SG83679A1 - Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus - Google Patents

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Info

Publication number
SG83679A1
SG83679A1 SG9801001A SG1998001001A SG83679A1 SG 83679 A1 SG83679 A1 SG 83679A1 SG 9801001 A SG9801001 A SG 9801001A SG 1998001001 A SG1998001001 A SG 1998001001A SG 83679 A1 SG83679 A1 SG 83679A1
Authority
SG
Singapore
Prior art keywords
chemical mechanical
grooved pattern
polishing pad
mechanical polishing
polishing apparatus
Prior art date
Application number
SG9801001A
Other languages
English (en)
Inventor
Osterheld Tom
Ko Sen-Hou
Edward Bennet Doyle
C Redeker Fred
Addiego Ginetto
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25324831&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG83679(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG83679A1 publication Critical patent/SG83679A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG9801001A 1997-05-15 1998-05-04 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus SG83679A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/856,948 US5921855A (en) 1997-05-15 1997-05-15 Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US09/003,315 US5984769A (en) 1997-05-15 1998-01-06 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Publications (1)

Publication Number Publication Date
SG83679A1 true SG83679A1 (en) 2001-10-16

Family

ID=25324831

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9801001A SG83679A1 (en) 1997-05-15 1998-05-04 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Country Status (7)

Country Link
US (6) US5921855A (fr)
EP (1) EP0878270B2 (fr)
JP (2) JPH1170463A (fr)
KR (2) KR100764988B1 (fr)
DE (1) DE69830944T3 (fr)
SG (1) SG83679A1 (fr)
TW (1) TW430893B (fr)

Families Citing this family (231)

* Cited by examiner, † Cited by third party
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US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
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US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
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US20030092371A1 (en) 2003-05-15
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US6645061B1 (en) 2003-11-11
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US6699115B2 (en) 2004-03-02
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EP0878270B1 (fr) 2005-07-27
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US5984769A (en) 1999-11-16
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US20040072516A1 (en) 2004-04-15
EP0878270A2 (fr) 1998-11-18

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