KR20010108391A - 다층 인쇄회로기판의 제작방법 및 이에 이용되는 복합 호일 - Google Patents
다층 인쇄회로기판의 제작방법 및 이에 이용되는 복합 호일 Download PDFInfo
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- KR20010108391A KR20010108391A KR1020017012161A KR20017012161A KR20010108391A KR 20010108391 A KR20010108391 A KR 20010108391A KR 1020017012161 A KR1020017012161 A KR 1020017012161A KR 20017012161 A KR20017012161 A KR 20017012161A KR 20010108391 A KR20010108391 A KR 20010108391A
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- foil
- copper foil
- layer
- functional copper
- composite
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- 239000011888 foil Substances 0.000 title claims abstract description 97
- 239000002131 composite material Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 148
- 239000011889 copper foil Substances 0.000 claims abstract description 102
- 229920005989 resin Polymers 0.000 claims abstract description 52
- 239000011347 resin Substances 0.000 claims abstract description 52
- 239000010410 layer Substances 0.000 claims description 149
- 239000010949 copper Substances 0.000 claims description 42
- 229910052802 copper Inorganic materials 0.000 claims description 41
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 19
- 238000010521 absorption reaction Methods 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000004020 conductor Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 239000006229 carbon black Substances 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 230000002787 reinforcement Effects 0.000 claims description 3
- 238000007772 electroless plating Methods 0.000 claims description 2
- 238000002161 passivation Methods 0.000 claims description 2
- 238000007739 conversion coating Methods 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 description 16
- 239000000463 material Substances 0.000 description 15
- 238000005530 etching Methods 0.000 description 10
- 238000004070 electrodeposition Methods 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- 238000003475 lamination Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 235000019241 carbon black Nutrition 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- FMWMEQINULDRBI-UHFFFAOYSA-L copper;sulfite Chemical compound [Cu+2].[O-]S([O-])=O FMWMEQINULDRBI-UHFFFAOYSA-L 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- SQNZJJAZBFDUTD-UHFFFAOYSA-N durene Chemical compound CC1=CC(C)=C(C)C=C1C SQNZJJAZBFDUTD-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004172 quinoline yellow Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Abstract
Description
Claims (26)
- a) 중심 보드(20)를 마련하고;b) 캐리어 호일(12)이 적층된 기능성 구리 호일(16)을 포함하는 복합 호일을 제조하고, 상기 기능성 구리 호일(16)은 캐리어 호일(12)의 정면과 접하며 후면에 레진이 코팅된 것이고;c) 상기 중심 보드(20)의 일측의 레진 코팅된 후면에 상기 복합 호일(10)을 적층시키고;d) 상기 기능성 구리 호일(16)로부터 캐리어 호일(12)을 제거하여 기능성 구리 호일(16)의 정면을 노출시키고,e) 미세바이어(microvia)를 형성하도록 상기 기능성 구리 호일(16) 및 상기 레진의 전체에 홀을 천공하는 단계를 포함하는 다층 PCB의 제작방법에 있어서,상기 기능성 구리 호일(16)이 두께가 10 ㎛ 미만이고,CO2레이저 원이 상기 기능성 구리 호일(16) 전체에 노출된 정면에 홀을 천공시키는데 이용하는 것을 특징으로 하는 방법.
- 제 1항에 있어서, 상기 기능성 구리 호일(16)이 전기증착되어 두께가 약 5 ㎛인 것을 특징으로 하는 방법.
- 제1항 또는 제2항에 있어서, 상기 기능성 구리 호일(16)의 정면에 CO2레이저의 흡수를 용이하게 하는 표면 제작을 수행하는 것을 특징으로 하는 방법.
- 제3항에 있어서, 상기 표면처리가 CO2레이저의 흡수를 용이하게 하도록 입자상 표면 프로파일(profile) 및 거칠기(roughness)를 제공하는 것을 특징으로 하는 방법.
- 제3항 또는 제4항에 있어서, 상기 표면제작이 CO2레이저의 흡수를 용이하게 하도록 입자상 표면 색상을 나타내는 것을 특징으로 하는 방법.
- 제3항, 제4항 또는 제5항에 있어서, 상기 표면제작이 상기 복합 호일(16)의 제작시 수행되는 것을 특징으로 하는 방법.
- 제1항 내지 제6항 중 어느 한항에 있어서, 상기 기능성 구리 호일(16)의 정면이 레이저 천공에 앞서 흑피(black oxide) 환원 코팅(conversion coating)으로 적층되는 것을 특징으로 하는 방법.
- 전항중 어느 한항에 있어서, 상기 복합 호일(10)이 상기 캐리어 호일(12) 및 상기 기능성 구리 호일(16)의 층간에 이형층(14)을 더욱 포함하고; 및상기 캐리어 호일(12)의 제거단계 d)가 캐리어 호일 및 이형층을 기계적으로 지속적으로 벗겨져 제거되는 것을 특징으로 하는 방법.
- 제1항 내지 제6항 중 어느 한항에 있어서, 상기 복합 호일이 상기 캐리어 호일 및 상기 기능성 구리 호일층 사이에 이형층을 더욱 포함하고, 상기 이형층이 CO2레이저의 흡수를 용이하게 하도록 입자상 표면 색을 포함하는 것을 특징으로 하는 방법.
- 전항중 어느 한항에 있어서, 상기 레진이 B-단계 레진층을 포함하는 것을 특징으로 하는 방법.
- 전항중 어느 한항에 있어서, 상기 레진층이 기능성 구리 호일(16)의 후면에 적용되는 C-단계 레진층 및 상기 C-단계 레진층에 도입되는 B-단계 레진층을 포함하는 것을 특징으로 하는 방법.
- 전항중 어느 한항에 있어서, 구리가 기능성 구리 호일(16)에 무전기 상태(electroless)로 도금하는 단계 e)를 포함하는 것을 특징으로 하는 방법.
- 제12항에 있어서, 두께를 증가시키기 위하여 기능성 구리 호일(16) 상부에 구리를 전기증착시키는 전기적 강화단계(galvanic reinforcement step)를 이어서포함하는 것을 특징으로 하는 방법.
- 캐리어 호일(12);상기 캐리어 호일(12)의 일측상의 이형층(14);상기 이형층(14)이 증착된 기능성 구리 호일(16), 상기 기능성 구리 호일이 이형층과 접하는 정면(front side) 및 후면(back side)을 포함하고,상기 기능성 구리 호일(16)의 후면의 레진 코팅(18)을 포함하는 다층 PCB의 제조에 이용되는 복합 호일에 있어서,상기 기능성 구리 호일(16)의 두께가 10 ㎛ 미만이고,상기 기능성 구리 호일(16)의 정면이 CO2레이저의 흡수를 용이하게 하는 표면 제작을 수행하는 것을 특징으로 하는 복합 호일.
- 제14항에 있어서, 상기 정면이 CO2레이저의 흡수를 용이하게 하도록 입자상 표면 프로파일 및 거칠기를 포함하는 것을 특징으로 하는 복합 호일.
- 제14 또는 15항에 있어서, 상기 정면이 CO2레이저의 흡수가 용이하도록 입자상 표면색을 포함하는 것을 특징으로 하는 복합 호일.
- 제14항, 제15항 또는 제16항에 있어서, 상기 기능성 구리 호일(16)이 상기이형층(14)에 전기증착되어 두께가 5 ㎛인 것을 특징으로 하는 복합 호일.
- 제16항에 있어서, 상기 표면색이 이형층(14) 및 기능성 구리 호일(16) 사이에 어두운 색의 전기전도성 물질의 박막층을 형성하여 이루어짐을 특징으로 하는 복합 호일.
- 제14항 내지 18항 중 어느 한항에 있어서, 상기 캐리어 호일(12)의 두께가 13 내지 150 ㎛이고, 상기 이형층의 두께가 1 ㎛이고, 상기 레진 코팅층의 두께가 5 내지 150 ㎛인 것을 특징으로 하는 복합 호일.
- 제14항 내지 제19항 중 어느 한항에 있어서, 상기 이형층이 크롬을 기초로 하는 층인 것을 특징으로 하는 복합 호일.
- 제16항에 있어서, 상기 이형층이 캐리어 호일의 박리시 기능성 구리 호일의 정면에 부착된채 남아있고,상기 이형층이 CO2레이저의 흡수를 용이하게 하도록 입자상 표면색을 포함하는 것을 특징으로 하는 복합 호일.
- 제21항에 있어서, 상기 이형층이 어두운 색의 전기전도성 물질의 박막층인 것을 특징으로 하는 복합 호일.
- 제18 또는 22항에 있어서, 상기 어두운 색의 전기전도성 물질의 박막층이 카본 블랙 및/또는 그라파이트인 것을 특징으로 하는 복합 호일.
- 제18항 또는 22항에 있어서, 상기 어두운 색의 전기전도성 물질의 박막층이 어두운 색의 전기전도성 고분자인 것을 특징으로 하는 복합 호일.
- 제14항 내지 24항 중 어느 한항에 있어서, 기능성 구리 호일(16)의 후면에 결합층을 포함하는 것을 특징으로 하는 복합 호일.
- 제14항 내지 제25항 중 어느 한항에 있어서, 상기 기능성 구리 호일(16)의 후면 상부에 인화(passivation)층을 포함하고, 바람직하기로는 결합층 및 레진 코팅층(18) 간에 포함하는 것을 특징으로 하는 복합 호일.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU90376A LU90376B1 (en) | 1999-03-23 | 1999-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
LU90376 | 1999-03-23 | ||
LU90475 | 1999-11-19 | ||
LU90475 | 1999-11-19 |
Publications (2)
Publication Number | Publication Date |
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KR20010108391A true KR20010108391A (ko) | 2001-12-07 |
KR100760432B1 KR100760432B1 (ko) | 2007-09-20 |
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KR1020017012161A KR100760432B1 (ko) | 1999-03-23 | 2000-03-23 | 다층 인쇄회로기판의 제작방법 및 이에 이용되는 복합 호일 |
Country Status (19)
Country | Link |
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US (1) | US6779262B1 (ko) |
EP (1) | EP1172025B2 (ko) |
JP (1) | JP2002540609A (ko) |
KR (1) | KR100760432B1 (ko) |
CN (1) | CN1193652C (ko) |
AT (1) | ATE222046T1 (ko) |
AU (1) | AU4108300A (ko) |
CA (1) | CA2364918C (ko) |
CZ (1) | CZ300550B6 (ko) |
DE (1) | DE60000315T3 (ko) |
EA (1) | EA003263B1 (ko) |
ES (1) | ES2181653T5 (ko) |
HK (1) | HK1043470B (ko) |
HU (1) | HUP0200426A2 (ko) |
IL (1) | IL145153A (ko) |
MX (1) | MXPA01009619A (ko) |
PL (1) | PL350939A1 (ko) |
SK (1) | SK13472001A3 (ko) |
WO (1) | WO2000057680A1 (ko) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100782402B1 (ko) * | 2006-10-24 | 2007-12-07 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조방법 |
KR100836653B1 (ko) * | 2006-10-25 | 2008-06-10 | 삼성전기주식회사 | 회로기판 및 그 제조방법 |
KR100882263B1 (ko) * | 2007-11-09 | 2009-02-06 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
KR101540151B1 (ko) * | 2013-06-18 | 2015-07-28 | 삼성전기주식회사 | 인쇄회로기판의 제조방법 |
Also Published As
Publication number | Publication date |
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DE60000315T3 (de) | 2006-10-12 |
PL350939A1 (en) | 2003-02-24 |
CZ300550B6 (cs) | 2009-06-10 |
ES2181653T3 (es) | 2003-03-01 |
CA2364918C (en) | 2009-04-14 |
AU4108300A (en) | 2000-10-09 |
JP2002540609A (ja) | 2002-11-26 |
SK13472001A3 (sk) | 2002-04-04 |
ES2181653T5 (es) | 2006-12-01 |
HK1043470A1 (en) | 2002-09-13 |
WO2000057680A1 (en) | 2000-09-28 |
IL145153A (en) | 2005-05-17 |
CN1193652C (zh) | 2005-03-16 |
CZ20013257A3 (cs) | 2002-01-16 |
DE60000315D1 (de) | 2002-09-12 |
US6779262B1 (en) | 2004-08-24 |
EP1172025B2 (en) | 2006-04-26 |
EP1172025A1 (en) | 2002-01-16 |
KR100760432B1 (ko) | 2007-09-20 |
EA003263B1 (ru) | 2003-02-27 |
CA2364918A1 (en) | 2000-09-28 |
EP1172025B1 (en) | 2002-08-07 |
CN1344484A (zh) | 2002-04-10 |
HK1043470B (zh) | 2003-02-14 |
HUP0200426A2 (en) | 2002-07-29 |
MXPA01009619A (es) | 2003-06-24 |
DE60000315T2 (de) | 2003-04-10 |
EA200100928A1 (ru) | 2002-04-25 |
IL145153A0 (en) | 2002-06-30 |
ATE222046T1 (de) | 2002-08-15 |
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