GB9910105D0 - Polishing apparatus - Google Patents
Polishing apparatusInfo
- Publication number
- GB9910105D0 GB9910105D0 GBGB9910105.7A GB9910105A GB9910105D0 GB 9910105 D0 GB9910105 D0 GB 9910105D0 GB 9910105 A GB9910105 A GB 9910105A GB 9910105 D0 GB9910105 D0 GB 9910105D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- polishing apparatus
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/071,442 US6001005A (en) | 1997-09-19 | 1998-05-01 | Polishing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9910105D0 true GB9910105D0 (en) | 1999-06-30 |
GB2337014A GB2337014A (en) | 1999-11-10 |
Family
ID=22101358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9910105A Withdrawn GB2337014A (en) | 1998-05-01 | 1999-04-30 | Polishing apparatus. |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE19919583A1 (en) |
GB (1) | GB2337014A (en) |
TW (1) | TW414747B (en) |
WO (1) | WO1999056910A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002154049A (en) | 2000-11-15 | 2002-05-28 | Fujikoshi Mach Corp | Polishing method |
DE10132504C1 (en) | 2001-07-05 | 2002-10-10 | Wacker Siltronic Halbleitermat | Method for simultaneously polishing both sides of semiconductor wafer mounted on cogwheel between central cogwheel and annulus uses upper and lower polishing wheel |
DE10345335B4 (en) * | 2003-09-22 | 2012-04-26 | Supfina Grieshaber Gmbh & Co. Kg | Surface grinding machine and method for controlling |
CN109483388A (en) * | 2018-12-30 | 2019-03-19 | 苏州富强科技有限公司 | A kind of planet turnover type 3D bend glass polishing machine |
CN114952577B (en) * | 2022-07-08 | 2023-12-15 | 苏州近藤精密部件有限公司 | Valve end face polishing machine |
CN116276405A (en) * | 2023-05-18 | 2023-06-23 | 扬州韩思半导体科技有限公司 | Polishing device for wafer processing |
CN117245516B (en) * | 2023-11-15 | 2024-01-30 | 响水县环宇轴承座制造有限公司 | Bearing seat continuous polishing device and use method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2963830A (en) * | 1958-06-04 | 1960-12-13 | Norton Co | Lapping machine |
DE2204581B2 (en) * | 1972-02-01 | 1977-12-08 | Wolters, Peter, 4020 Mettmann | CONTROL DEVICE FOR THE PROCESSING PRESSURE OF A LAEPP OR HONING MACHINE |
JPS63120077A (en) * | 1986-11-08 | 1988-05-24 | Otani Reiji | Driving method for lapping and polishing machine for robot loading/unloading |
US5595529A (en) * | 1994-03-28 | 1997-01-21 | Speedfam Corporation | Dual column abrading machine |
-
1999
- 1999-04-13 WO PCT/US1999/008006 patent/WO1999056910A1/en active Application Filing
- 1999-04-29 DE DE1999119583 patent/DE19919583A1/en not_active Withdrawn
- 1999-04-30 GB GB9910105A patent/GB2337014A/en not_active Withdrawn
- 1999-05-01 TW TW88107099A patent/TW414747B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE19919583A1 (en) | 1999-11-04 |
WO1999056910A1 (en) | 1999-11-11 |
GB2337014A (en) | 1999-11-10 |
TW414747B (en) | 2000-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |