AU2002214241A1 - Multi-layer printed circuit board fabrication system and method - Google Patents

Multi-layer printed circuit board fabrication system and method

Info

Publication number
AU2002214241A1
AU2002214241A1 AU2002214241A AU1424102A AU2002214241A1 AU 2002214241 A1 AU2002214241 A1 AU 2002214241A1 AU 2002214241 A AU2002214241 A AU 2002214241A AU 1424102 A AU1424102 A AU 1424102A AU 2002214241 A1 AU2002214241 A1 AU 2002214241A1
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
layer printed
fabrication system
board fabrication
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002214241A
Inventor
Barry Ben-Ezra
Amnon Ganot
Hanan Gino
Golan Hanina
Zeev Kantor
Boris Kling
Shabtay Spinzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Orbotech Ltd
Original Assignee
Orbotech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/708,160 external-priority patent/US6819789B1/en
Priority claimed from US09/792,498 external-priority patent/US6701197B2/en
Application filed by Orbotech Ltd filed Critical Orbotech Ltd
Publication of AU2002214241A1 publication Critical patent/AU2002214241A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4679—Aligning added circuit layers or via connections relative to previous circuit layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Image Processing (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Image Input (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2002214241A 2000-11-08 2001-11-06 Multi-layer printed circuit board fabrication system and method Abandoned AU2002214241A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US09/708,160 2000-11-08
US09/708,160 US6819789B1 (en) 2000-11-08 2000-11-08 Scaling and registration calibration especially in printed circuit board fabrication
US09/792,498 US6701197B2 (en) 2000-11-08 2001-02-23 System and method for side to side registration in a printed circuit imager
US09/792,498 2001-02-23
IL142354 2001-04-01
IL142354A IL142354A (en) 2000-11-08 2001-04-01 Multi-layer printed circuit board fabrication system and method
PCT/IL2001/001027 WO2002039793A2 (en) 2000-11-08 2001-11-06 Multi-layer printed circuit board fabrication system and method

Publications (1)

Publication Number Publication Date
AU2002214241A1 true AU2002214241A1 (en) 2002-05-21

Family

ID=27271948

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002214241A Abandoned AU2002214241A1 (en) 2000-11-08 2001-11-06 Multi-layer printed circuit board fabrication system and method

Country Status (5)

Country Link
US (1) US7283660B2 (en)
JP (1) JP2004523101A (en)
AU (1) AU2002214241A1 (en)
TW (1) TWI246382B (en)
WO (1) WO2002039793A2 (en)

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JP2006259715A (en) * 2005-02-21 2006-09-28 Fuji Photo Film Co Ltd Image-drawing method, image-drawing apparatus, image-drawing system, and correction method
TW200704146A (en) * 2005-02-21 2007-01-16 Fuji Photo Film Co Ltd Plotting method, plotting device, plotting system and correction method
US7668364B2 (en) * 2005-04-26 2010-02-23 Hitachi Via Mechanics, Ltd. Inspection method and apparatus for partially drilled microvias
GB0517929D0 (en) * 2005-09-02 2005-10-12 Xaar Technology Ltd Method of printing
ES2706729T3 (en) * 2005-12-02 2019-04-01 Irobot Corp Robot system
KR20090104877A (en) 2007-01-23 2009-10-06 후지필름 가부시키가이샤 Oxime compound, photosensitive composition, color filter, method for production of the color filter, and liquid crystal display element
US8482732B2 (en) * 2007-10-01 2013-07-09 Maskless Lithography, Inc. Alignment system for various materials and material flows
US7847938B2 (en) * 2007-10-01 2010-12-07 Maskless Lithography, Inc. Alignment system for optical lithography
JP2009109550A (en) * 2007-10-26 2009-05-21 Adtec Engineeng Co Ltd Direct writing exposure apparatus
IL194967A0 (en) * 2008-10-28 2009-08-03 Orbotech Ltd Producing electrical circuit patterns using multi-population transformation
EP2315507A1 (en) * 2009-10-22 2011-04-27 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Apparatus and method for manufacturing devices on a flexible substrate
TWI417984B (en) * 2009-12-10 2013-12-01 Orbotech Lt Solar Llc Auto-sequencing multi-directional inline processing apparatus
US9035673B2 (en) 2010-01-25 2015-05-19 Palo Alto Research Center Incorporated Method of in-process intralayer yield detection, interlayer shunt detection and correction
JP5481736B2 (en) * 2010-09-06 2014-04-23 株式会社ブイ・テクノロジー Film exposure equipment
AT12737U1 (en) * 2010-09-17 2012-10-15 Austria Tech & System Tech METHOD FOR PRODUCING A CONDUCTOR PLATE COMPOSED OF MULTIPLE PCB SURFACES AND PCB
JP5424271B2 (en) 2010-11-08 2014-02-26 株式会社ブイ・テクノロジー Exposure equipment
JP5685756B2 (en) 2010-11-10 2015-03-18 株式会社ブイ・テクノロジー Film exposure method
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
KR101206301B1 (en) * 2011-06-02 2012-11-29 아페리오(주) Method of fabricating a hole for chip-embedded printed circuit board
KR101206289B1 (en) 2011-06-08 2012-11-29 아페리오(주) Method of processing holes for printed circuit board embedded with components
JP5813555B2 (en) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング Exposure drawing apparatus and exposure drawing method
JP5813556B2 (en) * 2012-03-30 2015-11-17 株式会社アドテックエンジニアリング Exposure drawing apparatus, program, and exposure drawing method
US9282686B2 (en) * 2012-07-10 2016-03-08 Flextronics International Usa, Inc. System and method for high resolution, high throughput processing of conductive patterns of flexible substrates
TWI485054B (en) * 2012-09-07 2015-05-21 Da Yeh Paper Co Ltd Double - sided cutting positioning system and its method
WO2015147820A1 (en) 2014-03-27 2015-10-01 Hewlett-Packard Development Company, L.P. Locating a target through media
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DE102020113134A1 (en) * 2020-05-14 2021-11-18 Skybrain Vermögensverwaltungs Gmbh Processing station and method for processing workpieces

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Also Published As

Publication number Publication date
WO2002039793A3 (en) 2002-10-24
JP2004523101A (en) 2004-07-29
US7283660B2 (en) 2007-10-16
US20030190071A1 (en) 2003-10-09
TWI246382B (en) 2005-12-21
WO2002039793A2 (en) 2002-05-16

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