SG152974A1 - Method of manufacturing wafer carrier - Google Patents

Method of manufacturing wafer carrier

Info

Publication number
SG152974A1
SG152974A1 SG200806881-9A SG2008068819A SG152974A1 SG 152974 A1 SG152974 A1 SG 152974A1 SG 2008068819 A SG2008068819 A SG 2008068819A SG 152974 A1 SG152974 A1 SG 152974A1
Authority
SG
Singapore
Prior art keywords
wafer
carrier
wafer carrier
hole
dlc
Prior art date
Application number
SG200806881-9A
Other languages
English (en)
Inventor
Chan-Yong Lee
Original Assignee
Siltron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltron Inc filed Critical Siltron Inc
Publication of SG152974A1 publication Critical patent/SG152974A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y10T29/49982—Coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
SG200806881-9A 2007-11-29 2008-09-17 Method of manufacturing wafer carrier SG152974A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070122655A KR100898821B1 (ko) 2007-11-29 2007-11-29 웨이퍼 캐리어의 제조방법

Publications (1)

Publication Number Publication Date
SG152974A1 true SG152974A1 (en) 2009-06-29

Family

ID=40373423

Family Applications (2)

Application Number Title Priority Date Filing Date
SG2011039096A SG173996A1 (en) 2007-11-29 2008-09-17 Method of manufacturing wafer carrier
SG200806881-9A SG152974A1 (en) 2007-11-29 2008-09-17 Method of manufacturing wafer carrier

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG2011039096A SG173996A1 (en) 2007-11-29 2008-09-17 Method of manufacturing wafer carrier

Country Status (6)

Country Link
US (1) US20090139077A1 (ko)
EP (1) EP2065131B1 (ko)
JP (1) JP2009135424A (ko)
KR (1) KR100898821B1 (ko)
CN (1) CN101444899A (ko)
SG (2) SG173996A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101043983B1 (ko) * 2010-09-01 2011-06-24 박광진 수지재 캐리어 및 그 제조방법
DE102011003008B4 (de) * 2011-01-21 2018-07-12 Siltronic Ag Führungskäfig und Verfahren zur gleichzeitig beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
JP5741157B2 (ja) * 2011-04-07 2015-07-01 旭硝子株式会社 研磨用キャリア及び該キャリアを用いたガラス基板の研磨方法及びガラス基板の製造方法
TWI425230B (zh) * 2011-10-25 2014-02-01 Chroma Ate Inc Touchpad detection machine
DE102012214998B4 (de) 2012-08-23 2014-07-24 Siltronic Ag Verfahren zum beidseitigen Bearbeiten einer Halbleiterscheibe
JP6056793B2 (ja) 2014-03-14 2017-01-11 信越半導体株式会社 両面研磨装置用キャリアの製造方法及び両面研磨方法
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
JP2018136239A (ja) * 2017-02-23 2018-08-30 セイコーエプソン株式会社 電子部品搬送装置及び電子部品検査装置
JP2021102245A (ja) * 2019-12-25 2021-07-15 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731046A (en) * 1994-01-18 1998-03-24 Qqc, Inc. Fabrication of diamond and diamond-like carbon coatings
JP3379097B2 (ja) * 1995-11-27 2003-02-17 信越半導体株式会社 両面研磨装置及び方法
JPH1110530A (ja) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd 両面研磨用キャリア
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7004827B1 (en) * 2004-02-12 2006-02-28 Komag, Inc. Method and apparatus for polishing a workpiece
JP4113509B2 (ja) * 2004-03-09 2008-07-09 スピードファム株式会社 被研磨物保持用キャリア
JPWO2006001340A1 (ja) 2004-06-23 2008-04-17 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 両面研磨用キャリアおよびその製造方法
US20080166952A1 (en) * 2005-02-25 2008-07-10 Shin-Etsu Handotai Co., Ltd Carrier For Double-Side Polishing Apparatus, Double-Side Polishing Apparatus And Double-Side Polishing Method Using The Same
EP1852900B1 (en) * 2005-02-25 2011-09-21 Shin-Etsu Handotai Co., Ltd. Carrier for double side polishing machine and double side polishing machine employing it, and double side polishing method
JP2006303136A (ja) * 2005-04-20 2006-11-02 Shin Etsu Handotai Co Ltd 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
CA2623241A1 (en) 2005-04-21 2006-11-02 Celerus Diagnostics, Inc. Parallel processing fluidic method and apparatus for automated rapid immunohistochemistry
DE102005034119B3 (de) * 2005-07-21 2006-12-07 Siltronic Ag Verfahren zum Bearbeiten einer Halbleiterscheibe, die in einer Aussparung einer Läuferscheibe geführt wird
JP3974632B1 (ja) 2006-04-05 2007-09-12 株式会社白崎製作所 Ｄｌｃコーティングウエハホルダ、およびｄｌｃコーティングウエハホルダの製造方法。
JP2007301713A (ja) 2006-04-10 2007-11-22 Kemet Japan Co Ltd 研磨治具
DE102007049811B4 (de) * 2007-10-17 2016-07-28 Peter Wolters Gmbh Läuferscheibe, Verfahren zur Beschichtung einer Läuferscheibe sowie Verfahren zur gleichzeitigen beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben
JP4605233B2 (ja) * 2008-02-27 2011-01-05 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP5452984B2 (ja) * 2009-06-03 2014-03-26 不二越機械工業株式会社 ウェーハの両面研磨方法

Also Published As

Publication number Publication date
KR100898821B1 (ko) 2009-05-22
EP2065131A1 (en) 2009-06-03
JP2009135424A (ja) 2009-06-18
CN101444899A (zh) 2009-06-03
EP2065131B1 (en) 2012-10-10
US20090139077A1 (en) 2009-06-04
SG173996A1 (en) 2011-09-29

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