LU90376B1 - Method for manufacturing a multilayer printed circuit board and composite foil for use therein - Google Patents
Method for manufacturing a multilayer printed circuit board and composite foil for use thereinInfo
- Publication number
- LU90376B1 LU90376B1 LU90376A LU90376A LU90376B1 LU 90376 B1 LU90376 B1 LU 90376B1 LU 90376 A LU90376 A LU 90376A LU 90376 A LU90376 A LU 90376A LU 90376 B1 LU90376 B1 LU 90376B1
- Authority
- LU
- Luxembourg
- Prior art keywords
- manufacturing
- circuit board
- printed circuit
- multilayer printed
- composite foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
Priority Applications (20)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU90376A LU90376B1 (en) | 1999-03-23 | 1999-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
HU0200426A HUP0200426A2 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
CNB008051844A CN1193652C (en) | 1999-03-23 | 2000-03-23 | Method for mfg multilayer printed circuit board and composite foil for use therein |
DE60000315T DE60000315T3 (en) | 1999-03-23 | 2000-03-23 | METHOD FOR PRODUCING A MULTILAYER PRINTED PCB AND COMPOSITE FILM FOR USE THEREIN |
IL14515300A IL145153A (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
KR1020017012161A KR100760432B1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
CA002364918A CA2364918C (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
PCT/EP2000/002560 WO2000057680A1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
EP00920545A EP1172025B2 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
MXPA01009619A MXPA01009619A (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein. |
AT00920545T ATE222046T1 (en) | 1999-03-23 | 2000-03-23 | METHOD FOR PRODUCING A MULTI-LAYER PRINTED CIRCUIT BOARD AND COMPOSITE FILM FOR USE THEREIN |
ES00920545T ES2181653T5 (en) | 1999-03-23 | 2000-03-23 | PROCEDURE FOR THE MANUFACTURE OF A MULTI-PAPER PRINTED CIRCUIT CARD AND COMPOSITE SHEET FOR USE THEREOF. |
CZ20013257A CZ300550B6 (en) | 1999-03-23 | 2000-03-23 | Process for producing multilayer printer circuit board and composite film used in this production process |
SK1347-2001A SK13472001A3 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
AU41083/00A AU4108300A (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
PL00350939A PL350939A1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
US09/937,085 US6779262B1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board |
JP2000607449A JP2002540609A (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing multilayer printed circuit board and composite foil used therefor |
EA200100928A EA003263B1 (en) | 1999-03-23 | 2000-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
HK02105066.6A HK1043470B (en) | 1999-03-23 | 2002-07-08 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU90376A LU90376B1 (en) | 1999-03-23 | 1999-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
Publications (1)
Publication Number | Publication Date |
---|---|
LU90376B1 true LU90376B1 (en) | 2000-09-25 |
Family
ID=19731809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
LU90376A LU90376B1 (en) | 1999-03-23 | 1999-03-23 | Method for manufacturing a multilayer printed circuit board and composite foil for use therein |
Country Status (1)
Country | Link |
---|---|
LU (1) | LU90376B1 (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
DE3103986A1 (en) * | 1981-02-05 | 1982-09-09 | Reiner Dipl.-Phys. 8011 Vaterstetten Szepan | Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards |
US4398993A (en) * | 1982-06-28 | 1983-08-16 | International Business Machines Corporation | Neutralizing chloride ions in via holes in multilayer printed circuit boards |
WO1997041713A1 (en) * | 1996-05-01 | 1997-11-06 | Alliedsignal Inc. | New method of forming fine circuit lines |
JPH1075069A (en) * | 1996-06-27 | 1998-03-17 | Samsung Electro Mech Co Ltd | Manufacture of build-up multi-layer printed circuit board using yag laser |
JPH10190236A (en) * | 1996-12-26 | 1998-07-21 | Nippon Carbide Ind Co Inc | Manufacture of multilayer interconnection board |
-
1999
- 1999-03-23 LU LU90376A patent/LU90376B1/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3998601A (en) * | 1973-12-03 | 1976-12-21 | Yates Industries, Inc. | Thin foil |
DE3103986A1 (en) * | 1981-02-05 | 1982-09-09 | Reiner Dipl.-Phys. 8011 Vaterstetten Szepan | Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards |
US4398993A (en) * | 1982-06-28 | 1983-08-16 | International Business Machines Corporation | Neutralizing chloride ions in via holes in multilayer printed circuit boards |
WO1997041713A1 (en) * | 1996-05-01 | 1997-11-06 | Alliedsignal Inc. | New method of forming fine circuit lines |
JPH1075069A (en) * | 1996-06-27 | 1998-03-17 | Samsung Electro Mech Co Ltd | Manufacture of build-up multi-layer printed circuit board using yag laser |
JPH10190236A (en) * | 1996-12-26 | 1998-07-21 | Nippon Carbide Ind Co Inc | Manufacture of multilayer interconnection board |
Non-Patent Citations (4)
Title |
---|
A. KESTENBAUM ET AL.: "Laser drilling of microvias in epoxy-glass printed circuit boards", IEEE TRANSACTIONS ON COMPONENTS,HYBRIDS,AND MANUFACTURING TECHNOLOGY., vol. 13, no. 4, December 1990 (1990-12-01), IEEE INC. NEW YORK., US, pages 1055 - 1062, XP000176849, ISSN: 0148-6411 * |
A. N. PARGELLIS: "Formation of microvias in epoxy-glass composites by laser ablation", OPTICS AND LASER TECHNOLOGY, vol. 22, no. 3, June 1990 (1990-06-01), ELSEVIER SCIENCE PUBLISHERS BV., AMSTERDAM., NL, pages 205 - 207, XP000137239, ISSN: 0030-3992 * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 12 31 October 1998 (1998-10-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 8 30 June 1998 (1998-06-30) * |
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