SG158142A1 - A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus - Google Patents

A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus

Info

Publication number
SG158142A1
SG158142A1 SG200908350-2A SG2009083502A SG158142A1 SG 158142 A1 SG158142 A1 SG 158142A1 SG 2009083502 A SG2009083502 A SG 2009083502A SG 158142 A1 SG158142 A1 SG 158142A1
Authority
SG
Singapore
Prior art keywords
cleaning
persulfuric acid
sulfuric acid
recycling type
cleaning system
Prior art date
Application number
SG200908350-2A
Other languages
English (en)
Inventor
Tatsuo Nagai
Norihito Ikemiya
Haruyoshi Yamakawa
Hideki Kobayashi
Hiroshi Morita
Original Assignee
Kurita Water Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Ind Ltd filed Critical Kurita Water Ind Ltd
Publication of SG158142A1 publication Critical patent/SG158142A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25BELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00Electrolytic production of inorganic compounds or non-metals
    • C25B1/01Products
    • C25B1/28Per-compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/08Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Detergent Compositions (AREA)
SG200908350-2A 2004-09-17 2005-09-14 A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus SG158142A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004271604 2004-09-17
JP2005232825A JP4462146B2 (ja) 2004-09-17 2005-08-11 硫酸リサイクル型洗浄システムおよび硫酸リサイクル型過硫酸供給装置

Publications (1)

Publication Number Publication Date
SG158142A1 true SG158142A1 (en) 2010-01-29

Family

ID=36060067

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200908350-2A SG158142A1 (en) 2004-09-17 2005-09-14 A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus

Country Status (9)

Country Link
US (1) US9593424B2 (ja)
EP (1) EP1801265B1 (ja)
JP (1) JP4462146B2 (ja)
KR (1) KR101222880B1 (ja)
CN (1) CN101061261B (ja)
AT (1) ATE510048T1 (ja)
SG (1) SG158142A1 (ja)
TW (1) TWI366611B (ja)
WO (1) WO2006030816A1 (ja)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8046867B2 (en) 2006-02-10 2011-11-01 Tennant Company Mobile surface cleaner having a sparging device
JP4605393B2 (ja) * 2006-03-29 2011-01-05 栗田工業株式会社 電解ガス処理装置および硫酸リサイクル型洗浄システム
JP4623307B2 (ja) * 2006-03-29 2011-02-02 栗田工業株式会社 電解セルおよび該電解セルを用いた硫酸リサイクル型洗浄システム
JP4808551B2 (ja) * 2006-06-16 2011-11-02 クロリンエンジニアズ株式会社 過硫酸の製造方法
TWI351446B (en) * 2006-06-16 2011-11-01 Toshiba Kk Cleaning system and cleaning method
JP5087325B2 (ja) * 2006-06-16 2012-12-05 株式会社東芝 洗浄システム及び洗浄方法
JP4840582B2 (ja) * 2006-08-25 2011-12-21 栗田工業株式会社 過硫酸洗浄システム
JP4644170B2 (ja) * 2006-09-06 2011-03-02 栗田工業株式会社 基板処理装置および基板処理方法
KR101262842B1 (ko) * 2006-12-18 2013-05-09 주식회사 케이씨텍 습식처리장비의 약액 냉각장치
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
JP5605530B2 (ja) * 2008-01-11 2014-10-15 栗田工業株式会社 電解方法
JP5105081B2 (ja) * 2008-04-08 2012-12-19 栗田工業株式会社 機能性溶液供給システムおよび機能性溶液供給方法
KR100931063B1 (ko) * 2008-05-14 2009-12-10 일성초음파산업 주식회사 광학 렌즈 성형 몰드용 세척장치
JP5358303B2 (ja) * 2008-06-30 2013-12-04 クロリンエンジニアズ株式会社 電解硫酸による洗浄方法及び半導体装置の製造方法
CN102159750A (zh) * 2008-09-24 2011-08-17 栗田工业株式会社 金刚石电极及金刚石电极的制造方法
JP5592611B2 (ja) * 2009-01-05 2014-09-17 オルガノ株式会社 過硫酸製造装置及び過硫酸製造方法
JP5660279B2 (ja) * 2009-03-24 2015-01-28 栗田工業株式会社 機能性溶液供給システムおよび供給方法
JP2012146690A (ja) * 2009-03-31 2012-08-02 Kurita Water Ind Ltd 電子材料洗浄方法及び電子材料洗浄装置
JP5066152B2 (ja) * 2009-09-25 2012-11-07 株式会社東芝 洗浄システム
JP5148576B2 (ja) 2009-09-25 2013-02-20 株式会社東芝 洗浄方法
JP5499602B2 (ja) * 2009-09-30 2014-05-21 栗田工業株式会社 有効酸化性物質の濃度測定方法
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
JP2011192779A (ja) * 2010-03-15 2011-09-29 Kurita Water Ind Ltd 電子材料の洗浄方法および洗浄システム
US20110237484A1 (en) * 2010-03-25 2011-09-29 Basf Se Electrochemical textile-washing process
JP5751426B2 (ja) * 2010-06-07 2015-07-22 栗田工業株式会社 洗浄システムおよび洗浄方法
JP5668914B2 (ja) * 2010-08-27 2015-02-12 栗田工業株式会社 洗浄方法および洗浄システム
JP5773132B2 (ja) * 2011-02-23 2015-09-02 栗田工業株式会社 過硫酸濃度の測定方法、過硫酸濃度測定装置、及び過硫酸供給装置
JP2012180538A (ja) * 2011-02-28 2012-09-20 Kurita Water Ind Ltd 硫酸電解方法および硫酸電解装置
JP5939373B2 (ja) * 2011-03-24 2016-06-22 栗田工業株式会社 電子材料洗浄方法および洗浄装置
US8992691B2 (en) * 2011-04-05 2015-03-31 International Business Machines Corporation Partial solution replacement in recyclable persulfuric acid cleaning systems
EP2697730A4 (en) * 2011-04-15 2015-04-15 Advanced Diamond Technologies Inc ELECTROCHEMICAL SYSTEM AND METHOD FOR PROPORTION OF OXIDIZERS AT HIGH CURRENT DENSITY
CN102319688A (zh) * 2011-07-11 2012-01-18 苏州赤诚洗净科技有限公司 硅料清洗装置
JP5729571B2 (ja) 2011-07-11 2015-06-03 栗田工業株式会社 メタルゲート半導体の洗浄方法
DE102011080105A1 (de) * 2011-07-29 2013-01-31 Wacker Chemie Ag Verfahren zur Reinigung von polykristallinen Siliciumbruchstücken
EP2806779A1 (en) * 2012-01-26 2014-12-03 Tennant Company Apparatus and method for generating thermally-enhanced treatment liquids
JP2014063920A (ja) * 2012-09-21 2014-04-10 Kurita Water Ind Ltd 洗浄方法および洗浄装置
JP5854230B2 (ja) * 2012-12-13 2016-02-09 栗田工業株式会社 基板洗浄液および基板洗浄方法
US10056248B2 (en) 2013-07-23 2018-08-21 Kurita Water Industries Ltd. Method for measuring overall concentration of oxidizing substances, substrate cleaning method, and substrate cleaning system
JP5667674B1 (ja) * 2013-08-20 2015-02-12 サーモス株式会社 金属容器を洗浄する洗浄装置
US10239772B2 (en) 2015-05-28 2019-03-26 Advanced Diamond Technologies, Inc. Recycling loop method for preparation of high concentration ozone
US9665000B1 (en) * 2015-11-16 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Method and system for EUV mask cleaning with non-thermal solution
CN105585182A (zh) * 2016-03-03 2016-05-18 金晨光 一种压舱水处理设备
JP6750293B2 (ja) * 2016-04-28 2020-09-02 栗田工業株式会社 プラスチック表面の処理方法
WO2018075920A1 (en) 2016-10-20 2018-04-26 Advanced Diamond Technologies, Inc. Ozone generators, methods of making ozone generators, and methods of generating ozone
JP7146572B2 (ja) 2018-02-23 2022-10-04 キヤノン株式会社 基板の成膜方法、及び液体吐出ヘッドの製造方法
CN108550519A (zh) * 2018-06-08 2018-09-18 东莞市中图半导体科技有限公司 一种半导体晶片的清洗装置
JP7072453B2 (ja) * 2018-06-29 2022-05-20 東京エレクトロン株式会社 基板処理装置、および基板処理方法
US11037805B2 (en) * 2018-11-23 2021-06-15 Nanya Technology Corporation Wafer cleaning apparatus and method of cleaning wafer
KR102175129B1 (ko) 2019-04-26 2020-11-05 주식회사 성창 전자 재료 세정 시스템
CN111020643B (zh) * 2019-12-30 2022-02-11 中国科学院青海盐湖研究所 一种双面光铜箔及其制备方法与装置
CN115298360A (zh) * 2020-05-18 2022-11-04 栗田工业株式会社 电解硫酸溶液制备系统的启动方法
US20210407824A1 (en) 2020-06-30 2021-12-30 Applied Materials, Inc. Spm processing of substrates
JP6988977B1 (ja) * 2020-10-07 2022-01-05 栗田工業株式会社 樹脂成形体のエッチング方法及び樹脂成形体のエッチング処理システム
JP7370113B1 (ja) 2023-02-28 2023-10-27 ミクロエース株式会社 基板処理方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123098A (ja) * 1973-03-28 1974-11-25
US4395312A (en) * 1981-04-02 1983-07-26 The Ohio State University Research Foundation Method and apparatus for the analysis of solution adjacent an electrode
US4615776A (en) * 1983-10-21 1986-10-07 Shinko-Pfaudler Company Electrolytic decontamination process and process for reproducing decontaminating electrolyte by electrodeposition and apparatuses therefore
US4855023A (en) * 1986-10-06 1989-08-08 Athens, Inc. Method and apparatus for the continuous on-site chemical reprocessing of ultrapure liquids used in semiconductor wafer cleaning
JPH02159029A (ja) 1988-12-13 1990-06-19 Matsushita Electric Ind Co Ltd 薬液処理方法およびその装置
JPH0320746A (ja) * 1989-06-16 1991-01-29 Matsushita Electron Corp フォトレジスト膜の除去方法
JP3383334B2 (ja) * 1992-12-16 2003-03-04 クロリンエンジニアズ株式会社 硫酸の再生利用方法
US5399247A (en) * 1993-12-22 1995-03-21 Eastman Kodak Company Method of electrolysis employing a doped diamond anode to oxidize solutes in wastewater
JP2743822B2 (ja) * 1994-03-25 1998-04-22 日本電気株式会社 電解活性水処理装置
DE69533245D1 (de) * 1994-03-25 2004-08-19 Nec Electronics Corp Vorrichtung zur elektrolytischen Behandlung
US6562205B1 (en) * 1997-03-31 2003-05-13 Mitsubishi Denki Kabushiki Kaisha High-temperature ultrapure water production apparatus and liquid medicine preparation apparatus equipped with the production apparatus
JP2000164550A (ja) * 1998-11-27 2000-06-16 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
NZ517172A (en) * 1999-08-05 2003-09-26 Steris Inc Electrolytic synthesis of peracetic acid
DE19948184C2 (de) 1999-10-06 2001-08-09 Fraunhofer Ges Forschung Elektrochemische Herstellung von Peroxo-dischwefelsäure unter Einsatz von diamantbeschichteten Elektroden
JP2001192874A (ja) * 1999-12-28 2001-07-17 Permelec Electrode Ltd 過硫酸溶解水の製造方法
JP3635026B2 (ja) * 2000-06-14 2005-03-30 株式会社サンテックシステム 硫酸リサイクル装置
US20030077491A1 (en) * 2001-10-24 2003-04-24 Lillis Mark A. Weight sensing system, method for use thereof, and electrochemical system for use therewith
JP2003271218A (ja) * 2002-03-15 2003-09-26 Toshiba Corp 半導体製造装置、半導体製造システム及び基板処理方法
DE10219688A1 (de) * 2002-05-02 2003-11-20 Condias Gmbh Verfahren und Vorrichtung zur oxidativen Behandlung von Oberflächen
JP2004174485A (ja) 2002-11-14 2004-06-24 Sankyo Seiki Mfg Co Ltd 超純水洗浄システム
US20050139487A1 (en) * 2003-05-02 2005-06-30 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Method for the oxidative treatment of components comprised of or containing elementary silicon and/or substantially inorganic silicon compounds

Also Published As

Publication number Publication date
CN101061261A (zh) 2007-10-24
ATE510048T1 (de) 2011-06-15
EP1801265A4 (en) 2009-06-17
KR20070101219A (ko) 2007-10-16
EP1801265A1 (en) 2007-06-27
KR101222880B1 (ko) 2013-01-17
WO2006030816A1 (ja) 2006-03-23
TW200610841A (en) 2006-04-01
US9593424B2 (en) 2017-03-14
US20080251108A1 (en) 2008-10-16
JP2006114880A (ja) 2006-04-27
CN101061261B (zh) 2010-09-01
EP1801265B1 (en) 2011-05-18
JP4462146B2 (ja) 2010-05-12
TWI366611B (en) 2012-06-21

Similar Documents

Publication Publication Date Title
SG158142A1 (en) A sulfuric acid recycling type cleaning system and a sulfuric acid recycling type persulfuric acid supply apparatus
MY187600A (en) Microbubble electrolyzed water generation device and microbubble electrolyzed water generation method
WO2005012597A3 (en) Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction
WO2010101841A3 (en) Electrolytic apparatus for treating ballast water and treatment system using same
NO20063307L (no) Elektrolytisk celle for behandling av forurenset vann
EP1400494A2 (en) Electrochemical treatment of ammonia in waste-water
Almazán-Ruiz et al. Nickel recovery from an electroplating rinsing effluent using RCE bench scale and RCE pilot plant reactors: the influence of pH control
WO2010012792A3 (en) Electrochemical device
WO2008139653A1 (ja) 洗浄方法およびそれに用いる装置
PH12014502784A1 (en) Sterile water generation device and sterilizing cleaning method
KR101269948B1 (ko) 질소 폐수 처리장치 및 그 방법
WO2017090431A1 (ja) 還元水の製造装置および還元水の製造方法
JP4117607B2 (ja) 冷却水の処理方法
CN105399187B (zh) 一种资源化利用钢丝绳酸洗废液的方法
CN203976921U (zh) 酸性氯化铜蚀刻液电解再生循环及铜板回收装置
KR100816099B1 (ko) 차아염소산 나트륨 발생시스템
ATE503864T1 (de) Elektrochemisches verfahren zur rückgewinnung von eisenmetall- und chlorwertstoffen aus eisenreichen metallchloridabfällen
MX2010005949A (es) Catalizador para oxiclorinacion.
JP6300253B1 (ja) 水処理システム、電極洗浄方法及び電極洗浄装置
DE502006002482D1 (de) Verfahren zum reinigen von wässern nukleartechnischer anlagen
JP3177645U (ja) 特殊水生成装置
CN106957092A (zh) 一种三维脉冲电解除氨氮的方法
CN208234603U (zh) 循环水杀菌电解除垢系统
CN207418350U (zh) 一种网格式垢菌清装置
WO2009011190A1 (ja) 金属製造方法および装置