TW430893B - Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus - Google Patents

Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Info

Publication number
TW430893B
TW430893B TW087106469A TW87106469A TW430893B TW 430893 B TW430893 B TW 430893B TW 087106469 A TW087106469 A TW 087106469A TW 87106469 A TW87106469 A TW 87106469A TW 430893 B TW430893 B TW 430893B
Authority
TW
Taiwan
Prior art keywords
polishing pad
chemical mechanical
grooved pattern
mechanical polishing
polishing apparatus
Prior art date
Application number
TW087106469A
Other languages
English (en)
Inventor
Tom Osterheld
Sen-Hou Ko
Doyle Edward Bennett
Fred C Redeker
Ginetto Addiego
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25324831&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW430893(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW430893B publication Critical patent/TW430893B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW087106469A 1997-05-15 1998-04-27 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus TW430893B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/856,948 US5921855A (en) 1997-05-15 1997-05-15 Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US09/003,315 US5984769A (en) 1997-05-15 1998-01-06 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Publications (1)

Publication Number Publication Date
TW430893B true TW430893B (en) 2001-04-21

Family

ID=25324831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087106469A TW430893B (en) 1997-05-15 1998-04-27 Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus

Country Status (7)

Country Link
US (6) US5921855A (zh)
EP (1) EP0878270B2 (zh)
JP (2) JPH1170463A (zh)
KR (2) KR100764988B1 (zh)
DE (1) DE69830944T3 (zh)
SG (1) SG83679A1 (zh)
TW (1) TW430893B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329170B2 (en) 2000-12-01 2008-02-12 Toyo Tire & Rubber Co., Ltd. Method of producing polishing pad

Families Citing this family (230)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6254456B1 (en) * 1997-09-26 2001-07-03 Lsi Logic Corporation Modifying contact areas of a polishing pad to promote uniform removal rates
JP3076291B2 (ja) * 1997-12-02 2000-08-14 日本電気株式会社 研磨装置
DE19756537A1 (de) * 1997-12-18 1999-07-01 Wacker Siltronic Halbleitermat Verfahren zum Erzielen eines möglichst linearen Verschleißverhaltens und Werkzeug mit möglichst linearem Verschleißverhalten
US6093651A (en) * 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US5990012A (en) 1998-01-27 1999-11-23 Micron Technology, Inc. Chemical-mechanical polishing of hydrophobic materials by use of incorporated-particle polishing pads
JPH11216663A (ja) * 1998-02-03 1999-08-10 Sony Corp 研磨パッド、研磨装置および研磨方法
CA2261491C (en) 1998-03-06 2005-05-24 Smith International, Inc. Cutting element with improved polycrystalline material toughness and method for making same
KR20000003322A (ko) * 1998-06-27 2000-01-15 김영환 다중 연마판을 갖는 화학기계적 연마장치
US6080671A (en) * 1998-08-18 2000-06-27 Lucent Technologies Inc. Process of chemical-mechanical polishing and manufacturing an integrated circuit
US6331137B1 (en) * 1998-08-28 2001-12-18 Advanced Micro Devices, Inc Polishing pad having open area which varies with distance from initial pad surface
US6203407B1 (en) * 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
KR20000025003A (ko) * 1998-10-07 2000-05-06 윤종용 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드
GB2345255B (en) * 1998-12-29 2000-12-27 United Microelectronics Corp Chemical-Mechanical Polishing Pad
CN1345264A (zh) * 1999-03-30 2002-04-17 株式会社尼康 抛光盘、抛光机、抛光方法及制造半导体器件的方法
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
US6261168B1 (en) * 1999-05-21 2001-07-17 Lam Research Corporation Chemical mechanical planarization or polishing pad with sections having varied groove patterns
KR20010002467A (ko) * 1999-06-15 2001-01-15 고석태 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴
KR20010002470A (ko) * 1999-06-15 2001-01-15 고석태 화학적 기계적 폴리싱 장치용 폴리싱 패드의 그루브 패턴
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US6699104B1 (en) * 1999-09-15 2004-03-02 Rodel Holdings, Inc. Elimination of trapped air under polishing pads
US6443809B1 (en) * 1999-11-16 2002-09-03 Chartered Semiconductor Manufacturing, Ltd. Polishing apparatus and method for forming an integrated circuit
US6712678B1 (en) * 1999-12-07 2004-03-30 Ebara Corporation Polishing-product discharging device and polishing device
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
KR100553834B1 (ko) * 1999-12-27 2006-02-24 삼성전자주식회사 연마잔류물의 용이한 배출을 위한 구조를 갖는 화학기계적연마 패드
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
DE10009656B4 (de) * 2000-02-24 2005-12-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6860802B1 (en) 2000-05-27 2005-03-01 Rohm And Haas Electric Materials Cmp Holdings, Inc. Polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
KR100770852B1 (ko) * 2000-05-27 2007-10-26 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 화학 기계적 평탄화용 그루브형 연마 패드
US6500054B1 (en) * 2000-06-08 2002-12-31 International Business Machines Corporation Chemical-mechanical polishing pad conditioner
US7004823B2 (en) 2000-06-19 2006-02-28 Struers A/S Multi-zone grinding and/or polishing sheet
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6383066B1 (en) 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
JP2002036129A (ja) * 2000-07-25 2002-02-05 Roki Techno Co Ltd 研磨パッド及びその製造方法
KR100652360B1 (ko) * 2000-08-25 2006-11-30 삼성전자주식회사 패드를 구비하는 화학 기계적 연마 장치
JP4855571B2 (ja) * 2000-08-31 2012-01-18 ニッタ・ハース株式会社 研磨パッド及びその研磨パッドを用いた被加工物の研磨方法
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP2002200555A (ja) * 2000-12-28 2002-07-16 Ebara Corp 研磨工具および該研磨工具を具備したポリッシング装置
US6620031B2 (en) 2001-04-04 2003-09-16 Lam Research Corporation Method for optimizing the planarizing length of a polishing pad
US6837779B2 (en) * 2001-05-07 2005-01-04 Applied Materials, Inc. Chemical mechanical polisher with grooved belt
KR100646702B1 (ko) * 2001-08-16 2006-11-17 에스케이씨 주식회사 홀 및/또는 그루브로 형성된 화학적 기계적 연마패드
KR20030015567A (ko) * 2001-08-16 2003-02-25 에스케이에버텍 주식회사 웨이브 형태의 그루브가 형성된 화학적 기계적 연마패드
US6648743B1 (en) * 2001-09-05 2003-11-18 Lsi Logic Corporation Chemical mechanical polishing pad
US7070480B2 (en) 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US7314402B2 (en) * 2001-11-15 2008-01-01 Speedfam-Ipec Corporation Method and apparatus for controlling slurry distribution
JP3843933B2 (ja) * 2002-02-07 2006-11-08 ソニー株式会社 研磨パッド、研磨装置および研磨方法
US7121938B2 (en) * 2002-04-03 2006-10-17 Toho Engineering Kabushiki Kaisha Polishing pad and method of fabricating semiconductor substrate using the pad
TWI250572B (en) * 2002-06-03 2006-03-01 Jsr Corp Polishing pad and multi-layer polishing pad
JP2004023009A (ja) * 2002-06-20 2004-01-22 Nikon Corp 研磨体、研磨装置、半導体デバイス及び半導体デバイス製造方法
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
JP4620331B2 (ja) * 2003-01-31 2011-01-26 ニッタ・ハース株式会社 研磨パッド及び研磨パッドの製造方法
US20040152402A1 (en) * 2003-02-05 2004-08-05 Markus Naujok Wafer polishing with counteraction of centrifugal forces on polishing slurry
US7377840B2 (en) 2004-07-21 2008-05-27 Neopad Technologies Corporation Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
AU2004225931A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (CMP)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20060105182A1 (en) * 2004-11-16 2006-05-18 Applied Materials, Inc. Erosion resistant textured chamber surface
US7221553B2 (en) * 2003-04-22 2007-05-22 Applied Materials, Inc. Substrate support having heat transfer system
US6783436B1 (en) 2003-04-29 2004-08-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with optimized grooves and method of forming same
JP4292025B2 (ja) 2003-05-23 2009-07-08 Ｊｓｒ株式会社 研磨パッド
DE10324217A1 (de) * 2003-05-28 2004-12-16 Robert Bosch Gmbh Vorrichtung zur Klassifizierung von wenigstens einem Objekt mit einer Umfeldsensorik
JP4009237B2 (ja) * 2003-09-08 2007-11-14 東邦エンジニアリング株式会社 半導体ｃｍｐ加工用パッドの細溝加工機械
US6918824B2 (en) * 2003-09-25 2005-07-19 Novellus Systems, Inc. Uniform fluid distribution and exhaust system for a chemical-mechanical planarization device
TWI238100B (en) * 2003-09-29 2005-08-21 Iv Technologies Co Ltd Polishing pad and fabricating method thereof
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US7186651B2 (en) * 2003-10-30 2007-03-06 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US7442116B2 (en) 2003-11-04 2008-10-28 Jsr Corporation Chemical mechanical polishing pad
US7018274B2 (en) * 2003-11-13 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc Polishing pad having slurry utilization enhancing grooves
US6843709B1 (en) 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for reducing slurry reflux
US6843711B1 (en) 2003-12-11 2005-01-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Chemical mechanical polishing pad having a process-dependent groove configuration
JP2005177897A (ja) * 2003-12-17 2005-07-07 Nec Electronics Corp 研磨方法および研磨装置と半導体装置製造方法
US6955587B2 (en) * 2004-01-30 2005-10-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc Grooved polishing pad and method
US6951510B1 (en) * 2004-03-12 2005-10-04 Agere Systems, Inc. Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size
KR100640141B1 (ko) 2004-04-21 2006-10-31 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법
JP2007081322A (ja) * 2005-09-16 2007-03-29 Jsr Corp 化学機械研磨パッドの製造方法
US7329174B2 (en) 2004-05-20 2008-02-12 Jsr Corporation Method of manufacturing chemical mechanical polishing pad
KR20060046093A (ko) * 2004-05-20 2006-05-17 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US7270595B2 (en) * 2004-05-27 2007-09-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with oscillating path groove network
CN100436060C (zh) * 2004-06-04 2008-11-26 智胜科技股份有限公司 研磨垫及其制造方法
US6974372B1 (en) * 2004-06-16 2005-12-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having grooves configured to promote mixing wakes during polishing
US6958002B1 (en) 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
JP2006026844A (ja) * 2004-07-20 2006-02-02 Fujitsu Ltd ポリッシングパッド、それを備えた研磨装置及び貼り付け装置
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7658666B2 (en) * 2004-08-24 2010-02-09 Chien-Min Sung Superhard cutters and associated methods
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods
US7762872B2 (en) * 2004-08-24 2010-07-27 Chien-Min Sung Superhard cutters and associated methods
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
DE602005007125D1 (de) 2004-09-17 2008-07-10 Jsr Corp Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
JP4781654B2 (ja) * 2004-10-25 2011-09-28 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨クロス及びウェーハ研磨装置
JP3769581B1 (ja) 2005-05-18 2006-04-26 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US7131895B2 (en) 2005-01-13 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having a radially alternating groove segment configuration
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8678878B2 (en) 2009-09-29 2014-03-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
KR100721196B1 (ko) * 2005-05-24 2007-05-23 주식회사 하이닉스반도체 연마패드 및 이를 이용한 화학적기계적연마장치
US20070111644A1 (en) * 2005-09-27 2007-05-17 Spencer Preston Thick perforated polishing pad and method for making same
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
US7226345B1 (en) 2005-12-09 2007-06-05 The Regents Of The University Of California CMP pad with designed surface features
US7357703B2 (en) * 2005-12-28 2008-04-15 Jsr Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
KR20080087012A (ko) 2006-01-25 2008-09-29 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그의 제조 방법
US8053521B2 (en) 2006-02-03 2011-11-08 Jsr Corporation Chemical mechanical polishing pad
JP5339680B2 (ja) * 2006-02-15 2013-11-13 アプライド マテリアルズ インコーポレイテッド 表面の研磨
US7503833B2 (en) * 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
JP2007268658A (ja) * 2006-03-31 2007-10-18 Tmp Co Ltd 研磨シート及び研磨方法
US7267610B1 (en) 2006-08-30 2007-09-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP pad having unevenly spaced grooves
DE112007002066B4 (de) * 2006-09-06 2019-10-17 Nitta Haas Inc. Polierkissen
JP2008062367A (ja) * 2006-09-11 2008-03-21 Nec Electronics Corp 研磨装置、研磨パッド、研磨方法
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
US8047899B2 (en) * 2007-07-26 2011-11-01 Macronix International Co., Ltd. Pad and method for chemical mechanical polishing
JP5284610B2 (ja) * 2007-08-20 2013-09-11 八千代マイクロサイエンス株式会社 両面ラップ盤用回転定盤
US7544115B2 (en) * 2007-09-20 2009-06-09 Novellus Systems, Inc. Chemical mechanical polishing assembly with altered polishing pad topographical components
JP2009117815A (ja) 2007-10-18 2009-05-28 Jsr Corp 化学機械研磨パッドの製造方法
TWI455795B (zh) * 2007-10-18 2014-10-11 Iv Technologies Co Ltd 研磨墊及研磨方法
CN101422882B (zh) * 2007-10-31 2015-05-20 智胜科技股份有限公司 研磨垫及研磨方法
CN101903131B (zh) 2007-11-13 2013-01-02 宋健民 Cmp垫修整器
WO2009070352A1 (en) * 2007-11-30 2009-06-04 Innopad, Inc. Chemical-mechanical planarization pad having end point detection window
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
TWI473685B (zh) * 2008-01-15 2015-02-21 Iv Technologies Co Ltd 研磨墊及其製造方法
TWI409868B (zh) * 2008-01-30 2013-09-21 Iv Technologies Co Ltd 研磨方法、研磨墊及研磨系統
JP2009220265A (ja) * 2008-02-18 2009-10-01 Jsr Corp 化学機械研磨パッド
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
US20110143539A1 (en) * 2008-05-15 2011-06-16 Rajeev Bajaj Polishing pad with endpoint window and systems and methods using the same
US20110045753A1 (en) * 2008-05-16 2011-02-24 Toray Industries, Inc. Polishing pad
WO2009158665A1 (en) * 2008-06-26 2009-12-30 3M Innovative Properties Company Polishing pad with porous elements and method of making and using the same
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
CN102159361B (zh) * 2008-07-18 2014-11-05 3M创新有限公司 具有浮动单元的抛光垫以及制造和使用该抛光垫的方法
CN101637888B (zh) * 2008-08-01 2013-09-18 智胜科技股份有限公司 研磨垫及其制造方法
US8439723B2 (en) * 2008-08-11 2013-05-14 Applied Materials, Inc. Chemical mechanical polisher with heater and method
US20100041316A1 (en) * 2008-08-14 2010-02-18 Yulin Wang Method for an improved chemical mechanical polishing system
US8414357B2 (en) * 2008-08-22 2013-04-09 Applied Materials, Inc. Chemical mechanical polisher having movable slurry dispensers and method
TWM352127U (en) * 2008-08-29 2009-03-01 Bestac Advanced Material Co Ltd Polishing pad
US20100099342A1 (en) * 2008-10-21 2010-04-22 Applied Materials, Inc. Pad conditioner auto disk change
US8989890B2 (en) 2008-11-07 2015-03-24 Applied Materials, Inc. GST film thickness monitoring
US9073169B2 (en) * 2008-11-07 2015-07-07 Applied Materials, Inc. Feedback control of polishing using optical detection of clearance
JP5023099B2 (ja) * 2009-04-03 2012-09-12 ニッタ・ハース株式会社 研磨パッドおよび研磨装置
JP2012533888A (ja) * 2009-07-16 2012-12-27 キャボット マイクロエレクトロニクス コーポレイション 溝付きｃｍｐ研磨ｐａｄ
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
KR101165440B1 (ko) 2009-07-23 2012-07-12 에스케이씨 주식회사 무방향성이고, 불균일한 표면 거칠기를 갖는 연마패드, 그 연마패드 제조방법 및 제조장치
SG181678A1 (en) 2009-12-30 2012-07-30 3M Innovative Properties Co Polishing pads including phase-separated polymer blend and method of making and using the same
KR20110100080A (ko) * 2010-03-03 2011-09-09 삼성전자주식회사 화학적 기계적 연마 공정용 연마 패드 및 이를 포함하는 화학적 기계적 연마 설비
US9254547B2 (en) * 2010-03-31 2016-02-09 Applied Materials, Inc. Side pad design for edge pedestal
JP5062455B2 (ja) 2010-07-12 2012-10-31 Ｊｓｒ株式会社 化学機械研磨パッドおよび化学機械研磨方法
WO2012036444A2 (ko) * 2010-09-15 2012-03-22 주식회사 엘지화학 Cmp용 연마 패드
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
SG190340A1 (en) 2010-11-22 2013-06-28 3M Innovative Properties Co Assembly and electronic devices including the same
US9211628B2 (en) 2011-01-26 2015-12-15 Nexplanar Corporation Polishing pad with concentric or approximately concentric polygon groove pattern
TWI532565B (zh) * 2011-03-21 2016-05-11 智勝科技股份有限公司 研磨方法以及研磨系統
US20120289131A1 (en) * 2011-05-13 2012-11-15 Li-Chung Liu Cmp apparatus and method
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
CN103329253B (zh) 2011-05-23 2016-03-30 宋健民 具有平坦化尖端的化学机械研磨垫修整器
DE102011082777A1 (de) * 2011-09-15 2012-02-09 Siltronic Ag Verfahren zum beidseitigen Polieren einer Halbleiterscheibe
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US9421669B2 (en) * 2012-07-30 2016-08-23 Globalfoundries Singapore Pte. Ltd. Single grooved polishing pad
US9428967B2 (en) 2013-03-01 2016-08-30 Baker Hughes Incorporated Polycrystalline compact tables for cutting elements and methods of fabrication
TWI599447B (zh) * 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9486893B2 (en) 2014-05-22 2016-11-08 Applied Materials, Inc. Conditioning of grooving in polishing pads
US10105812B2 (en) 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
US10207389B2 (en) 2014-07-17 2019-02-19 Applied Materials, Inc. Polishing pad configuration and chemical mechanical polishing system
US10076817B2 (en) 2014-07-17 2018-09-18 Applied Materials, Inc. Orbital polishing with small pad
TWI597125B (zh) * 2014-09-25 2017-09-01 三芳化學工業股份有限公司 拋光墊及其製造方法
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102436416B1 (ko) 2014-10-17 2022-08-26 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN113103145B (zh) * 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US9873179B2 (en) 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
KR102302564B1 (ko) 2016-03-09 2021-09-15 어플라이드 머티어리얼스, 인코포레이티드 패드 구조 및 제조 방법들
SG11201806820UA (en) 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
KR102363829B1 (ko) 2016-03-24 2022-02-16 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마를 위한 조직화된 소형 패드
TWI595968B (zh) * 2016-08-11 2017-08-21 宋建宏 研磨墊及其製造方法
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
US10864612B2 (en) * 2016-12-14 2020-12-15 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad and method of using
US20180281076A1 (en) * 2017-03-31 2018-10-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Gelling reduction tool for grooving chemical mechanical planarization polishing pads
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US10882160B2 (en) 2017-05-25 2021-01-05 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using sacrificial material
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
CN111032284B (zh) * 2017-08-04 2022-11-04 3M创新有限公司 具有增强的共平面性的微复制型抛光表面
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20190078941A (ko) * 2017-12-27 2019-07-05 삼성전자주식회사 연마 패드 및 이를 사용한 웨이퍼 가공 방법
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
US11679469B2 (en) * 2019-08-23 2023-06-20 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical planarization tool
TWI797501B (zh) 2019-11-22 2023-04-01 美商應用材料股份有限公司 在拋光墊中使用溝槽的晶圓邊緣不對稱校正
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
KR102518222B1 (ko) * 2020-12-24 2023-04-05 주식회사 에스엠티 리테이너 링, 이를 제조하는 방법 및 이를 포함하는 cmp 장치
CN112809550B (zh) * 2020-12-31 2022-04-22 湖北鼎汇微电子材料有限公司 一种抛光垫
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
US20220410338A1 (en) * 2021-06-28 2022-12-29 Sandisk Technologies Llc Chemical mechanical polishing apparatus with polishing pad including debris discharge tunnels and methods of operating the same
CN114083433A (zh) * 2021-11-23 2022-02-25 上海世禹精密机械有限公司 一种晶圆减薄机真空吸盘调节装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61182753A (ja) † 1985-02-07 1986-08-15 Canon Inc 研摩皿
JPS6254666A (ja) * 1985-08-29 1987-03-10 Matsushita Electric Ind Co Ltd 研摩定盤
AT386958B (de) * 1986-08-25 1988-11-10 Fischer Gmbh Verfahren zur herstellung eines skis
JPS6357055A (ja) * 1986-08-27 1988-03-11 三田村　利助 脱臭体
JPS6357077U (zh) * 1986-10-01 1988-04-16
JPS6357055U (zh) * 1986-10-03 1988-04-16
JPH01140959A (ja) * 1987-11-24 1989-06-02 Sumitomo Electric Ind Ltd 非接触研磨装置の錫定盤
US5190568B1 (en) * 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
US5020283A (en) † 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5234867A (en) * 1992-05-27 1993-08-10 Micron Technology, Inc. Method for planarizing semiconductor wafers with a non-circular polishing pad
FR2658747B1 (fr) * 1990-02-23 1992-07-03 Cice Sa Machine a roder, et plateau de rodage a sillon a pas variable pour une telle machine.
JPH05146969A (ja) † 1991-06-24 1993-06-15 Intel Corp 半導体基板上に形成された誘電体層を研磨する装置
US5212910A (en) † 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
JPH05177908A (ja) * 1992-01-07 1993-07-20 Canon Inc 記録装置
US5527215A (en) * 1992-01-10 1996-06-18 Schlegel Corporation Foam buffing pad having a finishing surface with a splash reducing configuration
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
JPH06179165A (ja) * 1992-12-14 1994-06-28 Kyocera Corp ラップ加工用定盤
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5394655A (en) * 1993-08-31 1995-03-07 Texas Instruments Incorporated Semiconductor polishing pad
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JPH07321076A (ja) * 1994-05-24 1995-12-08 Toshiba Corp 半導体装置の製造方法と研磨装置
JPH08197434A (ja) * 1995-01-23 1996-08-06 Sony Corp 研磨用パッド
US5558563A (en) * 1995-02-23 1996-09-24 International Business Machines Corporation Method and apparatus for uniform polishing of a substrate
JP2647046B2 (ja) * 1995-02-28 1997-08-27 日本電気株式会社 研磨布および研磨方法
US5533923A (en) † 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
JPH0911119A (ja) * 1995-04-27 1997-01-14 Asahi Glass Co Ltd ガラス板研磨パッドとガラス板の研磨方法
JPH0957608A (ja) * 1995-08-11 1997-03-04 Sony Corp 研磨パッド及びこれを用いた被表面処理加工物の研磨方法
JPH09102475A (ja) * 1995-10-03 1997-04-15 Hitachi Ltd 研磨装置
JP3042593B2 (ja) * 1995-10-25 2000-05-15 日本電気株式会社 研磨パッド
US5778481A (en) 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5690540A (en) † 1996-02-23 1997-11-25 Micron Technology, Inc. Spiral grooved polishing pad for chemical-mechanical planarization of semiconductor wafers
US5645469A (en) * 1996-09-06 1997-07-08 Advanced Micro Devices, Inc. Polishing pad with radially extending tapered channels
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US5888121A (en) * 1997-09-23 1999-03-30 Lsi Logic Corporation Controlling groove dimensions for enhanced slurry flow
US6203407B1 (en) * 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6238271B1 (en) * 1999-04-30 2001-05-29 Speed Fam-Ipec Corp. Methods and apparatus for improved polishing of workpieces
US6517416B1 (en) * 2000-01-05 2003-02-11 Agere Systems Inc. Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher
US6241596B1 (en) * 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7329170B2 (en) 2000-12-01 2008-02-12 Toyo Tire & Rubber Co., Ltd. Method of producing polishing pad
US7641540B2 (en) 2000-12-01 2010-01-05 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad
US7762870B2 (en) 2000-12-01 2010-07-27 Toyo Tire & Rubber Co., Ltd Polishing pad and cushion layer for polishing pad

Also Published As

Publication number Publication date
KR19980087060A (ko) 1998-12-05
DE69830944T3 (de) 2014-06-26
DE69830944D1 (de) 2005-09-01
SG83679A1 (en) 2001-10-16
DE69830944T2 (de) 2006-04-13
KR20060129140A (ko) 2006-12-15
KR100801371B1 (ko) 2008-02-05
JP4937184B2 (ja) 2012-05-23
US20030092371A1 (en) 2003-05-15
EP0878270A3 (en) 2000-08-23
US6520847B2 (en) 2003-02-18
US6645061B1 (en) 2003-11-11
US6824455B2 (en) 2004-11-30
JP2008188768A (ja) 2008-08-21
US6699115B2 (en) 2004-03-02
US20020137450A1 (en) 2002-09-26
KR100764988B1 (ko) 2007-12-14
EP0878270B2 (en) 2014-03-19
EP0878270B1 (en) 2005-07-27
JPH1170463A (ja) 1999-03-16
US5921855A (en) 1999-07-13
US5984769A (en) 1999-11-16
US20040072516A1 (en) 2004-04-15
EP0878270A2 (en) 1998-11-18

Similar Documents

Publication Publication Date Title
TW430893B (en) Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
EP1066928A3 (en) Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
SG72940A1 (en) Carrier and polishing apparatus
EP0439124A3 (en) Polishing pad with uniform abrasion
HUT63788A (en) Grain-cleaning and polishing apparatus
EP0307573A3 (en) Honing, lapping and polishing machine
AU6159198A (en) Integrated pad and belt for chemical mechanical polishing
GB2304058B (en) Apparatus for grinding and uniformizing grains and screen with annular working space for use in the apparatus
SG71123A1 (en) Universal surface finish for dca smt and pad on pad interconnections
EP0619983A3 (en) Surgical needle and device for grinding it.
GB8929131D0 (en) Tokens and validation devices therefor
BR9814812B1 (pt) processo de mistura e aparelhagem para realização do processo.
SG72926A1 (en) Carrier and cmp apparatus
EP0411345A3 (en) Feeding and dosing equipment for the lapping mixture in polishing machines for lapping, grinding or polishing
GB2289859B (en) Spherical member polishing apparatus
EP0739996A3 (en) Surface treating agent for plating and base material with the plating adhered thereto
SG70100A1 (en) Carrier apparatus with more than one carrier belts and processing apparatus therewith
DE59813362D1 (de) Maschinenzentrum, bei dem Werkstückhalter eine Mehrfachkupplung mit Abdeckung aufweisen
FR2703197B1 (fr) Armoire de distribution, montée sur un socle et ayant des barrettes amovibles de support de câbles.
EP0636500A3 (en) Accessory for notepad support.
DE59301418D1 (de) Grundgestell für maschinen und dergleichen
GB2335875B (en) Sphere grinding apparatus
FR2719982B3 (fr) Table à piètement amovible.
DE59808403D1 (de) Trägergurt für Kontaktstifte und Verfahren zu dessen Herstellung
GB9303996D0 (en) Portable back support apparatus

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MC4A Revocation of granted patent
MC4A Revocation of granted patent