經濟部智慧財產局員工消費合作社印製 414747 A7 ______B7 五'發明說明（ί) 發明背景 1、 發明領域 本發明係相關於一種拋光機，並且特別地相關於一種 用來對一個或多個工件實行明確修整之機械。本發明特別 地適用於電腦硬碟記憶儲存磁碟之雙邊精確拋光° 2、 相關前技之敘述 拋光機係已能夠有效地被製造來提供例如是電腦硬碟 記憶儲存磁碟等工件一種非常平滑 '明確之表面修整。雖 然，單邊拋光係已經在一種有限程度上被執行’今日在商 業上所強調的是在記憶磁碟之雙邊加工，以至於磁碟結構 之兩個主要表面係可以被運用於記憶體儲存，從而降低記 憶體裝置之尺寸，而在同時允許較大記憶體容量被提供予 一給定尺寸之硬碟元件。記憶體儲存磁碟之磁性密度係已 大致上增加，而更多的數目資料位元係能夠被儲存在給定 尺寸之表面區域上。因此，資料儲存位元係已逐漸地佔據 較小之磁碟表面部份。據此，記憶磁碟之表面特徵已經逐 漸引起注意，而記憶磁碟之例行、極度明確之拋光係被需 要.。 在嘗試改良硬碟存取時間及記憶體轉換速率中，記憶 體儲存磁碟係以較高磁碟轉動速度而被驅動。因此，記憶 體儲存磁碟之整體（或所謂之'^綜合"）尺寸及容差對於 改良硬碟效能係逐漸地變得爲更加重要。再者，當磁碟速 度增加時，一般被稱之爲'^磁頭#之傳感器必須要盡可能 接近記憶體磁碟表面，用以獲得可用之訊號強度。因此， _____3___ 本紙張尺度適用中國國家標準（CNS)A4規格（210x 297公Μ ) — — — — — — — II--1 — 1111111 * — — — — — — 1/ (請先W讀背*之注項再i本頁) 414747 A7 B7__ 五、發明說明（> ) 增大之需求必須使用在對於降低記憶體儲存磁碟之總耗盡 量，並且記憶體儲存磁碟之表面變化係以一種朝向降低不 斷減小高度之"高點（high spots)"觀點而 被更仔細地檢查。再者，在特定類形之硬碟驅動機構中， 雙邊表面之平行度對於獲得預期裝置性能而言係變得更爲 重要。 發明槪要 本發明之目的係爲提供一種高效能拋光機*該拋光機 係原本精確地、容易使用而且與商業製造環境相容。重要 的是此等拋光機在拋光運轉之所有階段期間係能夠穩定* 而不需要特別注意改變之狀況，而且最終偏移可具有對於 被處理工件表面品質之效果。 在特定應用中，當拋光壓力減輕時，該工件之繼續轉 動係爲所必須者，而且至少在這些時間中該拋光表面及支 撐這些表面之周圍機構係被允許一個特定移動自由度。不 同的配合元件之任何大致偏移或內部移動係可能會導致欲 處理工件拋光表面之不必要的接觸，而本發明目的係用於 控制此等接觸。 檢查整體機器結構之剛性以及發展用來支撐拋光構件 之新結構來移除不必要運動是重要的，特別是在緊急時期 ，如同在拋光壓力係被釋放之時。 本發明這些及其他目的將從用於拋光工件之裝置之說 明書及圖式之硏究而變得更爲明顯，該裝置係包括有： 4 — I — I I!! — - I I I I J 訂 *!1!1 ί請先閱讀背面之注意事項再本頁) 經濟部智慧財產局員工消费合作社印製 本紙張尺度適用_國S家標準（CNS)A·丨規烙（210 X 297公坌） A7414747 經濟部智慧財產局具工消費合作社印製 B7_ -_ 五、發明說明（Ί ) 一個框架； 一個上方拋光平板； 一個下方拋光平板，其係被地位在該上方抛光平板之 下； 一個平板支承軸，其係從該上方拋光平板向上地延伸 ，並且具有一個特定軸； 裝設機構，其係用於裝設該平板支承軸’而使該平板 支承軸能夠在垂直方向上往覆運動並且可以繞著其中央軸 旋轉； 一個平台，其係藉由該軸所運載而與其一同移動’而 該平板支承軸係通過該平台： . 平台支承機構，其係藉由該框架所運載，用以使該平 台銜接在一個固定位置中，並同時允許該軸相對於該平台 之移動；以及 定位機構，其係包括有一個雙作用流體壓縮囊袋機構 ，其係藉由該平台所運載並且係銜接該平板支承軸，用以 使該平板支承軸以及該上方拋光平板相對於該平台而移動 ，以便使該上方拋光平板移向或是移離該下方拋光平板。 圖示簡鼠設明 第一圖係爲根據本發明原理之拋光裝置之分解立體圖 » 第二圖係爲拋光裝置之前視圖； 第三圖係爲拋光裝置之俯視圖： ----— — — — — — —--Μ--------^*il — -----^ ί請先閱讀背面之注意事項再^¾本頁) 本紙張尺度適用令國國家標準（CNS)A4規格⑵〇χ297公S ) 414747 Λ7 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（iV ) 第四圖係爲拋光裝置之側視圖； 第五圖係爲沿著第三圖中線5 - 5所截之斷面截面圖 i 第六圖係爲另一種配置之放大比例斷面圖； 第七圖係以放大比例來顯示第六圖之一部份； 第八圖係爲一個顯示了另一種配置之截面圖； 第九圖係爲相似於第六圖之斷面截面圖，但其顯示了 另一個用於裝設上方拋光平板之配置； 第十圖係爲一個拋光工具之前視圖： 第十一圖係爲一個拋光工具之俯視圖，其中有部分去 除； 第十二A圖以及第十二B圖係一起包括了另一個根據 本發明原理之拋光裝置的分解立體圖； 第十三圖係爲配合第十二圖中裝置之拋光裝置的一個 俯視圖*其中有部分去除； 第十四圖係爲拋光裝置之前視圖；以及 第十五圖係爲沿著第十三圖中線1 5 - 1 5所截之斷 面截面圖。 較佳實施例詳細說明 現在參照圖示，並且首先參照第一圖至第十一圖，一 個根據本發明原理之拋光工具8 (參見第十圖）係包括有 固顯示在第一圖中並且大體上以元件符號1 0所標示之 內部加工配置。該工具8係可以直接在商業上認可之拋光 — — — —tllllln — * I — I I I I I · I I I I — I I I r (請先閱讀背面之注意事項务本頁) 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 414747 Α7 Β7 經濟部智慧財產局員工消费合作社印製 五、發明說明（<) 記憶體儲存磁碟基板的領域中找到，雖然該工具8亦可以 輕易地適合於其他之使用’而這些使用包括有例如是加工 工具部件以及積體電路晶圓之硏磨、拋光、組織、以及平 面化。 在較佳實施例中，大數目（例如有5 〇個）之工件、 記憶體磁碟、磁碟基板、加工部件、或是其他工件係承受 同時的雙邊拋光，從而提供工具使用者在製造上的一種重 要經濟因素。爲了容納大數目之工件，包括有具齒工作夾 持棄或是運載器12(參見第十一圖）之工作籠機構係被 使用，用以在一個拋光操作期間來限制工件。一般來說較 佳的情況係爲：該工作籠機構係爲一種行星類型，其中複 數個運載器12係在一個外魂齒輪14與一個中央太陽齒 輪1 6之間繞轉。該運載器之外側具齒邊緣係與該中央太 陽齒輪相嚙合，該中央太陽齒輪係提供了該運載器一個旋 轉運動，以使得在該運載器係相對於該中央太陽齒輪之軸 旋轉時，工件能夠在個別、大體上擺線的路徑移動而繞著 其運載器之軸繞轉。同樣地，該上方拋光平板與該下方拋 光平板之旋轉，以及被安置在該拋光平板間之該工作籠機 構的旋轉，此等旋轉係可以依照所需而在旋轉之逆反方向 上操作。藉由調節該太陽齒輪以及環齒輪旋轉之方向與速 度，以及調整該上方拋光平板與該下方拋光平板之旋轉方 向與速度，實際上任何所期望之拋光作用係可以被獲得。 在較佳實施例中，五個記憶體磁碟1 8係被承載於每 一個運載器上，而十個運載器則係相互嚙合在該中央太陽 !!11! ^^ !! ·1 — 11!· / (請先Μ讀背面之注意事項再'砍寫本貝> 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） B7 414747 五、發明說明（L ) 齒輪與外側環繞環齒輪之間。爲了說明淸楚之緣故，在圖 示中僅顯示出兩個記憶體磁碟。然而，在實際上任何數目 之記憶體磁碟或是其他工件係可以經由運載器設計之適當 改變而被容納。整個工作籠機構係以一個獨立可控制之速 度來旋轉，而在同時該上方拋光平板以及該下方拋光平板 2 0、2 6 (例如參見第1 2 B圖）係以其本身所選定之 速度來獨立地旋轉。如同可以在這裡所看到的，該上方拋 光平板2 0係藉由一個馬達4 4而從上方被驅動（參見第 12A圖），而在同時該下方拋光平板26則係以一種傳 統方式而藉由容置在一中空底部箱子4 8中之裝備而從下 方被驅動。可以從第十圖看到可以經由存取門5 2而使用 該裝備來驅動該下方拋光平板。 在本發明中，較佳的情況係爲上方拋光平板以及下方 拋光平板係設有相對之環形拋光表面，並且上方拋光平板 以及下方拋光平板係沿著一個單一共同軸而獨立可旋轉地 裝設（參見第十二B圖中之虛線2 8) ^—個共同軸對準 之達成或者所謂的w聚焦（f 〇 c u s ) #係已被發現其 對於獲得所期望之拋光結果是很重要的’尤其是當具齒之 籠子機構係被製造以承受一種複雜的運動時’如同在本發 明之較佳實施例中所述者9爲了改善上方拋光平板與下方 拋光平板之同心對準，並且爲了在機器操作之不同階段期 間確保此等對準’大體上較佳的是支承上方拋光平板與下 方拋光平板之結構係具有其位置座落元件’該位置座落元 件係在一個共同磨整操作中被磨整，而該部件則係一個接 8 - ------ ----I* !| 訂.— — — — — I!線 (請先閱讀背面之注意事項再r寫本頁) 經濟部智慧財產局具工消费合作社印製 本紙張尺度適用中®國家標準（CNS)A4規格（210 X 297公釐） 414747 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（1 ) 著另一個地被裝設在其個別位置中。 如同將在此處所見到者，該支承上部構造之不同元件 係具有一個大體上三角形之構形。因此，大體上較佳的情 況係爲三個垂直支承柱體3 2 ' 3 4、以及3 6係被使用 ，而一個三角形、大體上水平之頂壁3 8則係在該柱體之 上端之間延伸（參見例如是第十二A圖）。該框架之底部 4 0較佳係能夠具有一個大體上矩形的形狀（參見第十二 B圖），雖然一個大體上三邊之三角形形狀亦可以被使用 〇 現在參照第二圖以及第三圖，支承柱體3 2至3 6係 從該頂壁3 8延伸並且係從下方被支承，通過底部隔間4 8 (參見第十圖）而到達機器底部4 0。參照第四圖以及 第五圖，大體上以元件符號6 0所標示之一個平台組件係 包括有一個平台6 6 >該平台之尺寸係爲了在該支承柱體 3 2、3 4、以及3 6之中的垂直移動而被設計》 一個帶有提供滑動支承之線性軸承7 2的平台組件6 〇 *其係具有一個中央支承柱體7 0 (參見第五圖）。如 同可以從第五圖中所看到者，該中央支承軸7 0係爲中空 者’而允許旋轉驅動主軸7 2能夠移動通過該平台組件， 以使其下端7 4係被連結至該上方拋光平板2 0，而與其 共同旋轉。在顯示於第五圖之配置中，該中央支承軸7 〇 係被連結至上升機構（例如是齒條以及小齒輪組合），該 上升機構並未顯示於圖示中，並且係被裝設在該頂壁3 8 之頂上。該上升機構係銜接該中央支承軸7 〇，用以使該 ____ 9 ------！丨|! · — · I I I — 丨訂------ (請先閱璜背面之注意事項再对寫本頁> 、' 、用中國國家標準（CNS)A』規格（210x297公髮 414747 B； 經濟部智慧財產局員工消費合作社印製 五、發明說明（z ) 支承軸7 0上升以及下降一個所期望之量。 如同可以從第五圖中所看到者，該中央支承軸7 0在 其下端係被連接至一個軸承裝置7 8。該軸承7 8接著係 被連結至上方壓力平板2 0。旋轉驅動主軸7 4係可以自 由地繞其中央軸而旋轉，從而使得該上方壓力平板2 0旋 轉。該中央支承柱體7 0較好係爲了上升以及下降而被裝 設，而不是爲了旋轉而被裝設者。 再一次地參照第五圖，平台組件6 0係包括有一個支 承台|該支承台係由一頂壁8 2與諸側壁8 4所構成，該 支承台之下端係被連結至該平台6 6。一個大致上完整之 包圍係被安置在該支承台中，並且係形成了一個環繞該中 央支承柱體7 0之中空空腔。該包圍係包括有一個頂壁8 6、圓柱形外壁8 8、以及下壁9 0與9 2。中央支承柱 體7 0係包括有第一與第二突出類似磁碟之平板元件9 4 與9 6。該第一磁碟9 4係被安置在該中空空腔中，以使 得該磁碟9 4係能夠與該上壁8 6相配合用以形成一個第 一容室部分，並且該磁碟9 4係能夠與該下壁9 0相配合 用以形成一個第二容室部分。該第二磁碟9 6係被安置在 形成於該下壁9 2與該平台6 6之間的空腔中。 一個上方流體壓縮囊袋1 〇 2係被安置在該第一容室 部份中，並且一個第二流體壓縮囊袋1 〇 4係被形成在剩 下的（下方的）容室部份中。該流體壓縮囊袋1 〇 2與1 Q 4係可以具有一種彈性（亦即可膨脹者）結構或是一種 帶有摺壁來允許容積擴張之非彈性結構。在較佳實施例中 1---I--------裝---！訂-------線 {請先閱讀背面之注意事項再贫寫本頁) 本紙張尺度適用中囤國家標準（CNS)A4規袼（210* 297公餐了 經濟部智慧財產局員工消費合作社印製 414747 A7 ----------B7 五、發明說明（1 ) ’該流體壓縮囊袋1 〇 2與1 ο 4係由一種例如是橡膠混 合物之彈性材料所製成。 再—次參照第五圖’當該下方囊袋1 〇 4係被壓縮時 ’該囊袋係膨脹以便完全地佔據在該磁碟9 4下方的該下 方容室部分。如同可以從第五圖中所看到者，該囊袋係藉 由該磁碟9 4、圓柱形外壁8 8、以及下壁9 0所限制， 其係被支承來抵抗移動。隨著壓力更進一步的增加，該囊 袋1 0 4係在一個向前的方向上驅使該磁碟9 4，降低了 該上方容室部分之容積，從而產生了該上方囊袋1〇2可 以被一個適當低內部壓力所允許之任何平坦化。 根據上方囊袋1 0 2之中的壓力，該下方囊袋1 0 4 之壓縮擴大將在一個特定操作點處停止》因爲該磁碟9 4 係被固定至該中央支承柱體7 0 ·而該中央支承柱體7 0 接著係被固定至該上方壓力平板2 0，因此該上方壓力平 板2 0之位置以及藉由該上方壓力平板2 0所施予工件之 壓力係可以被輕易地決定。如所希望在壓力上增大，或者 是如果該壓力平板2 0必須被下降得更多’壓力係可以從 該下方囊袋1 0 4釋放’而允許該磁碟9 4能夠安放在該 包圍之中的一個下方點處。如果需要的話’在該上方囊袋 1 0 2中之壓力亦可以被增大’用以提供在該上方壓力平 板2 0之一個較大範圍的控制。舉例來說’隨著該上方囊 袋與該下方囊袋1 0 2與1 0 4保持壓縮以便在其所座落 之該容室部分中完全地膨脹’該壓力平板2 〇將在任何所 期望之操作點處被提供增大之位置穩定性以及剛性’從而 丨 — ! — ! 1 訂· I I I I I 1— · (請先閱讀背面之江意事項再Ji寫本頁) 本紙張尺度通用争國國家標準（CNS)A4規格（2】0*297公釐） 414747 A7 __ B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（、c ) 抵抗了瞬間的移動作用力β 如同所提及者’該下方磁碟9 6係被保持在一個形成 在該平台6 6、下壁9 2、以及該圓柱形外壁8 4之間的 容室之中。所允許該下方磁碟96之自由度實際上將固定 該上方壓力平板2 0之移動範圍。如同將從下文中所看到 者’較佳的丨β況係爲將該平台6 6固定在一個相對於該支 承結構之固定位置處。磁碟9 6較好將被定位而在一些操 作點處接觸該平台6 6，用以固定該上方壓力平板2 0之 最下方位移1如果此係爲操作之一必須方面的話。 參照第一圖以及第二圖，大體上較佳的情況係爲，該 平台6 6與該上方壓力平板2 0係藉由該中央支承柱體7 0而從上方（例如頂壁3 8 )被懸掛地懸吊著。如同將從 下文中所看到者，在操作中，該平台6 6與該上方壓力平 板2 0係在一種普通操作中一起被上升或下降。在下降操 作期間，該平台6 6係在一個預定點處被停止，並且該隨 後該上方壓力平板2 0係相關於在該平台與該上方壓力平 板之間的相對移動，而被更進一步地下降。在這方面大體 上較佳的情況係爲，該上方壓力平台6 6之支承係盡可能 地牢固並且穩定。 參照第五圖，可以看到的是該平台6 6係提供了一個 用於該線性軸承7 2之參考框架，以及該線性軸承之穩定 支承將使得該上方壓力平板更進一步之下降能夠更爲精確 。因此，再一次地參照第一圖與第二圖，複數個可調整止 擋元件1 1 0裝設在該支承柱體3 2、3 4、以及3 6上 12 ----------I (請先W讀背面之注意事項务分寫本頁) i ί τ 本纸银尺度通用中gg家標準（CNS)jV1規格（21〇x297公釐) 經濟部智慧財產局員工消費合作社印製 414747 at Β7 五、發明說明（Λ ) 。再者，鑽石形之支承銷1 1 2係被固定至該止擋元件1 1 0，並且係被容置在一個互補形狀之凹槽中，其中該凹 槽係形成在該平台6 6之下側。在這樣的情況中，該平台 6 6之精確定位係能夠被保證，而對於拋光工具之每—個 操作循環而言能夠達到可重複之精確度。如果需要的話， 該止擋銷係可以被做成可調整者。藉由將該平台6 6固定 在適切位置，該線性軸承7 2並從而該上方拋光平板2 0 亦可以相對於工具之上方結構或結構而被精確地固定在適 切位置。 再一次地參照第十圖以及第十一圖，該中央支承軸以 及一個旋轉驅動主軸係被裝設在一個撓性類似囊袋之套管 1 1 6中。用於該中央支承柱體7 0之齒條與小齒輪上升 機構係座落在被裝設在該頂壁8 8頂上之包圍1 1 8中。 該中央支承柱體突出該頂壁3 8上方的部分效好係被容置 在該外殼1 1 8之中。欲喁該主軸7 4之旋轉驅動較好係 包括有一個被裝設在該中央支承柱體7 〇頂上之驅動馬達 ，以及在該外殼1 1 8之中的包圍，而該上方壓力平板2 0係藉由該中央支承柱體7 0而以一種鐘擺的方式從該頂 壁3 8被支承。參見第五圖，該中央支承柱體之下方部分 係藉由被安置在該平台6 6之中的該線性軸承7 2所引導 。該下方壓力平板26(參見第十圖）係藉由被安置在該 外殻部分48之中的傳統支承與驅動機構，而從下方被支 承。用於下方壓力平板2 6之該支承驅動機構係爲傳統之 設計，並且在圖中並無法看見。參照第五圖，隨著一個拋 本紙張&度適用中园國家標準（CNS)A4規格（210 X 297公爱） -----11----裝 -- - ----訂---------線 {請先閱讀背面之注意事項再ΐτΐΡ本頁) 414747 A7 B7 五、發明說明（) 光操作之完成，該中央支承柱體7 0係被上升，從而使得 該上方壓力平板2 0上升。 t 大體上較佳的情況係爲，該上方拋光平板2 0之初始 上升的完成係爲藉由壓縮上方囊袋1 0 4，如果需要的話 ，使該上方囊袋1 〇 2減壓。實際上，初始上升作用力係 經由壁8 4而被傳送至該平台6 6。如同上文中所提及者 ，此作用力接著係經由銷1 1 2與支承塊1 1 0，而被傳 送至支承柱體3 2 - 3 6並且最終被傳送至底部平板4 0 .。該中央支承柱體7 0接著係如同所提及者而被上升•並 且最後係與該平台6 6之下方表面相接觸。隨後，隨著該 中央支承柱體7 0之連續上升，該上方壓力平板2 0、該 平台6 6、以及運載於其上之該平台6 0係如同一個單一 單元而一起被上升，用以在該上方拋光平板與該下方拋光 平板2 0與2 6之間提供額外的間隙，以使得以拋光工件 能夠便利地移除以及重新裝載。隨後，該拋光加工循環係 隨著該上方壓力平板之下降而被重複，而開始一個新的拋 光操作。 一開始時，該中央支承柱體7 0係被下降，而該平台 6 6以及相關之平台組件6 0係停置在該上方壓力平板2 0之頂上。藉由連續地使得該中央支承柱體7 0下降，該 平台6 6最後係與該支承銷1 1 2以一種在第二圖中所指 出之方式相接觸。在這一點，大體上較佳的情況是該上方 拋光平板2 0係稍微地分隔在被運載於該下方拋光平板2 6上之工件上方。如果需要的話，該上方壓力平板係可以 {蹐先閱讀背面之#i意事項#--νί^本頁) Γ 矣· 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用令國舀家橾準規烙d〇x297公堃） 414747 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（θ) 直接地被帶至與該工件接觸。然而，對於高精確度拋光操 作而言，當該上方拋光平板被帶至與欲拋光工件相接觸時 ，小心地控制該上方拋光平板之移動是很重要的。特別的 是，吾人係已發現控制由該上方拋光平板20所施予之最 終拋光壓力是很重要的，並且控制拋光壓力之增加速率亦 爲相當重要者。 根據本發明，拋光壓力之增加速率係可以經由一種更 精細的方式而被控制，其中代表拋光壓力增加之所期望操 作曲線係可以經由一種在商業上經濟的精確度方式而重複 地獲得。在操作中*隨著該平台6 6被固定在一個固定位 置中，例如是在第二圖中所說明者，該上方拋光平板2 0 之重量係藉由該下方囊袋104所負荷。藉由降低在該下 方囊袋1 0 4中的壓力，該上方拋光平板2 0係以一種能 夠增大工件上拋光壓力的方式而被下降，其中該工件係爲 被運載於該下方拋光平板2 6上者。再一次地參照第五圖 ，元件符號1 2 2係標示在該上方拋光平板與該下方拋光 平板2 0與2 6中之一個鍵與槽的配置，用以保證該上方 拋光平板與該下方拋光平板2 0與2 6之相互同心定向。 同樣地，一個萬向配置係被指出，其中該上方拋光平板2 0係被固定至該中央支承柱體7 〇 ^ 如果需要的話，在該上方囊袋1 0 2中之空氣壓力係 可以被維持在實際上任何所期望之壓力等級。在一種操作 模式中，此將會造成該囊袋組合1 0 2與1 〇 4之彈簧特 徵，並且係將會反抗該上方拋光平板2 0在拋光操作期間 15 本紙張尺度適用中國標準（CNS>A4規格（21〇χ 297H) "" !!!裝— — 1 訂-!--線 (#先閱讀背面之注意事項再矿寫本頁> 414747 經濟部智慧財產局具工消費合作社印製 B7 五、發明說明（A) 可能會承受之之任何向上偏移。或者，如果希望提供此等 向上偏移之緩衝，則在該上方囊袋1 〇 2中之壓力係可以 稍微地減小，用以提供所期望之偏移量，而不需要移除承 載於該中央支承柱體7 0上之雙作用彈簧。 現在翻到第六圖，其係顯示了用於被元件符號1 2 6 所標示之另一個中央支承柱體之配置。如同在第六圖中所 指出者，該中央支承柱體1 2 6係將懸掛支承提供予該上 方拋光平板2 0 *而沒有一種內部座落之驅動主軸的好處 (例如是在第五圖中上方所示者）。更確切地說·該中央 支承柱體係藉由被裝設在該頂壁3 8頂上之適當驅動機構 ，而從上方可轉動地驅動，並且係被容置在該外殼1 1 8 之中，如同在第十圖中所顯示者。不同之配置係可以被使 用來降低在類似磁碟突出部94與囊袋102與104之 間的摩擦銜接。 如同在第六圖中以及第七圖中所顯示者，一對軸承1 2 8係被使用，其中一個軸承係與每一個囊袋有聯繫。該 平台組件6 0上下的細節係相同於在第五圖中所敘述者。 舉例來說，大體上較佳的是軸承1 3 0與1 3 2係分別被 設置在鄰近該上壁8 6與該下壁9 0處。如同在第七圖中 所指出者，一個空氣缺口或間隙係被設置在該中央支承柱 體與該頂壁8 2以及該下壁9 2之間。如果需要的話’一 個氣密包裝係可以被使用在此一區域中，但是此等係已被 發現爲非必須者》 現在翻到第八圖，其係顯示了用於該上方拋光平板之 --I---- - — I) - I - — — —In— ------I — (請先閲讀背面之注意事項*.^寫本頁) 本紙張尺度適用中國囷家標準（CNS)A4規格（21〇χ297公《) 經濟部智慧財產局員工消費合作社印製 414747 五、發明說明（6) 另一個流體控制配置β第八圖中支配置係大體上相似於在 第七圖中所顯示者。舉例來說，軸承1 2 8係被設置在該 類似磁碟之突出部9 4的一側上。然而，第七圖中之囊袋 係被上方與下方伸縮軟管140與142所替代》流體導 管1 4 4與1 4 6在一端係被連結至一個控制單元1 4 8 ，並且係通過環繞包圍之壁牆，以便進入到該伸縮軟管1 4 0與1 4 2之內部。該伸縮軟管係爲在垂直方向上可以 擴張以及可以收縮者’但是較佳的情況是非彈性者。如同 在第八圖中所顯示者，該伸縮軟管係具有與該中央支承柱 體1 2 6相分隔之內壁。或者，如果需要的話，該伸縮軟 管係可以具有一個開放的內部，而流體壓力係抵住該中央 支承柱體1 2 6之外壁。在後者之情況中，壓力密閉包裝 或是其他密封機構較好係被設置在空腔1 5 0與1 5 2中 〇 現在翻到第九圖，一種用於支承該上方拋光平板2 0 之配置係大致上相似於顯示在第六圖中者’除了一個萬向 機架1 5 8之設置之外’該萬向機架係允許該上方抛光平 板2 0在下壓銜接被應用至工件時能夠稍微地搖擺。在一 種操作模式中’裝以萬向接頭係允許該上方拋光平板能夠 達成一種與被運載於該下方拋光平板上之一列工件緊密地 接觸銜接，雖然在工件厚度上係會改變。如果沒有萬向配 置，拋光作用力將一開始就集中在較厚的工件上’而較白 之工件則將接收到一個較小的加工壓力’直到足夠的材料 係從該較厚工件上移除而使得工件厚度整個均勻爲止。 17 I!— — — — !- ·!ιί 訂· II ! I I - "3^ (請先閱璜背面之注帝孝項本頁) 本紙張尺度適用中國0家標準規格G1〇x 297公髮） 414747 B7 經濟部智慧財產局員工消費合作社印製 五、發明說明（> ) 現在翻到第十二圖至第十五圖，拋光工具之更進一步 的實施例係大體上以元件符號2 0 0來標示（參見第十三 圖以及第十四圖）。拋光工具200之許多特點係相同於 以上所描述者。舉例來說，參見第十三圖以及第十四圖， 該支承柱體3 2、3 4、以及3 6係從頂壁3 8延伸，並 且係從下方被支承，通過底部隔間4 8而到達機器底部4 0。一個平台2 0 6係沿著該支承柱體3 2 — 3 6而上下 地滑動。滾珠絲杠元件2 1 0係提供該平台2 0 6與螺絲 軸或螺紋桿件2 1 0、2 1 2、以及2 1 4之連接。該螺 紋桿件2 1 0、2 1 2、以及2 1 4接著係藉由頂壁3 8 而從上方被支承，並且接著係藉由驅動馬達2 1 6、2 1 8、以及2 2 0而被可旋轉地驅動（參見第十二Α圖）。 現在參照第十五圖，當一個拋光操作係被完成時，並 且一個 ''溫和釋放（soft release) 〃係被 期望時，在該下方囊袋1 0 4中之壓力係被增大，並且如 果需要的話，在上方囊袋1 0 2中之壓力係被降低，經由 在上文中所提及之方式，以便使該上方拋光平板2 0上升 一個初始量。隨後，該驅動馬達2 1 6、2 1 8、以及2 2 0係被給予能量，以便使該螺紋桿件2 1 0、2 1 2、 以及2 1 4旋轉，從而使得該平台元件2 0 6上升。隨著 繼續地上升，該平台之上方表面2 4 0係銜接被固定至該 中央支承柱體7 0之類似磁碟的突出部9 6。其後，隨著 該螺紋桿件2 1 0、2 1 2、以及2 1 4之繼續旋轉，該 中央支承桿件7 0並從而該上方拋光平板2 0係被上升， 18 I — — — — — — 11111— ·1111111 » —lilt I (請先閱讀背面之注意事項再填窝本頁) 本紙張尺度適用中國园家標準（CNS)A4規格（210 X 297公釐） 414747 A7 B7_ 五、發明說明（η) 隨著該平台2 4 0而在一個向上方向上移動，用以提供該 上方拋光平板與該下方拋光平板2 0與2 6之間〜個增大 的間隙。 在工件係被重新裝塡之後，拋光工具係已預備進行％ 個新的操作循環。一開始時，驅動馬達2 1 6、2 1 8、 以及2 2 0係被給予能量，而使得螺紋桿件2 1 0、2 1 2、以及2 1 4在相反方向上轉動，以便下方平台2 〇 6 、運載於其上之平台組件6 0'以及中央支承柱體7 〇隨 著該上方拋光平板而移動。在此操作過程期間•類似磁碟 之突出部9 6係維持與該平台2 0 6之上方表面2 4 0相 銜接。隨著該螺紋桿件2 1 0、2 1 2、以及2 1 4之繼 續旋轉，該平台2 0 6之下表面係被帶至與可調整引導銷 2 4 6相接觸，該可調整引導銷2 4 6係爲了在托架上之 垂直調整所裝設者，而該托架係爲從支承軸頸2 4 8所延 伸者。該引導銷2 4 6係可以具有一個用於垂直調整之螺 紋外部表面，或者是止擋軸頸248係可以螺紋與該支承 柱體3 2、3 4、以及3 6相銜接（經由印島銷2 4 6或 者不經由引導銷246) ’用以將一個垂直止擋調整提供 予該平台2 0 6。隨著該螺紋桿件2 1 0、2 1 2、以及 2 1 4之繼續旋轉，該平台2 0 6係被下降至與該引導銷 2 4 6相接觸，而馬達2 1 6、2 1 8、以及2 2 0係被 除去能量 ''大體上較佳的情況是該上方拋光平板2 0係被 分隔至少稍微在該下方拋光平板上方’並且該平台2 0 6 係被固定在一個固定的、穩定的位置。隨著在該囊袋10 --------------骏--------訂---------線 ί1*先町讀背面之注拿項再^寫本！) 經濟部智慧財產局員工消费合作社印 本紙張尺度適用中固國家標準（CNS)A4規格（210x297公釐） 414747 B7 經濟部智慧財產局員工消费合作社印製 五、發明說明（、?.） 4中壓力之減小，或是在上方囊袋1 0 2中壓力之增大， 或者是兩者同時發生的情況下，該中央支承柱體7 0並從 而被運載於其底部上之該上方壓力平板20，其係被更進 一步地下降，直到所期望之拋光壓力係到達爲止。如同上 文中所提及者，流體壓縮囊袋之使用係允許在拋光壓力改 變之改變與速率上之精確控制。再者，藉由使用多個囊袋 ，上方拋光平板之雙作用控制係可以在操作之一個循環期 間，經由一種在偏移上有效地緩衝或是其他控制震動方式 而輕易地被達成。 如同在本文中所述嫌前之實施例，平台以及平台組件 之重量係較產生所期望拋光壓力之所需向下作用力爲大。 因此，在銜接來產生所期望之拋光壓力之後並不需要驅動 該螺紋桿件2 1 0、2 1 2、以及2 1 4。如同所提及者 ，然而，較佳的情況是向下作用力係藉由增大在該上方囊 袋1 0 2中之壓力而增大，雖然在較佳實施例中此增大之 向下作用力與該上方拋光平板及其相關組件（例如是中央 支承柱體7 0 )之重量相較之下係爲相當的小。雖然在大 體上並非爲較佳者，藉由控制隨著該螺紋桿件1 0 2、1 0 4、以及1 0 6之拋光壓力來省略流體壓縮囊袋1 0 2 與1 0 4之操作是有可能的。 圖示以及先前之敘述並非用來表示相關於本發明結構 與操作方式之細節等等的唯一形式。在形式上之改變以及 在部件相稱上之改變，以及均等物之替代，此等係被認爲 是權宜之情況：並且雖然特殊之名詞係被採用’其係被認 1!!!-裝—丨— —訂----- --線 {請先閱讀背面之注意事項再"寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 414747 a7 _B7 五、發明說明（/\ ) 爲僅爲一種一般上以及敘述上之觀念，而非爲了限制之目 的，本發明之範圍係藉由以下申請專利範圍來界定。 (^先閱璜背面之汶意事項再矿寫本頁> 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準（CNSM·(規格（210 X 297公釐）Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 414747 A7 ______B7 Five 'Description of Invention (ί) Background of the Invention 1. Field of the Invention The present invention relates to a polishing machine, and in particular to a machine for performing one or more workpieces. Clear trimming mechanism. The present invention is particularly suitable for the two-sided precise polishing of computer hard disk memory storage disks. 2. Description of the related art The polishing machine has been effectively manufactured to provide workpieces such as computer hard disk memory storage disks with a very smooth 'Clear surface finish. Although, the unilateral polishing system has been performed to a limited extent, what is commercially emphasized today is the bilateral processing of memory disks, so that the two main surface systems of the disk structure can be used for memory storage, This reduces the size of the memory device, while allowing a larger memory capacity to be provided to a given size hard disk component. The magnetic density of memory storage disks has increased substantially, and a greater number of data bits can be stored on a surface area of a given size. As a result, data storage bits have gradually taken up a smaller portion of the disk surface. Based on this, the surface characteristics of memory disks have gradually attracted attention, and the routine and extremely clear polishing of memory disks is needed. In an attempt to improve hard disk access times and memory conversion rates, memory storage disks are driven at higher disk rotation speeds. Therefore, the overall (or so-called 'composite') size and tolerance of the memory storage disk are gradually becoming more important for improving the performance of the hard disk. Furthermore, as the speed of the magnetic disk increases, a sensor commonly referred to as '^ 磁头 #' must be as close as possible to the surface of the memory disk to obtain a usable signal strength. Therefore, _____3___ This paper size applies to the Chinese National Standard (CNS) A4 specification (210x 297mm) — — — — — — — II--1 — 1111111 * — — — — — — 1 / (Please read the back first * (Notes on this page) 414747 A7 B7__ 5. Description of the Invention (>) The increased demand must be used to reduce the total depletion of the memory storage disk, and the surface change of the memory storage disk is based on A " high spots " perspective that continuously decreases in height toward lowering is examined more closely. Furthermore, in certain types of hard disk drive mechanisms, the parallelism of the bilateral surfaces becomes more important for obtaining the desired device performance. SUMMARY OF THE INVENTION The object of the present invention is to provide a high-performance polishing machine that was originally accurate, easy to use, and compatible with commercial manufacturing environments. It is important that these polishing machines are stable during all stages of the polishing operation * without special attention to changing conditions, and that the final offset can have an effect on the quality of the surface of the workpiece being processed. In certain applications, when the polishing pressure is reduced, continued rotation of the workpiece is necessary, and at least during these times, the polishing surface and surrounding mechanisms supporting the surface are allowed a specific degree of freedom of movement. Any substantial offset or internal movement of different mating elements may cause unnecessary contact with the polished surface of the workpiece to be processed, and the object of the present invention is to control such contact. It is important to check the rigidity of the overall machine structure and to develop new structures to support the polished components to remove unnecessary movements, especially during emergencies, as when the polishing pressure is released. These and other objects of the present invention will become more apparent from the study of the description and drawings of a device for polishing a workpiece. The device includes: 4 — I — II !! —-IIIIJ Order *! 1! 1 ί Please read the notes on the back first, then this page) The paper printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to this paper _ National Standards (CNS) A · 丨 Standard Branding (210 X 297) 坌 A7414747 Ministry of Economy Printed by B7 _-_ of the Intellectual Property Bureau Cooperative Consumers Co., Ltd. 5. Description of the Invention (Ί) A frame; an upper polished plate; a lower polished plate, which is positioned below the upper polished plate; a plate supporting shaft, which The system extends upward from the upper polishing plate and has a specific shaft; a mounting mechanism is used to install the plate support shaft 'so that the plate support shaft can move in a vertical direction and can move around it The central axis rotates; a platform that moves with it carried by the axis' and the flat support shaft passes through the platform:. Platform support mechanism that is carried by the frame For engaging the platform in a fixed position while allowing the shaft to move relative to the platform; and a positioning mechanism that includes a double-acting fluid compression bag mechanism that is carried by the platform And it is connected with the flat plate support shaft for moving the flat plate support shaft and the upper polishing plate relative to the platform, so that the upper polishing plate is moved toward or away from the lower polishing plate. The figure shows that the first picture is an exploded perspective view of the polishing device according to the principle of the present invention »The second picture is a front view of the polishing device; the third picture is a top view of the polishing device: ---------------- — — —-- Μ -------- ^ * il — ----- ^ ί Please read the precautions on the back first ^^ This page) The paper size applies the national standard (CNS) A4 Specifications ⑵〇χ297 公 S) 414747 Λ7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of Invention (iV) The fourth picture is a side view of the polishing device; the fifth picture is along the line in the third picture The cross-sectional view taken from 5 to 5 i The sixth figure is an enlarged scale sectional view of another configuration; the seventh figure is a part of the sixth figure at an enlarged scale; the eighth figure is a display A sectional view of another configuration is shown; the ninth figure is a sectional view similar to the sixth figure, but it shows another configuration for installing an upper polishing plate; the tenth figure is a front view of a polishing tool : The eleventh figure is a top view of a polishing tool, with some parts removed; twelfth A And the twelfth figure B together includes another exploded perspective view of the polishing device according to the principle of the present invention; the thirteenth figure is a top view of the polishing device matching the device in the twelfth figure * with some parts removed; The fourth figure is a front view of the polishing device; and the fifteenth figure is a cross-sectional view taken along line 15-15 in the thirteenth figure. Detailed description of the preferred embodiment Referring now to the drawings, and first to the first to eleventh drawings, a polishing tool 8 (see tenth drawing) according to the principles of the present invention includes a solid display shown in the first drawing and generally The internal processing configuration indicated by the component symbol 10 above. The tool 8 series can be directly commercially approved polishing — — — — tlllllln — * I — IIIII · IIII — III r (Please read the precautions on the back page first) This paper size applies to Chinese National Standards (CNS) A4 specifications (210 X 297 mm) 414747 Α7 Β7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs <) Found in the field of memory storage disk substrates, although the tool 8 can also be easily adapted for other uses', and these uses include, for example, honing, polishing, processing tool parts and integrated circuit wafers, Organization and planarization. In a preferred embodiment, a large number (for example, 50) of workpieces, memory disks, disk substrates, processing components, or other workpieces are subjected to simultaneous bilateral polishing, thereby providing tool users with manufacturing capabilities. An important economic factor. To accommodate a large number of workpieces, a working cage mechanism including a toothed work clamp discard or carrier 12 (see Fig. 11) is used to restrict the workpiece during a polishing operation. In general, the preferred situation is that the working cage mechanism is of a planetary type, in which a plurality of carriers 12 are orbited between an external soul gear 14 and a central sun gear 16. The outer toothed edge train of the carrier meshes with the central sun gear. The central sun gear train provides a rotational movement of the carrier so that when the carrier train rotates relative to the axis of the central sun gear, the workpiece Capable of moving on individual, generally cycloidal paths, around its carrier axis. Similarly, the rotation of the upper polishing plate and the lower polishing plate, and the rotation of the working cage mechanism disposed between the polishing plates, these rotations can be operated in the reverse direction of rotation as required. By adjusting the direction and speed of rotation of the sun gear and ring gear, and adjusting the direction and speed of rotation of the upper polishing plate and the lower polishing plate, virtually any desired polishing effect can be obtained. In the preferred embodiment, five memory disks 18 are carried on each carrier, and ten carriers are meshed with each other in the central sun !! 11! ^^ !! · 1 — 11 ! · / (Please read the precautions on the back first, and then 'cut the shellfish'> This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) B7 414747 V. Description of the invention (L) Gear and outer side Surround the ring gears. For the sake of clarity, only two memory disks are shown in the illustration. However, in fact, any number of memory disks or other workpieces can be designed by the carrier. The working cage mechanism is rotated at an independently controllable speed, and the upper polishing plate and the lower polishing plate 20, 2 6 (for example, see FIG. 1 2B) are at the same time. The speed selected by itself rotates independently. As can be seen here, the upper polishing plate 20 is driven from above by a motor 4 4 (see Figure 12A), while polishing at the same time Tablet 26 is a traditional method It is driven from below by the equipment housed in a hollow bottom box 48. It can be seen from the tenth figure that the equipment can be used to drive the lower polishing plate via the access door 52. In the present invention The best case is that the upper polishing plate and the lower polishing plate are provided with opposite annular polishing surfaces, and the upper polishing plate and the lower polishing plate are independently rotatably installed along a single common axis (see twelfth) The dashed line 2 in the figure B 8) ^ —Achieving a common axis alignment or so-called w focus (f occus) # has been found to be important for obtaining the desired polishing result ', especially when toothed The cage mechanism is manufactured to withstand a complex movement 'as described in the preferred embodiment of the present invention 9 in order to improve the concentric alignment of the upper polishing plate and the lower polishing plate, and to improve the concentric alignment of the lower polishing plate It is ensured during this alignment that 'in general it is preferred that the structure supporting the upper polishing plate and the lower polishing plate has a position seating element' which position seating element system Grinded in a common grinding operation, and the parts are connected one after the other 8------- ---- I *! | Order. — — — — — I! Note for further writing on this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Industrial Consumer Cooperatives, this paper is applicable in the national standard (CNS) A4 specification (210 X 297 mm) 414747 B7 Fifth, the description of the invention (1) is installed in another position in another place. As will be seen here, the different elements of the supporting superstructure have a generally triangular configuration. Therefore, generally The best case is that three vertical support columns 3 2 '3 4 and 36 are used, and a triangular, generally horizontal top wall 38 is extended between the upper ends of the column ( (See, for example, Figure 12A). The bottom 40 of the frame is preferably able to have a generally rectangular shape (see figure 12B), although a generally three-sided triangular shape can also be used. Now referring to the second and third figures, The support columns 3 2 to 3 6 extend from the top wall 38 and are supported from below, and reach the bottom 40 of the machine through the bottom compartment 4 8 (see the tenth figure). Referring to the fourth and fifth figures, a platform assembly generally indicated by the component symbol 60 includes a platform 6 6 > The dimensions of the platform are to be mounted on the support pillars 3 2, 3 4, and 3 Designed for vertical movement among 6 "A platform assembly 60 with a linear bearing 7 2 that provides sliding support has a central support cylinder 70 (see figure 5). As can be seen from the fifth figure, the central support shaft 70 is hollow and allows the rotary drive spindle 72 to be able to move through the platform assembly so that its lower end 74 is connected to the upper polishing The plate 2 0 rotates with it. In the configuration shown in the fifth figure, the central support shaft 70 is connected to a lifting mechanism (such as a rack and pinion combination). The lifting mechanism is not shown in the figure and is installed in the On top of the top wall 3 8. The lifting mechanism is connected to the central support shaft 70 to make the ____ 9 ------!丨 |! · · · III — 丨 Order ------ (Please read the precautions on the back of the page before writing this page >, ', using China National Standard (CNS) A' specifications (210x297 public hair 414747 B; Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (z) The support shaft 70 rises and falls by a desired amount. As can be seen from the fifth figure, the central support shaft 70 At its lower end, it is connected to a bearing device 78. The bearing 78 is then connected to the upper pressure plate 20. The rotary drive spindle 7 4 is free to rotate around its central axis, so that the upper pressure plate 20 rotation. The central support cylinder 70 is preferably installed for ascending and descending, rather than being installed for rotation. Referring again to the fifth figure, the platform assembly 60 includes a support. Platform | The support platform is composed of a top wall 82 and side walls 84, and the lower end of the support platform is connected to the platform 66. A substantially complete surrounding system is placed in the support platform, and the system Formed around the central support column 7 0 hollow space. The enclosing system includes a top wall 86, a cylindrical outer wall 88, and lower walls 90 and 92. The central support column 70 includes a first and a second protruding similar disks. Plate elements 9 4 and 9 6. The first magnetic disk 9 4 is disposed in the hollow cavity, so that the magnetic disk 9 4 can cooperate with the upper wall 86 to form a first volume. And the magnetic disk 92 can be matched with the lower wall 90 to form a second storage chamber portion. The second magnetic disk 96 can be placed on the lower wall 92 and the platform. In the cavity between 6 and 6. An upper fluid compression pouch 1002 system is placed in the first chamber portion, and a second fluid compression pouch 104 system is formed in the remaining ( In the lower part of the chamber, the fluid compression bladder 10 and 1 Q 4 series can have a flexible (ie, expandable) structure or a non-elastic structure with folded walls to allow volume expansion. In the preferred embodiment 1 --- I -------- install ---! Order ------- line {Please read the precautions on the back before writing this page) This paper size suitable China National Standard (CNS) A4 Regulations (210 * 297 meals printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs printed 414747 A7 ---------- B7 V. Invention Description (1) 'The fluid Compression pouches 1 02 and 1 4 are made of an elastic material, such as a rubber compound. Refer again to the fifth figure 'When the lower pouch 10 is compressed,' the pouch is inflated. So as to completely occupy the lower chamber portion below the magnetic disk 94. As can be seen from the fifth figure, the pouch is connected by the magnetic disk 94, the cylindrical outer wall 88, and the bottom Restricted by a wall 90, it is supported to resist movement. As the pressure increases further, the pouch 104 drives the magnetic disk 94 in a forward direction, reducing the volume of the upper chamber portion, thereby producing the upper pouch 104 Any planarization allowed by a suitably low internal pressure. According to the pressure in the upper pouch 1 102, the compression expansion of the lower pouch 1 104 will stop at a specific operating point. "Because the disk 9 4 is fixed to the central support cylinder 7 0 ·, The central support cylinder 70 is then fixed to the upper pressure plate 20, so the position of the upper pressure plate 20 and the pressure applied to the workpiece by the upper pressure plate 20 can be easily determined. Increase the pressure as desired, or if the pressure plate 20 must be lowered more 'the pressure can be released from the lower pouch 10 104' and allow the disk 9 4 to be placed in the enclosure Point below one of them. If desired, 'the pressure in the upper pouch 102 can also be increased' to provide a larger range of control over the upper pressure plate 20. For example, 'as the upper pouch and the lower pouch 1 102 and 104 remain compressed to fully expand in the part of the chamber in which they are seated' the pressure plate 2 will be at any desired The operating point is provided with increased position stability and rigidity, so 丨 —! —! 1 Order IIIII 1— · (Please read the Jiang Yi matters on the back before Ji write this page) This paper is a standard country of the country Standard (CNS) A4 Specification (2) 0 * 297 mm) 414747 A7 __ B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (, c) Resists the momentary moving force β as mentioned 'The lower magnetic disk 96 is held in a container formed between the platform 66, the lower wall 92, and the cylindrical outer wall 84. The degree of freedom allowed for the lower magnetic disk 96 will actually fix the moving range of the upper pressure plate 20. As will be seen hereinafter, the preferred condition of β is to fix the platform 66 at a fixed position relative to the support structure. The magnetic disk 9 6 is preferably positioned to contact the platform 6 6 at some operating points to fix the lowermost displacement 1 of the upper pressure plate 20 if this is an essential aspect of operation. Referring to the first figure and the second figure, it is generally preferred that the platform 66 and the upper pressure plate 20 are covered from above (for example, the top wall 38) by the central support column 70. Suspended. As will be seen from the following, in operation, the platform 66 and the upper pressure plate 20 are raised or lowered together in a normal operation. During the lowering operation, the platform 66 is stopped at a predetermined point, and the subsequent upper pressure plate 20 is further lowered in relation to the relative movement between the platform and the upper pressure plate. . In this respect, it is generally preferred that the support of the upper pressure platform 66 is as strong and stable as possible. Referring to the fifth figure, it can be seen that the platform 6 6 series provides a reference frame for the linear bearing 72, and the stable support of the linear bearing will enable the upper pressure plate to be lowered more accurately. . Therefore, referring again to the first and second figures, a plurality of adjustable stop elements 1 10 are installed on the support pillars 3 2, 3 4, and 3 6 12 -------- --I (Please read the precautions on the reverse side and write this page first) i ί τ General paper standard (CNS) jV1 specification (21 × 297 mm) on paper and silver Printed 414747 at Β7 V. Description of the Invention (Λ). Furthermore, a diamond-shaped support pin 1 1 2 is fixed to the stop element 1 1 0 and is accommodated in a complementary-shaped groove, wherein the groove is formed below the platform 66. side. In such a case, the precise positioning of the platform 66 can be guaranteed, and repeatable accuracy can be achieved for each operation cycle of the polishing tool. If necessary, the stop pin system can be made adjustable. By fixing the platform 6 6 in a proper position, the linear bearing 72 and thus the upper polished flat plate 20 can also be accurately fixed in a proper position relative to the structure or structure above the tool. Referring again to the tenth and eleventh figures, the central support shaft and a rotary drive spindle system are housed in a flexible bag-like sleeve 1 1 6. The rack and pinion raising mechanism for the central support cylinder 70 is seated in a surround 1 1 8 mounted on top of the top wall 8 8. A part of the central support pillar protruding above the top wall 38 is effectively accommodated in the casing 1 1 8. The rotation drive of the main shaft 74 preferably includes a drive motor mounted on the top of the central support cylinder 70 and a surround in the housing 1 18, and the upper pressure plate 20 It is supported from the top wall 38 by a central pendulum 70 in a pendulum manner. Referring to the fifth figure, the lower portion of the central support cylinder is guided by the linear bearing 72 placed in the platform 66. The lower pressure plate 26 (see the tenth figure) is supported from below by a conventional supporting and driving mechanism disposed in the housing portion 48. The supporting drive mechanism for the lower pressure plate 26 is of conventional design and cannot be seen in the figure. With reference to the fifth figure, with a throwaway paper & degree applicable to the National Park National Standard (CNS) A4 specification (210 X 297 public love) ----- 11 ---- installed------ order --------- Line {Please read the precautions on the back page before ΐτΐΡ page) 414747 A7 B7 V. Description of the invention () After the light operation is completed, the central support column 7 0 is raised, so that The upper pressure plate 20 rises. In general, it is generally better that the initial ascent of the upper polishing plate 20 is completed by compressing the upper pouch 104 and decompressing the upper pouch 102 if necessary. In fact, the initial ascending force is transmitted to the platform 66 via the wall 84. As mentioned above, this force is then transmitted to the support pillars 3 2-3 6 via the pins 1 12 and the support block 1 10, and finally to the bottom plate 40. The central support cylinder 70 is then raised as mentioned, and finally comes into contact with the lower surface of the platform 66. Subsequently, with the continuous rise of the central support column 70, the upper pressure plate 20, the platform 66, and the platform 60 carried on it are raised together as a single unit for Additional clearance is provided between the upper polishing plate and the lower polishing plate 20 and 26, so that the polished workpiece can be easily removed and reloaded. Subsequently, the polishing process cycle is repeated as the upper pressure plate is lowered, and a new polishing operation is started. Initially, the central support column 70 is lowered, and the platform 66 and related platform components 60 are parked on top of the upper pressure plate 20. By continuously lowering the central support post 70, the platform 66 is finally in contact with the support pin 1 12 in a manner indicated in the second figure. At this point, it is generally preferable that the upper polishing plate 20 is slightly partitioned above the workpiece carried on the lower polishing plate 26. If necessary, the upper pressure plate can be {蹐 read the #i 意 事 #-νί ^ page on the back side) Γ 矣 · Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs.橾 Standard regulations (d × x297) 堃 414747 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (θ) is brought directly into contact with the workpiece. However, for high-precision polishing operations, when the upper polishing plate is brought into contact with the workpiece to be polished, it is important to carefully control the movement of the upper polishing plate. In particular, we have found that it is important to control the final polishing pressure applied by the upper polishing plate 20, and it is also important to control the rate of increase of the polishing pressure. According to the present invention, the rate of increase of the polishing pressure can be controlled via a finer method, in which a desired operation curve representing an increase in the polishing pressure can be repeatedly obtained through a commercially economically accurate manner. In operation * As the platform 66 is fixed in a fixed position, such as illustrated in the second figure, the weight of the upper polishing plate 20 is carried by the lower pouch 104. By lowering the pressure in the lower pouch 104, the upper polishing plate 20 is lowered in a manner capable of increasing the polishing pressure on the workpiece, wherein the workpiece is carried on the lower polishing plate 2 6 The former. Referring again to the fifth figure, the component symbol 1 2 2 indicates a key and groove arrangement in the upper polishing plate and the lower polishing plate 20 and 26 to ensure that the upper polishing plate and the lower polishing The plates 20 and 26 are oriented concentrically with each other. Similarly, a gimbal arrangement is indicated, in which the upper polished plate 20 is fixed to the central support post 7 〇 ^ If necessary, the air pressure system in the upper pocket 102 can be maintained At virtually any desired pressure level. In one mode of operation, this will cause the spring characteristics of the capsular bag combination 102 and 104, and will resist the upper polished flat plate 20 during the polishing operation. This paper size applies to Chinese standards (CNS > A4 specifications (21〇χ 297H) " " !!! equipment — 1 order-!-Line (# first read the notes on the back and then write this page) 414747 Ministry of Economic Affairs Intellectual Property Bureau Tooling Consumer Cooperatives Printed B7 V. Description of the invention (A) Any upward displacement that it may withstand. Or, if you want to provide cushioning for such upward displacement, the pressure in the upper pouch 102 can be slightly reduced. Small to provide the desired offset without removing the double-acting spring carried on the central support cylinder 70. Now turning to the sixth figure, it shows the symbol for the component 1 2 The configuration of the other central support column indicated at 6. As indicated in the sixth figure, the central support column 1 2 6 provides hanging support to the upper polished plate 2 0 * without an internal seating Benefits of driving the spindle (e.g. in Figure 5 (Shown above). More specifically, the central support column system is rotatably driven from above by an appropriate drive mechanism mounted on top of the top wall 38, and is housed in the housing 1 18, as shown in the tenth figure. Different configurations can be used to reduce the frictional engagement between the similar disk protrusion 94 and the pouches 102 and 104. As in the sixth figure and As shown in the seventh figure, a pair of bearings 128 is used, one of which is associated with each pouch. The details of the platform assembly 60 above and below are the same as those described in the fifth figure. For example, it is generally preferred that the bearings 130 and 132 are respectively disposed adjacent to the upper wall 86 and the lower wall 90. As indicated in the seventh figure, an air gap Or a gap system is provided between the central support pillar and the top wall 82 and the lower wall 92. 'An airtight packaging system can be used in this area if necessary, but these systems have been Found as a non-essential "Now turn to the eighth figure, which shows the --I -----— I)-I-— — —In— ------ I — (Please read the notes on the back first *. ^ Write this page) The paper size applies Chinese Family Standard (CNS) A4 specification (21 × 297) "Printed by the Consumers' Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 414747 V. Description of the invention (6) Another fluid control configuration β The branch configuration in Figure 8 is roughly similar As shown in the seventh figure. For example, a bearing 1 2 8 is provided on one side of the disk-like protrusion 9 4. However, the pouch in the seventh figure is above and below. Telescopic hoses 140 and 142 replace "Fluid conduits 1 4 4 and 1 4 6 are connected to a control unit 1 4 8 at one end and pass through the surrounding wall to access the telescopic hose 1 4 0 With 1 4 2 interior. The telescopic hose is one which can be expanded and contracted in the vertical direction, but it is preferably inelastic. As shown in the eighth figure, the telescopic hose has an inner wall separated from the central support post 1 2 6. Alternatively, if desired, the telescoping hose system may have an open interior and the fluid pressure system abuts against the outer wall of the central support cylinder 1 2 6. In the latter case, a pressure-tight packaging or other sealing mechanism is preferably provided in the cavities 150 and 152. Now turning to the ninth figure, a configuration for supporting the upper polished plate 20 The system is roughly similar to the one shown in the sixth figure, except for the setting of a universal frame 158. The universal frame system allows the upper polished flat plate 20 to be slightly pressed when the joint is applied to the workpiece. To sway. In one mode of operation, the use of a universal joint system allows the upper polished plate to achieve a close contact engagement with a row of workpieces carried on the lower polished plate, although the thickness of the workpiece may vary. If there is no gimbal configuration, the polishing force will be concentrated on the thicker workpiece from the beginning 'and the whiter workpiece will receive a smaller processing pressure' until enough material is removed from the thicker workpiece So that the thickness of the workpiece is uniform throughout. 17 I! — — — —!-!! I order II! II-" 3 ^ (Please read the note on the back page of the Emperor Xiaoxiao page first) This paper size applies to 0 Chinese standard specifications G1〇x 297 male (Issued) 414747 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (>) Now turning to the twelfth to fifteenth drawings, a further embodiment of the polishing tool is generally indicated by the symbol 2 0 0 to mark (see Figures 13 and 14). Many features of the polishing tool 200 are the same as those described above. For example, referring to the thirteenth and fourteenth drawings, the support columns 3 2, 3 4, and 36 are extended from the top wall 38 and are supported from below through the bottom compartment 48. Reach the bottom of the machine 40. A platform 2 0 6 slides up and down along the supporting column 3 2-3 6. The ball screw element 2 0 provides the connection of the platform 2 06 with a screw shaft or a threaded rod 2 1 0, 2 1 2 and 2 1 4. The threaded rods 2 1 0, 2 1 2 and 2 1 4 are then supported from above by the top wall 3 8 and then are driven by the drive motors 2 1 6, 2 1 8 and 2 2 0 Driven rotatably (see figure twelve A). Referring now to the fifteenth figure, when a polishing operation is completed and a `` soft release '' system is desired, the pressure system in the lower pouch 104 is increased, and if If necessary, the pressure in the upper pouch 102 is reduced, in the manner mentioned above, in order to raise the upper polished flat plate 20 by an initial amount. Subsequently, the driving motors 2 1 6, 2 1 8, and 2 2 0 are energized to rotate the threaded rod members 2 1 0, 2 1 2, and 2 1 4 so that the platform member 2 6 rise. As it continues to rise, the upper surface 240 of the platform engages a disk-like projection 96 fixed to the central support cylinder 70. Thereafter, as the threaded rods 2 1 0, 2 1 2 and 2 1 4 continue to rotate, the central support rod 70 and thus the upper polished flat plate 20 are raised, 18 I — — — — — — 11111— · 1111111 »—lilt I (Please read the precautions on the back before filling in this page) This paper size applies to China Garden Standard (CNS) A4 (210 X 297 mm) 414747 A7 B7_ V. Invention Explanation (η) moves in an upward direction with the platform 240 to provide an increased gap between the upper polishing plate and the lower polishing plate 20 and 26. After the workpiece system has been reloaded, the polishing tool system is ready for% new operating cycles. At the beginning, the drive motors 2 1 6, 2 1 8, and 2 2 0 are energized, so that the threaded rods 2 1 0, 2 1 2, and 2 1 4 are rotated in opposite directions so that the lower platform 2 〇6, the platform assembly 60 'carried on it and the central support pillar 70 are moved along with the polished flat plate above. During this operation • Disk-like protrusions 9 6 remain engaged with the upper surface 2 4 0 of the platform 2 06. As the threaded rods 2 1 0, 2 1 2 and 2 1 4 continue to rotate, the lower surface of the platform 2 06 is brought into contact with an adjustable guide pin 2 4 6 which is an adjustable guide pin 2 4 6 is installed for vertical adjustment on the bracket, and the bracket is extended from the support journal 2 4 8. The guide pin 2 4 6 can have a threaded external surface for vertical adjustment, or the stop journal 248 can be threaded to the support post 3 2, 3 4, and 3 6 (via the island pin) 2 4 6 or 246) 'To provide a vertical stop adjustment to the platform 2 0 6. As the threaded rods 2 1 0, 2 1 2 and 2 1 4 continue to rotate, the platform 2 0 6 is lowered to contact the guide pin 2 4 6 and the motors 2 1 6 and 2 1 8 And the 2 2 0 system is removed of energy `` in general it is better that the upper polishing plate 20 system is separated at least slightly above the lower polishing plate 'and the platform 2 6 system is fixed to a fixed, Stable position. With 10 in the pouch -------------- Jun -------- Order --------- line ί1 * Xiancho read the note on the back Xiang again ^ copybook! ) The printed paper size of the employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs applies to the China Solid State Standard (CNS) A4 specification (210x297 mm) 414747 B7 When the pressure decreases, or the pressure in the upper pouch 102 increases, or both occur simultaneously, the central support cylinder 70 is thus carried on the upper pressure plate on its bottom. 20, which is further lowered until the desired polishing pressure is reached. As mentioned above, the use of a fluid compression bladder allows precise control over the change and rate of polishing pressure changes. Furthermore, by using multiple pouches, the double-acting control system of the polished upper plate can be easily achieved during a cycle of operation through an effective buffering or other vibration control method. As with the previous embodiments described herein, the weight of the platform and platform components is greater than the downward force required to produce the desired polishing pressure. Therefore, it is not necessary to drive the threaded rod members 2 1 0, 2 1 2 and 2 1 4 after being engaged to generate the desired polishing pressure. As mentioned, however, it is preferred that the downward force is increased by increasing the pressure in the upper bladder 102, although in the preferred embodiment this increased downward force The force is relatively small compared with the weight of the upper polished flat plate and its related components (for example, the central support cylinder 70). Although it is generally not the better one, the operation of omitting the fluid compression bladder 1 0 2 and 1 0 4 by controlling the polishing pressure with the threaded rods 1 0 2, 1 0 4 and 10 6 is possible. The illustrations and previous descriptions are not the only forms used to show details and the like related to the structure and operation of the present invention. Changes in form and changes in commensurate parts, and substitution of equals, are considered expedient situations: and although special terms are used, 'It is recognized 1 !!!-packed —丨 — —Order ----- --- line {Please read the precautions on the back before writing this page) This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) The invention description (/ \) is only a general and narrative concept, not for the purpose of limitation. The scope of the present invention is defined by the scope of the following patent applications. (^ Please read the Wen Yi matter on the back and write this page first> Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy