KR100801371B1 - 화학 기계적 연마 장치에 사용하기 위한 홈 패턴을 가지는연마 패드 - Google Patents
화학 기계적 연마 장치에 사용하기 위한 홈 패턴을 가지는연마 패드 Download PDFInfo
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- KR100801371B1 KR100801371B1 KR1020060114367A KR20060114367A KR100801371B1 KR 100801371 B1 KR100801371 B1 KR 100801371B1 KR 1020060114367 A KR1020060114367 A KR 1020060114367A KR 20060114367 A KR20060114367 A KR 20060114367A KR 100801371 B1 KR100801371 B1 KR 100801371B1
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- polishing
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- polishing pad
- groove
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (12)
- 화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드로서,연마 표면의 중심 주위에 중심이 맞춰진 원형인 복수의 동심 홈들을 갖는 연마 표면을 포함하며, 상기 홈들은 0.02 내지 0.05 인치 범위의 깊이와, 0.015 내지 0.04 인치 범위의 폭과, 0.09 내지 0.24 인치 범위의 피치를 가지며, 수직한 측벽을 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 0.03 인치의 깊이를 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 0.02 인치의 폭을 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 0.12 인치의 피치를 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 0.03 인치의 깊이와, 0.02 인치의 폭과, 0.12 인치의 피치를 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 격벽에 의해 분리되며, 상기 홈 대 격벽의 비율은 0.10 내지 0.25 범위인,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 연마 표면은 0.06 내지 0.12 인치 범위의 두께를 갖는 층의 표면인,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 7 항에 있어서,상기 홈들의 바닥과 상기 하부 층의 바닥 사이의 거리는 0.035 내지 0.085 인치 범위인,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 8 항에 있어서,상기 홈들의 바닥과 상기 하부 층의 바닥 사이의 거리는 0.04 인치인,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 연마 표면은 원형인,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 둥근 바닥 표면을 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
- 제 1 항에 있어서,상기 홈들은 평탄한 바닥 표면을 가지는,화학 기계적 연마 시스템으로 기판을 연마하는 연마 패드.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/856,948 US5921855A (en) | 1997-05-15 | 1997-05-15 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing system |
US08/856,948 | 1997-05-15 | ||
US09/003,315 | 1998-01-06 | ||
US09/003,315 US5984769A (en) | 1997-05-15 | 1998-01-06 | Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus |
KR1019980017456A KR100764988B1 (ko) | 1997-05-15 | 1998-05-15 | 화학기계적연마장치에사용하기위한홈패턴을가지는연마패드 및 연마방법 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980017456A Division KR100764988B1 (ko) | 1997-05-15 | 1998-05-15 | 화학기계적연마장치에사용하기위한홈패턴을가지는연마패드 및 연마방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060129140A KR20060129140A (ko) | 2006-12-15 |
KR100801371B1 true KR100801371B1 (ko) | 2008-02-05 |
Family
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Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980017456A KR100764988B1 (ko) | 1997-05-15 | 1998-05-15 | 화학기계적연마장치에사용하기위한홈패턴을가지는연마패드 및 연마방법 |
KR1020060114367A KR100801371B1 (ko) | 1997-05-15 | 2006-11-20 | 화학 기계적 연마 장치에 사용하기 위한 홈 패턴을 가지는연마 패드 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980017456A KR100764988B1 (ko) | 1997-05-15 | 1998-05-15 | 화학기계적연마장치에사용하기위한홈패턴을가지는연마패드 및 연마방법 |
Country Status (7)
Country | Link |
---|---|
US (6) | US5921855A (ko) |
EP (1) | EP0878270B2 (ko) |
JP (2) | JPH1170463A (ko) |
KR (2) | KR100764988B1 (ko) |
DE (1) | DE69830944T3 (ko) |
SG (1) | SG83679A1 (ko) |
TW (1) | TW430893B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101165440B1 (ko) | 2009-07-23 | 2012-07-12 | 에스케이씨 주식회사 | 무방향성이고, 불균일한 표면 거칠기를 갖는 연마패드, 그 연마패드 제조방법 및 제조장치 |
WO2022139185A1 (ko) * | 2020-12-24 | 2022-06-30 | 주식회사 에스엠티 | 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치 |
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Cited By (2)
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KR101165440B1 (ko) | 2009-07-23 | 2012-07-12 | 에스케이씨 주식회사 | 무방향성이고, 불균일한 표면 거칠기를 갖는 연마패드, 그 연마패드 제조방법 및 제조장치 |
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Also Published As
Publication number | Publication date |
---|---|
US6645061B1 (en) | 2003-11-11 |
EP0878270A2 (en) | 1998-11-18 |
JP2008188768A (ja) | 2008-08-21 |
US5984769A (en) | 1999-11-16 |
KR19980087060A (ko) | 1998-12-05 |
KR100764988B1 (ko) | 2007-12-14 |
US5921855A (en) | 1999-07-13 |
SG83679A1 (en) | 2001-10-16 |
US6699115B2 (en) | 2004-03-02 |
JP4937184B2 (ja) | 2012-05-23 |
DE69830944D1 (de) | 2005-09-01 |
US20030092371A1 (en) | 2003-05-15 |
DE69830944T3 (de) | 2014-06-26 |
US20040072516A1 (en) | 2004-04-15 |
EP0878270B2 (en) | 2014-03-19 |
US20020137450A1 (en) | 2002-09-26 |
EP0878270A3 (en) | 2000-08-23 |
US6520847B2 (en) | 2003-02-18 |
US6824455B2 (en) | 2004-11-30 |
JPH1170463A (ja) | 1999-03-16 |
DE69830944T2 (de) | 2006-04-13 |
EP0878270B1 (en) | 2005-07-27 |
TW430893B (en) | 2001-04-21 |
KR20060129140A (ko) | 2006-12-15 |
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