DE3103986A1 - Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards - Google Patents

Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards

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Publication number
DE3103986A1
DE3103986A1 DE19813103986 DE3103986A DE3103986A1 DE 3103986 A1 DE3103986 A1 DE 3103986A1 DE 19813103986 DE19813103986 DE 19813103986 DE 3103986 A DE3103986 A DE 3103986A DE 3103986 A1 DE3103986 A1 DE 3103986A1
Authority
DE
Germany
Prior art keywords
circuit boards
electronic circuit
drill holes
hole plating
boards according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813103986
Other languages
German (de)
Inventor
Reiner Dipl.-Phys. 8011 Vaterstetten Szepan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19813103986 priority Critical patent/DE3103986A1/en
Publication of DE3103986A1 publication Critical patent/DE3103986A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Published without abstract.

Description

Beschreibungdescription

zur Patentanmeldung, betreffend: Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten Verfahren zur Herstellung von Durchkontaktierungen in elektronischen Leiterplatten sind bekannt und werden unter anderem großtechnisch angewandt. Bei den Leiterplatten handelt es sich um ein elektrisch nicht leitendes Trägermaterial meist auf Kohlenstoffbasis, auf das meist beiderseitig eine Metallfolie aufgebracht ist. Bohrungen in der Leiterplatte übernehmen neben der Aufnahme von Anschlußdrähten von elektronischen Bauelementen die Aufgabe, eine leitfähige Verbindung zwischen den beiderseitigen Leiterbahnen herzustellen. Da das Trägermaterial der Leiterplatte aber elektrisch nicht leitet, ist ein unmittelbarer galvanischer Auftrag von Metall in der Wandung des Bohrlochs unmöglich.for patent application, relating to: Method for producing boreholes for through-hole plating in electronic circuit boards Process for manufacturing of vias in electronic circuit boards are known and will be among other things applied on a large scale. The circuit boards are an electrically non-conductive carrier material, usually based on carbon, on which usually a metal foil is applied on both sides. Holes in the circuit board take over in addition to the inclusion of connecting wires from electronic components the task of a conductive connection between the two-sided conductor tracks to manufacture. However, since the carrier material of the circuit board does not conduct electricity, is a direct galvanic application of metal in the wall of the borehole not possible.

Deshalb wird mit einem aufwendigen, leidlich beherrschten Verfahren leitfähiges Material in die Bohrungswandungen aufgeschlemmt, worauf dann Metall aufgetragen werden kann.Therefore, a complex, reasonably well-mastered procedure is used conductive material is slurried into the walls of the bore, whereupon metal can be applied.

Es ist Aufgabe dieser Erfindung, ein Verfahren zu schaffen, daß unmittelbar bei dem Bohrvorgang elektrisch leitfähige Bohrungswände erzeugt, auf die gegebenenfalls Metall galvanisch aufgetragen werden kann.It is the object of this invention to provide a method that immediately generated electrically conductive bore walls during the drilling process, to which, if necessary Metal can be electroplated.

Diese Aufgabe wird erfindungsgemäß durch ein Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung von elektrischen Leiterplatten nach dem Hauptanspruch gelöst. Weitere vorteilhafte Ausstattungen des erfindungsgemäßen Verfahrens ergeben sich aus den Unteransprüchen und der nachfolgenden Beschreibung.According to the invention, this object is achieved by a process for production of drill holes for through-hole plating of electrical circuit boards according to the main claim solved. Further advantageous features of the method according to the invention result from the subclaims and the following description.

Beim Beschuß der Leiterplatte mit energiereicher gebündelter Strahlung wird die Materie abgetragen bis ein begrenztes Loch entsteht. Dabei erweisen sich die die Kohlenstoffanteile des Trägermaterials der Leiterplatte am widerstandsfähigsten. Sie kleiden deshalb die Wandung des Lochs aus. Wird nun während des Bohrvorgangs der Zutritt von chemischen Oxydatoren verhindert, so verbleibt ein elektrisch leitfähiger und haftender Kohlenstoff-Belag auf der Bohrungswandung. Dieser kann unmittelbar als Durchkontaktierung genützt werden oder als Basismaterial für einen galvanischen Auftrag von Metall dienen.When bombarding the circuit board with high-energy bundled radiation the matter is removed until a limited hole is created. It turn out to be which is the most resistant of the carbon components of the printed circuit board's carrier material. They therefore line the wall of the hole. Will now be used during the drilling process the access of chemical oxidizers is prevented, so an electrically conductive one remains and adhesive carbon coating on the bore wall. This can be immediate can be used as through-hole plating or as a base material for a galvanic Serving order of metal.

Als energiereiche gebündelte Strahlung läßt sich gemäß dieser Erfindung Laserstrahlung einer geeigneten Wellenlänge und ausreichender Energie zur Herstellung von leitfähigen Durchkontaktierungen in elektronischen Leiterplatten anwenden. Dies ist z.B. mit einem geeigneten C02-Laser zu bewerkstelligen. Die Oxydation der frischentstandenen und noch heißen Oberflächenschichten der Bohrungen mit insbesondere dem Sauerstoff der Luft wird durch zumindest teilweise Evakuierung der Luft oder durch ein geeignetes Schutzgas, z.B. Stickstoff, verhindert.As high-energy bundled radiation according to this invention Laser radiation of a suitable wavelength and sufficient energy for production of conductive vias in electronic circuit boards. this can be accomplished e.g. with a suitable CO2 laser. The oxidation of the freshly formed and the still hot surface layers of the bores with, in particular, the oxygen the air is at least partially evacuated or by a suitable Protective gas, e.g. nitrogen, prevented.

Desgleichen können gebündelte Elektronenstrahlen mit ausreichender Energie und ausreichender Stromdichte erfindungsgemäß zur Herstellung leitfähiger Durchkontaktierungen in elektronischen Leiterplatten benutzt werden. Die Kühlenstoffoxydation durch den Luftsauerstoff wird durch eine zumindest teilweise Evakuierung erreicht.Likewise, bundled electron beams with sufficient Energy and sufficient current density according to the invention to produce more conductive Vias are used in electronic circuit boards. The refrigerant oxidation through the atmospheric oxygen is achieved through an at least partial evacuation.

Die in der Regel reine Metalloberfläche absorbiert insbesondere bei Laserbestrahlung nur einen Bruchteil der eingestrahlten Energie. Dieser Anteil kann so gering sein, daß nicht spontan das Bohrloch entsteht, sondern daß die Metallschicht sich aufgrund ihrer Wärmeleiteigenschaften flächig erwärmt, was zu einer lokalen Ablösung der Metallfolie von dem Trägermaterial führt. Dieses Problem wird erfindungsgemäß dadurch gelöst, daß die Metalloberfläche der Einstrahlungsseite mit einem strahlungsspezifischen Akzeptor versehen ist. Ist Metallfolie der Einstrahlungsseite aus Kupfer, so kann der Strahlungsakzeptor z.B. aus Kupter-l i-oxyd bestehen.The usually pure metal surface absorbs in particular Laser irradiation only takes a fraction of the radiated energy. This proportion can be so small that the borehole does not arise spontaneously, but that the metal layer heats up over a large area due to its thermal conductivity, resulting in a local Detachment of the metal foil from the carrier material leads. This problem becomes present in accordance with the invention solved in that the metal surface of the radiation side with a radiation-specific Acceptor is provided. If the metal foil on the irradiation side is made of copper, then the radiation acceptor e.g. consist of copper oxide.

Eine Beschichtung der metallischen Außenseiten der Leiterplatte mit einem geeigneten elektrischen Isolator, gegebenenfalls mit dem strahlungsspezifischen Akzeptor, wird durch die Strahlung nur am Bohrloch penetriert. Solchermaßen bleibt der galvanische Auftrag von Metall auf die erzeugten Kohlenstofflächen in den Bohrlöchern beschränkt.A coating of the metallic outside of the circuit board with a suitable electrical insulator, if necessary with the radiation-specific one Acceptor, the radiation only penetrates it at the borehole. So remains the galvanic application of metal to the carbon surfaces produced in the drill holes limited.

Besonders vorteilhaft und ver#l#renstechnisch zuverlässig läßt sich das Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung von elektronischen Leiterplatten mit mehrschichtigen Leitungsführungen, sogenannte Multi- Layer-Verfahren anwenden.It can be particularly advantageous and technically reliable the method of producing drill holes for through-hole plating of electronic Printed circuit boards with multi-layer cable routing, so-called multi-layer processes use.

PatentansprücheClaims

Claims (6)

Patentansprüche ;)Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten, bestehend aus Trägermaterialien auf Kohlenstoffbasis g e k e n n z e i c h n e t d u r c h die Anwendung von gebündelter energiereicher Strahlung unter Abschuß von chemischen Oxydatoren zur Ausbildung von einer hülsenförmigen, elektrisch leitfähigen Kohlenstoffschicht in der Bohrungswand. Claims;) Method for producing drill holes for through-hole plating in electronic circuit boards, consisting of carbon-based carrier materials G e k e n n e n n i c h n e t d u r c h the use of bundled energy-rich Radiation with the launch of chemical oxidizers to form a sleeve-shaped, electrically conductive carbon layer in the bore wall. 2. Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten nach Anspruch 1, dadurch gekennzeichnet, daß die Strahlungsenergie von einem geeigneten Laser erzeugt wird. 2. Process for producing drill holes for through-hole plating in electronic circuit boards according to claim 1, characterized in that the Radiant energy is generated by a suitable laser. 3. Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten nach den Ansprüchen 1,2, dadurch gekennzeichnet, daß die Strahlungsenergie von einem C02-Laser erzeugt wird. 3. Method of producing drill holes for through-hole plating in electronic circuit boards according to claims 1, 2, characterized in that that the radiant energy is generated by a CO2 laser. 4. Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten nach dem Anspruch 1, dadurch gekennzeichnet, daß Elektronenstrahlen angewandt werden. 4. Method of making drill holes for through-hole plating in electronic circuit boards according to claim 1, characterized in that Electron beams are applied. 5. Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten nach den Ansprüchen 1, 2, 3, 4, d a d u r c h g e k e n n z e i c h n e t, daß gegebenenfalls die metallische Oberfläche der Leiterplatte mit einer geeignet aufzubringenden Schicht versehen ist, so daß eine unmittelbare Akzeptanz der energiereichen Strahlung zum Schutz der Bohrlochumgebung besteht. 5. Method of making drill holes for through-hole plating in electronic circuit boards according to claims 1, 2, 3, 4, d a d u r c h g e k e n n n e i n e t that, if applicable, the metallic surface of the circuit board is provided with a suitable layer to be applied, so that an immediate There is acceptance of high-energy radiation to protect the borehole environment. .6. Verfahren zur Herstellung von Bohrlöchern zur Durchkontaktierung in elektronischen Leiterplatten nach den Ansprüchen 1 2, 3, 4, 5 d a d u r c h g e k e n n z e i c h n e t, daß die metallische Oberfläche der Leiterplatte mit einer geeignet aufzubringenden Schicht versehen ist, die einen galvanischen Auftrag von Metall auf die erzeugten Kohlenstoff-Flächen beschränkt..6. Method for producing drill holes for through-hole plating in electronic circuit boards according to claims 1 2, 3, 4, 5 d a d u r c h g e k e n n n e i n e t that the metallic surface of the circuit board with a suitable to be applied layer is provided, which is a galvanic application of Metal limited to the carbon surfaces produced.
DE19813103986 1981-02-05 1981-02-05 Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards Withdrawn DE3103986A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813103986 DE3103986A1 (en) 1981-02-05 1981-02-05 Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813103986 DE3103986A1 (en) 1981-02-05 1981-02-05 Method for producing drilled holes for through-plated contact making in electronic printed-circuit boards

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DE3103986A1 true DE3103986A1 (en) 1982-09-09

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989002697A1 (en) * 1987-09-14 1989-03-23 Hughes Aircraft Company Induced metallization process by way of dissociating aluminum nitride ceramic
EP0431334A2 (en) * 1989-12-04 1991-06-12 Xerox Corporation Electrical component with conductive path
EP0964610A2 (en) * 1998-06-02 1999-12-15 Mitsubishi Gas Chemical Company, Inc. Printed wiring board and process for forming it
LU90376B1 (en) * 1999-03-23 2000-09-25 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board and composite foil for use therein
WO2000057680A1 (en) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
EP1061785A3 (en) * 1999-06-17 2001-12-05 Mitsubishi Gas Chemical Company, Inc. High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board
EP1289354A1 (en) * 2001-09-01 2003-03-05 TRUMPF LASERTECHNIK GmbH Multilayer printed circuit board and process for manufacturing holes therein

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989002697A1 (en) * 1987-09-14 1989-03-23 Hughes Aircraft Company Induced metallization process by way of dissociating aluminum nitride ceramic
EP0431334A2 (en) * 1989-12-04 1991-06-12 Xerox Corporation Electrical component with conductive path
EP0431334A3 (en) * 1989-12-04 1992-01-15 Xerox Corporation Electrical component with conductive path
EP0964610A3 (en) * 1998-06-02 2001-03-21 Mitsubishi Gas Chemical Company, Inc. Printed wiring board and process for forming it
EP0964610A2 (en) * 1998-06-02 1999-12-15 Mitsubishi Gas Chemical Company, Inc. Printed wiring board and process for forming it
US6280641B1 (en) 1998-06-02 2001-08-28 Mitsubishi Gas Chemical Company, Inc. Printed wiring board having highly reliably via hole and process for forming via hole
LU90376B1 (en) * 1999-03-23 2000-09-25 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board and composite foil for use therein
WO2000057680A1 (en) * 1999-03-23 2000-09-28 Circuit Foil Luxembourg Trading S.À R.L. Method for manufacturing a multilayer printed circuit board and composite foil for use therein
US6779262B1 (en) 1999-03-23 2004-08-24 Circuit Foil Luxembourg Trading Sarl Method for manufacturing a multilayer printed circuit board
CZ300550B6 (en) * 1999-03-23 2009-06-10 Circuit Foil Luxembourg Trading S.A R.L. Process for producing multilayer printer circuit board and composite film used in this production process
EP1061785A3 (en) * 1999-06-17 2001-12-05 Mitsubishi Gas Chemical Company, Inc. High-density multi-layered printed wiring board having highly reliably through hole and method of producing said printed wiring board
US6708404B1 (en) 1999-06-17 2004-03-23 Mitsubishi Gas Chemical Company, Inc. Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole
EP1289354A1 (en) * 2001-09-01 2003-03-05 TRUMPF LASERTECHNIK GmbH Multilayer printed circuit board and process for manufacturing holes therein

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