KR100898821B1 - 웨이퍼 캐리어의 제조방법 - Google Patents
웨이퍼 캐리어의 제조방법 Download PDFInfo
- Publication number
- KR100898821B1 KR100898821B1 KR1020070122655A KR20070122655A KR100898821B1 KR 100898821 B1 KR100898821 B1 KR 100898821B1 KR 1020070122655 A KR1020070122655 A KR 1020070122655A KR 20070122655 A KR20070122655 A KR 20070122655A KR 100898821 B1 KR100898821 B1 KR 100898821B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- wafer carrier
- hole
- manufacturing
- carrier
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/28—Work carriers for double side lapping of plane surfaces
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4998—Combined manufacture including applying or shaping of fluent material
- Y10T29/49982—Coating
Abstract
Description
Claims (3)
- 웨이퍼의 양면을 연마하기 위한 웨이퍼의 양면 연마장치에 구비되는 웨이퍼 캐리어의 제조방법에 있어서,상기 웨이퍼 캐리어를 구성하는 본체를 미리 설정된 형상으로 가공하는 가공단계;상기 웨이퍼 캐리어의 본체에 예비공 및 슬러리를 유입하기 위한 슬러리 유입공을 관통 형성하는 형성단계;상기 예비공이 형성된 본체에 디엘씨를 코팅하는 코팅단계; 및상기 디엘씨 코팅후에 상기 예비공을 확공하여 웨이퍼를 삽입하기 위한 웨이퍼 유지공을 형성하는 웨이퍼 유지공 형성단계;를 구비하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
- 제 1항에 있어서,상기 예비공을 형성한 후 상기 디엘씨를 코팅하기 전에, 상기 본체의 전면 및 배면 중 적어도 하나의 면에 상기 예비공의 중심점으로부터 서로 동일한 거리에 배치되도록 상기 본체에 부착 가능한 표식부재를 부착하는 부착단계;를 더 구비하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
- 제 2항에 있어서,상기 표식부재를 상기 예비공의 중심점으로부터 방사형으로 배치되도록 적어도 4개 부착하는 것을 특징으로 하는 웨이퍼 캐리어의 제조방법.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
EP08015234A EP2065131B1 (en) | 2007-11-29 | 2008-08-28 | Method of manufacturing wafer carrier |
US12/201,490 US20090139077A1 (en) | 2007-11-29 | 2008-08-29 | Method of manufacturing wafer carrier |
JP2008233693A JP2009135424A (ja) | 2007-11-29 | 2008-09-11 | ウェーハキャリアの製造方法 |
SG200806881-9A SG152974A1 (en) | 2007-11-29 | 2008-09-17 | Method of manufacturing wafer carrier |
SG2011039096A SG173996A1 (en) | 2007-11-29 | 2008-09-17 | Method of manufacturing wafer carrier |
CNA2008101755535A CN101444899A (zh) | 2007-11-29 | 2008-11-07 | 制造芯片载体的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100898821B1 true KR100898821B1 (ko) | 2009-05-22 |
Family
ID=40373423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070122655A KR100898821B1 (ko) | 2007-11-29 | 2007-11-29 | 웨이퍼 캐리어의 제조방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090139077A1 (ko) |
EP (1) | EP2065131B1 (ko) |
JP (1) | JP2009135424A (ko) |
KR (1) | KR100898821B1 (ko) |
CN (1) | CN101444899A (ko) |
SG (2) | SG152974A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101043983B1 (ko) * | 2010-09-01 | 2011-06-24 | 박광진 | 수지재 캐리어 및 그 제조방법 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102011003008B4 (de) * | 2011-01-21 | 2018-07-12 | Siltronic Ag | Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben |
JP5741157B2 (ja) * | 2011-04-07 | 2015-07-01 | 旭硝子株式会社 | 研磨用キャリア及び該キャリアを用いたガラス基板の研磨方法及びガラス基板の製造方法 |
TWI425230B (zh) * | 2011-10-25 | 2014-02-01 | Chroma Ate Inc | Touchpad detection machine |
DE102012214998B4 (de) | 2012-08-23 | 2014-07-24 | Siltronic Ag | Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe |
JP6056793B2 (ja) * | 2014-03-14 | 2017-01-11 | 信越半導体株式会社 | 両面研磨装置用キャリアの製造方法及び両面研磨方法 |
JP6424809B2 (ja) * | 2015-12-11 | 2018-11-21 | 信越半導体株式会社 | ウェーハの両面研磨方法 |
JP2018136239A (ja) * | 2017-02-23 | 2018-08-30 | セイコーエプソン株式会社 | 電子部品搬送装置及び電子部品検査装置 |
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JP2006303136A (ja) * | 2005-04-20 | 2006-11-02 | Shin Etsu Handotai Co Ltd | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP2007276041A (ja) | 2006-04-05 | 2007-10-25 | Shirasaki Seisakusho:Kk | Dlcコーティングウエハホルダ、およびdlcコーティングウエハホルダの製造方法。 |
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JP2007301713A (ja) | 2006-04-10 | 2007-11-22 | Kemet Japan Co Ltd | 研磨治具 |
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-
2007
- 2007-11-29 KR KR1020070122655A patent/KR100898821B1/ko active IP Right Grant
-
2008
- 2008-08-28 EP EP08015234A patent/EP2065131B1/en active Active
- 2008-08-29 US US12/201,490 patent/US20090139077A1/en not_active Abandoned
- 2008-09-11 JP JP2008233693A patent/JP2009135424A/ja active Pending
- 2008-09-17 SG SG200806881-9A patent/SG152974A1/en unknown
- 2008-09-17 SG SG2011039096A patent/SG173996A1/en unknown
- 2008-11-07 CN CNA2008101755535A patent/CN101444899A/zh active Pending
Patent Citations (4)
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KR20070110033A (ko) * | 2005-02-25 | 2007-11-15 | 신에쯔 한도타이 가부시키가이샤 | 양면 연마 장치용 캐리어 및 이를 이용한 양면 연마 장치,양면 연마 방법 |
JP2006303136A (ja) * | 2005-04-20 | 2006-11-02 | Shin Etsu Handotai Co Ltd | 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法 |
JP2007276041A (ja) | 2006-04-05 | 2007-10-25 | Shirasaki Seisakusho:Kk | Dlcコーティングウエハホルダ、およびdlcコーティングウエハホルダの製造方法。 |
JP2007301713A (ja) | 2006-04-10 | 2007-11-22 | Kemet Japan Co Ltd | 研磨治具 |
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KR101043983B1 (ko) * | 2010-09-01 | 2011-06-24 | 박광진 | 수지재 캐리어 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
SG173996A1 (en) | 2011-09-29 |
CN101444899A (zh) | 2009-06-03 |
SG152974A1 (en) | 2009-06-29 |
EP2065131B1 (en) | 2012-10-10 |
JP2009135424A (ja) | 2009-06-18 |
US20090139077A1 (en) | 2009-06-04 |
EP2065131A1 (en) | 2009-06-03 |
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