SG152121A1 - Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers - Google Patents

Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Info

Publication number
SG152121A1
SG152121A1 SG200805890-1A SG2008058901A SG152121A1 SG 152121 A1 SG152121 A1 SG 152121A1 SG 2008058901 A SG2008058901 A SG 2008058901A SG 152121 A1 SG152121 A1 SG 152121A1
Authority
SG
Singapore
Prior art keywords
carrier
semiconductor wafers
coating
simultaneous double
side material
Prior art date
Application number
SG200805890-1A
Other languages
English (en)
Inventor
Georg Pietsch
Michael Kerstan
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG152121A1 publication Critical patent/SG152121A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
SG200805890-1A 2007-10-17 2008-08-08 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers SG152121A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007049811.1A DE102007049811B4 (de) 2007-10-17 2007-10-17 Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben

Publications (1)

Publication Number Publication Date
SG152121A1 true SG152121A1 (en) 2009-05-29

Family

ID=40458799

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200805890-1A SG152121A1 (en) 2007-10-17 2008-08-08 Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers

Country Status (7)

Country Link
US (1) US9539695B2 (ko)
JP (1) JP5207909B2 (ko)
KR (1) KR101275441B1 (ko)
CN (1) CN101412201B (ko)
DE (1) DE102007049811B4 (ko)
SG (1) SG152121A1 (ko)
TW (1) TWI411494B (ko)

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DE102009038941B4 (de) * 2009-08-26 2013-03-21 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE102009047927A1 (de) 2009-10-01 2011-01-27 Siltronic Ag Läuferscheibe und Verfahren zur Politur einer Halbleiterscheibe
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US8712575B2 (en) * 2010-03-26 2014-04-29 Memc Electronic Materials, Inc. Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
DE102010032501B4 (de) 2010-07-28 2019-03-28 Siltronic Ag Verfahren und Vorrichtung zum Abrichten der Arbeitsschichten einer Doppelseiten-Schleifvorrichtung
DE102010042040A1 (de) 2010-10-06 2012-04-12 Siltronic Ag Verfahren zum Schleifen einer Halbleiterscheibe
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
DE102011080323A1 (de) 2011-08-03 2013-02-07 Siltronic Ag Verfahren zum Einebnen einer Halbleiterscheibe mit verbesserter Kantenschonung
DE102011082857B4 (de) * 2011-09-16 2020-02-20 Siltronic Ag Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung wenigstens dreier Werkstücke
DE102011089570A1 (de) 2011-12-22 2013-06-27 Siltronic Ag Führungskäfig zum beidseitigen Schleifen von mindestens einem scheibenförmigen Werkstück zwischen zwei rotierenden Arbeitsscheiben einer Schleifvorrichtung, Verfahren zur Herstellung des Führungskäfigs und Verfahren zum gleichzeitigen beidseitigen Schleifen von scheibenförmigen Werkstücken unter Verwendung des Führungskäfigs
DE102012206398A1 (de) 2012-04-18 2012-06-21 Siltronic Ag Verfahren zur beidseitigen Bearbeitung einer Scheibe aus Halbleitermaterial
KR20130137475A (ko) * 2012-06-07 2013-12-17 삼성전자주식회사 기판 처리방법 및 그에 사용되는 서포트 기판
DE102012214998B4 (de) 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
JP5748717B2 (ja) 2012-09-06 2015-07-15 信越半導体株式会社 両面研磨方法
DE102012218745A1 (de) 2012-10-15 2014-04-17 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
DE102013218880A1 (de) * 2012-11-20 2014-05-22 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe, umfassend das gleichzeitige Polieren einer Vorderseite und einer Rückseite einer Substratscheibe
DE102013200756A1 (de) * 2013-01-18 2014-08-07 Siltronic Ag Läuferscheibe für die beidseitige Politur von Scheiben aus Halbleitermaterial
CN103817572A (zh) * 2014-02-18 2014-05-28 河南机电高等专科学校 一种离合器摩擦钢片修复装置
US11325220B2 (en) * 2016-02-16 2022-05-10 Shin-Etsu Handotai Co., Ltd. Double-side polishing method and double-side polishing apparatus
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US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
JP6977657B2 (ja) * 2018-05-08 2021-12-08 信越半導体株式会社 両面研磨装置用キャリアの保管方法及びウェーハの両面研磨方法
US11621171B2 (en) 2018-09-25 2023-04-04 Nissan Chemical Corporation Method for polishing silicon wafer with reduced wear on carrier, and polishing liquid used therein
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Also Published As

Publication number Publication date
JP2009099980A (ja) 2009-05-07
DE102007049811B4 (de) 2016-07-28
TWI411494B (zh) 2013-10-11
DE102007049811A1 (de) 2009-04-23
KR101275441B1 (ko) 2013-06-14
CN101412201A (zh) 2009-04-22
US9539695B2 (en) 2017-01-10
KR20090039596A (ko) 2009-04-22
CN101412201B (zh) 2012-04-18
JP5207909B2 (ja) 2013-06-12
US20090104852A1 (en) 2009-04-23
TW200918236A (en) 2009-05-01

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