TW200633114A - Chucking system for nano-manufacturing - Google Patents

Chucking system for nano-manufacturing

Info

Publication number
TW200633114A
TW200633114A TW095102091A TW95102091A TW200633114A TW 200633114 A TW200633114 A TW 200633114A TW 095102091 A TW095102091 A TW 095102091A TW 95102091 A TW95102091 A TW 95102091A TW 200633114 A TW200633114 A TW 200633114A
Authority
TW
Taiwan
Prior art keywords
nano
manufacturing
chucking system
land
protrusions
Prior art date
Application number
TW095102091A
Other languages
Chinese (zh)
Other versions
TWI291212B (en
Inventor
Daniel A Babbs
Byung-Jin Choi
Anshuman Cherala
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,499 external-priority patent/US7636999B2/en
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200633114A publication Critical patent/TW200633114A/en
Application granted granted Critical
Publication of TWI291212B publication Critical patent/TWI291212B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.
TW95102091A 2005-01-31 2006-01-19 Chucking system for nano-manufacturing TWI291212B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate

Publications (2)

Publication Number Publication Date
TW200633114A true TW200633114A (en) 2006-09-16
TWI291212B TWI291212B (en) 2007-12-11

Family

ID=36777728

Family Applications (2)

Application Number Title Priority Date Filing Date
TW95102091A TWI291212B (en) 2005-01-31 2006-01-19 Chucking system for nano-manufacturing
TW95102094A TWI277504B (en) 2005-01-31 2006-01-19 Method of separating a mold from a solidified layer disposed on a substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW95102094A TWI277504B (en) 2005-01-31 2006-01-19 Method of separating a mold from a solidified layer disposed on a substrate

Country Status (4)

Country Link
EP (1) EP1843884A4 (en)
KR (1) KR101254042B1 (en)
TW (2) TWI291212B (en)
WO (3) WO2006083519A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773729B2 (en) 2005-02-28 2011-09-14 キヤノン株式会社 Transfer apparatus and device manufacturing method
JP5069979B2 (en) * 2007-09-03 2012-11-07 東芝機械株式会社 Release device, supply / discharge system, and release method
WO2010005032A1 (en) * 2008-07-09 2010-01-14 東洋合成工業株式会社 Pattern-forming method
JP5438578B2 (en) * 2010-03-29 2014-03-12 富士フイルム株式会社 Method and apparatus for forming fine uneven pattern
JP4774125B2 (en) * 2010-10-04 2011-09-14 キヤノン株式会社 Transfer apparatus, mold, and device manufacturing method
JP6333031B2 (en) * 2014-04-09 2018-05-30 キヤノン株式会社 Imprint apparatus and article manufacturing method
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP6659104B2 (en) * 2014-11-11 2020-03-04 キヤノン株式会社 Imprint method, imprint apparatus, mold, and article manufacturing method
JP7284639B2 (en) 2019-06-07 2023-05-31 キヤノン株式会社 Molding apparatus and article manufacturing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110341C2 (en) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Method and apparatus for aligning a thin substrate in the image plane of a copier
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
JPH06244269A (en) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp Semiconductor manufacturing apparatus, wafer vacuum chuck device thereof, and gas cleaning and nitride film formation therefor
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
AU1507200A (en) * 1999-12-01 2001-06-12 Nokia Corporation Providing gateway functionality in a virtual private network
SG142150A1 (en) * 2000-07-16 2008-05-28 Univ Texas High-resolution overlay alignment systems for imprint lithography
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
WO2003099463A2 (en) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US6879191B2 (en) * 2003-08-26 2005-04-12 Intel Corporation Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

Also Published As

Publication number Publication date
WO2006083520A2 (en) 2006-08-10
WO2006083519A2 (en) 2006-08-10
WO2006083518A3 (en) 2007-03-29
WO2006083520A3 (en) 2009-05-14
WO2006083519A3 (en) 2009-04-23
EP1843884A4 (en) 2008-12-17
TW200633846A (en) 2006-10-01
KR101254042B1 (en) 2013-04-12
EP1843884A2 (en) 2007-10-17
WO2006083518A2 (en) 2006-08-10
TWI277504B (en) 2007-04-01
TWI291212B (en) 2007-12-11
KR20070102723A (en) 2007-10-19

Similar Documents

Publication Publication Date Title
SG159498A1 (en) Chucking system for nano-manufacturing
TW200633114A (en) Chucking system for nano-manufacturing
TW200706689A (en) Gas providing member and processing device
PL1838230T3 (en) Angularly stable device for mutually fixing a longitudinal carrier to a bone fixing element
CA113465S (en) Showerhead
CA112672S (en) Cable connector
CA121815S (en) Attachable lighting device
TW200420245A (en) Cord stopper
CA118276S (en) Yagi antenna
ATE533947T1 (en) INSTALLATION EQUIPMENT AND INSTALLATION PROCEDURES
CA115145S (en) Ink cartridge
TW200702568A (en) Fastener receptacle
CA113930S (en) Covered casserole
CA115124S (en) Ink cartridge
CA117351S (en) Iron
CA113809S (en) Engine assembly
CA113484S (en) Showerhead
TW200641581A (en) Wireless mouse adapted to receive a wireless receiver therein
CA111845S (en) Guitar body
CA115699S (en) Overflow pipe
TW200719744A (en) Communication device
TW200628798A (en) Testing probe
CA114997S (en) Faucet
CA114499S (en) Stapler
CA117235S (en) Wireless receiver with integrated headphones

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees