copper foil layer to produce a large amount of copper-containing waste acid solution, and in the post-treatment process of the circuit board, for example, the cleaning process also produces waste alkali liquor.
  • the waste acid solution is mainly a copper solution whose medium is hydrochloric acid (pH 1), and the waste alkali liquid is mainly a copper ammonia solution of ammonium chloride-ammonia water (pH 9-10), which is highly polluting to the environment. Due to the high price of copper, circuit board manufacturers usually recycle copper ions for such copper-containing waste liquids, so that even if the pollution is reduced, the recycling cost is very high.
  • the present invention provides a multilayer circuit board processing process that avoids plating and etching processes.
  • the technical solution of the present invention is: a multilayer circuit board processing process, the steps of which are:
  • step (6) a post-processing process of the circuit board is further included.
  • the copper-clad adhesive is an epoxy resin or a biphenyl-containing epoxy resin.
  • the method for fixing the circuit board on the processing platform in the step (1) comprises fixing after flattening, flattening under vacuum conditions, or adhering with glue having a viscosity lower than that of the copper-clad adhesive.
  • the step (2) further includes a process of treating the remaining copper foil.
  • the processing method of the multi-layer circuit board of the invention changes the processing method of the traditional circuit board etching circuit, and adopts the physical processing method, that is, the laser directly processes the line on the copper foil; the through hole and the buried hole are formed by the process of forming and welding the copper tube Blind hole; compared with the prior art, the beneficial effect is obvious:
  • the copper foil is directly processed by the wire and then bonded to the basic plate coated with copper glue to form a circuit board, thereby eliminating the step of coating the copper foil on the substrate, simplifying the process and saving cost.
  • the viscosity of the glue is only required to be lower than the viscosity of the copper-clad glue; in order to facilitate the separation of the useful line copper foil and the non-line copper foil after laser processing in the subsequent process, the viscosity is preferably lower than that of the copper-clad glue.
  • a glue class is only required to be lower than the viscosity of the copper-clad glue; in order to facilitate the separation of the useful line copper foil and the non-line copper foil after laser processing in the subsequent process, the viscosity is preferably lower than that of the copper-clad glue.
  • the copper foil is processed by laser, and the copper foil and the unnecessary copper foil are separated by laser processing; on the other hand, on the copper foil-free circuit board substrate.
  • Apply copper-clad glue to the position corresponding to the line; finally, press the above-mentioned circuit board substrate to the copper foil, and lift the circuit board substrate, then the copper foil line is attached to the substrate, and the circuit board substrate and the copper foil line are formed by hot pressing.
  • the conventional circuit board generally refers to a copper clad laminate, which is a plate-shaped material which is obtained by immersing a reinforcing material in a resin, coated with copper foil on one or both sides, and hot pressed, also called a copper clad laminate.
  • the circuit board substrate is a plate-shaped substrate material before the copper foil is uncovered, and includes a paper substrate, a fiberglass cloth substrate, a synthetic fiber cloth substrate, a non-woven substrate, and a composite substrate, and the most commonly used ones now include FR. -4 boards.
  • the copper foil can be bonded to the substrate in a manner of printing or spraying copper paste on the corresponding copper foil before or after processing to bond the substrate to the substrate.
  • the above process is the same for the production of a single-layer circuit board, and the same method can be used to form a double-layer circuit board on the other side of the circuit board substrate to form a multilayer circuit board.
  • the steps of making holes are also included. Firstly, the single-layer or double-layer circuit board is perforated according to the design file, and a copper tube of a corresponding size is installed in the hole, and one or both ends of the copper tube are slightly higher than the surface of the circuit board; the copper tube is punched to turn the copper tube It is pressed on the copper foil of the line and welded by welding process to ensure the conduction of the line.
  • the welding method can be a welding process such as laser/plasma/precision arc.
  • the copper foil is fixed to the working platform by means of gluing.
  • the copper foil can be directly laid flat on the working platform, fixed by mechanical positioning, or fixed under vacuum conditions. It can be used on the platform.
  • the whole processing environment is vacuum, which is conducive to laser processing accuracy under vacuum conditions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

一种多层线路板加工工艺。该工艺是将覆铜铜箔定位固定在加工平台上，按设计文件采用激光进行线路加工，把线路铜箔与不需要的铜箔分开；再按设计好的线路文件，将线路板基板对应有线路的位置涂抹覆铜胶，然后将线路板基板对位压接在铜箔上，提起线路板基板则铜箔线路附于基板上，热压固定；按设计文件对线路板打孔，在孔内装设对应尺寸的铜管，铜管一端成型或两端略高于线路板表面，冲压铜管两端使铜管翻边压在线路铜箔上并焊接；采用该方法制作各层板后层压形成多层板。解决了电镀、蚀刻线路工艺的污染问题；且省去了蚀刻液回收再处理的工序，省去基板覆铜箔的步骤。

Description

一种多层线路板加工工艺 技术领域
本发明涉及线路板技术领域，具体涉及一种多层线路板加工工艺。
背景技术
现有多层线路板加工工艺中存在的污染是人所共知的，污染问题是整个行业的共性难题。各个线路板厂家都要花费大量的人力和财力用于污染的防治，并尽可能的优化工艺以减少污染。但这些工艺优化均是治标不治本的解决办法。我们知道，线路板的加工均是采用附有铜箔的基板，通过蚀刻工艺在基板上形成线路，再经过清洗烘干等一系列的处理工序最终获得成品板。蚀刻工艺是采用一定浓度的硫酸对铜箔层进行腐蚀，产生大量的含铜废酸液，另外线路板后处理过程中例如清洗工序也会产生废碱液。废酸液主要是介质为盐酸(pH1)的铜溶液，废碱液主要是介质为氯化铵-氨水(pH9～10)铜氨溶液,对环境污染较大。由于铜价格较高，对于这类含铜废液,线路板厂家通常都要将铜离子回收再利用，这样即使减少污染，但回收成本非常高。
发明内容
为从根本上解决上述问题，本发明提供一种可避免采用电镀及蚀刻工艺的多层线路板加工工艺。
本发明的技术方案为：一种多层线路板加工工艺，其步骤为：
（1）将铜箔定位固定于加工平台上；按设计好的线路排布，采用激光对铜箔进行加工，把线路铜箔与不需要的铜箔通过激光加工分开；
（2）另,按设计好的线路排布，将线路板基板对应有线路的位置涂抹覆铜胶；将线路板基板对位压接在铜箔上，提起线路板基板则铜箔线路附于基板上,并热压固定；
（3） 重复步骤（1）（2）在线路板基板第二面制作线路；
（4） 按设计文件对线路板打孔；
（5） 在孔内装设对应尺寸的铜管，铜管一端或两端略高于线路板表面；
（6）对铜管进行冲压，使铜管翻边压接在线路铜箔上并采用焊接的方式，形成通孔、埋孔、盲孔；
（7）将制作好的单层及双层线路板层压形成多层线路板。
具体的，步骤（6）后还包括线路板的后处理工序。
具体的，所述覆铜胶为环氧树脂胶或含联苯结构型环氧树脂。
具体的，步骤(1)中将线路板固定在加工平台上的方法包括平置后固定、在真空条件下平置或采用粘度低于覆铜胶的胶粘附。
具体的，步骤（2）还包括对剩余铜箔的处理过程。
本发明所述多层线路板加工工艺改变传统线路板蚀刻线路的加工方法，采用物理加工的方式，即激光直接在铜箔上加工成线路；通过铜管成型焊接的工艺形成通孔、埋孔、盲孔；与现有技术相比较，有益效果明显：
（1） 该工艺从根本上解决了蚀刻线路工艺和孔的沉铜电镀工艺的污染问题，可以说是线路板行业的革命性改进；
（2） 该工艺采用激光加工方式，自动化程度高，过程和精度更易控制；
（3） 省去了蚀刻液回收再处理的工序，大大节约企业成本；
（4）采用铜箔直接进行线路加工后再与涂覆铜胶的基本板贴合形成线路板，省去基板覆铜箔的步骤，简化工艺，节约成本。
具体实施方式
下面结合具体实施例对本发明作进一步的详细说明。
实施例
所述多层线路板的加工工艺的具体步骤如下:
（1）在加工平台上涂覆一定粘度的胶，将铜箔定位粘结于加工平台上。该胶的粘度只要低于覆铜胶粘度即可；为了在后工序中能够方便的将激光加工后的有用的线路铜箔和非线路铜箔分开，优选粘度低于覆铜胶二分之一的胶类。
（2）然后再分别按设计好的线路文件，一方面采用激光对铜箔进行加工，把线路铜箔与不需要的铜箔通过激光加工分开；一方面在未覆铜箔的线路板基板上对应有线路的位置涂抹覆铜胶；最后将上述线路板基板对位压接在铜箔上，提起线路板基板则铜箔线路附于基板上，采用热压固定线路板基板及铜箔线路形成线路板。现有的线路板基本一般是指覆铜板，其是将补强材料浸以树脂，一面或两面覆以铜箔，经热压而成的一种板状材料，也称为覆铜箔层压板，是做PCB线路板的基本材料，也叫基材；用于多层板生产时，也叫芯板（CORE）。本发明所述的线路板基板是未覆铜箔前的板状基材材料，包括纸基板、玻纤布基板、合成纤维布基板、无纺布基板、复合基板，现在最常用的还包括FR-4板。本步骤中，还需对留在工作平台上的非线路铜箔做处理，一般采用推刮等物理方法处理即可。该剩余铜箔可方便的回收再利用。
线路铜箔与基材的结合方式也可以是在加工前或加工后，在对应的线路铜箔上印刷或喷涂覆铜胶，使其与线路板基材粘合。
上述为制作单层线路板工艺相同，采用上述同样的方法，可在线路板基材的另一面也覆上线路铜箔，制成双层线路板，进而制成多层线路板。
（3）制作多层线路板时，还包括制孔的步骤。首先，按设计文件对上述单层或双层线路板打孔，在孔内装设对应尺寸的铜管，铜管一端或两端略高于线路板表面；对铜管进行冲压，使铜管翻边压在线路铜箔上并采用焊接工艺焊接，确保线路的导通。焊接方式可采用激光/等离子/精密电弧等焊接工艺。
（4）最后将制好的多个线路板层压形成多层线路板。
在每层线路板制作完成后都需要对线路板进行表面清理、线路检测等等。这些工序本领域技术人员采用常规处理方式即可，再此不再赘述。
上述实施例中，采用胶粘的方式将铜箔固定到工作平台上，实际操作中，可以直接将铜箔铺平平置在工作平台上，结合机械定位方式固定；或者在真空条件下固定在工作平台上均可，此时整个加工环境为真空，真空条件下有利于激光加工精度。
上述实施例仅为本发明的其中一种实现方式，其描述较为具体和详细，不能因此而理解为对本发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些显而易见的替换形式均属于本发明的保护范围。

Claims (5)

  1. 一种多层线路板加工工艺，其步骤为：
    （1） 将铜箔定位固定于加工平台上；按设计好的线路排布，采用激光对铜箔进行加工，把线路铜箔与不需要的铜箔通过激光加工分开；
    （2） 另,按设计好的线路排布，将线路板基板对应有线路的位置涂抹覆铜胶；将线路板基板对位压接在铜箔上，提起线路板基板则铜箔线路附于基板上,并热压固定；
    （3） 重复步骤（1）（2）在线路板基板第二面制作线路；
    （4） 按设计文件对线路板打孔；
    （5） 在孔内装设对应尺寸的铜管，铜管一端或两端略高于线路板表面；
    （6） 对铜管进行冲压，使铜管翻边压接在线路铜箔上并采用焊接的方式，形成通孔、埋孔、盲孔；
    （7） 将制作好的单层及双层线路板层压形成多层线路板。
  2. 根据权利要求1所述的多层线路板加工工艺，其特征在于：步骤（6）后还包括线路板的后处理工序。
  3. 根据权利要求1所述的多层线路板加工工艺，其特征在于：所述覆铜胶为环氧树脂胶或含联苯结构型环氧树脂。
  4. 根据权利要求1所述的多层线路板加工工艺，其特征在于：步骤(1)中将线路板固定在加工平台上的方法包括平置后固定、在真空条件下平置或采用粘度低于覆铜胶的胶粘附。
  5. 根据权利要求1所述的多层线路板加工工艺，其特征在于：步骤（2）还包括对剩余铜箔的处理过程。
PCT/CN2013/083162 2013-09-09 2013-09-09 一种多层线路板加工工艺 WO2015032103A1 (zh)

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CN107864574A (zh) * 2017-09-26 2018-03-30 惠州绿草电子科技有限公司 一种用于生产电路板的全自动数控冲贴一体化设备

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CN1344484A (zh) * 1999-03-23 2002-04-10 瑟基特.弗依卢森堡贸易公司 制造多层印刷电路板的方法及用于其中的复合片
JP2008078250A (ja) * 2006-09-20 2008-04-03 Hitachi Cable Ltd 配線板の製造方法
US20100326704A1 (en) * 2009-06-30 2010-12-30 Wintek Corporation Soldering pad layout for flexible printed circuit board
CN102548186A (zh) * 2012-02-15 2012-07-04 深圳崇达多层线路板有限公司 一种对称压合结构hdi板及制作方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1344484A (zh) * 1999-03-23 2002-04-10 瑟基特.弗依卢森堡贸易公司 制造多层印刷电路板的方法及用于其中的复合片
JP2008078250A (ja) * 2006-09-20 2008-04-03 Hitachi Cable Ltd 配線板の製造方法
US20100326704A1 (en) * 2009-06-30 2010-12-30 Wintek Corporation Soldering pad layout for flexible printed circuit board
CN102548186A (zh) * 2012-02-15 2012-07-04 深圳崇达多层线路板有限公司 一种对称压合结构hdi板及制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107864574A (zh) * 2017-09-26 2018-03-30 惠州绿草电子科技有限公司 一种用于生产电路板的全自动数控冲贴一体化设备
CN107864574B (zh) * 2017-09-26 2024-04-19 李新明 一种用于生产电路板的全自动数控冲贴一体化设备

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