TW200633114A - Chucking system for nano-manufacturing - Google Patents

Chucking system for nano-manufacturing

Info

Publication number
TW200633114A
TW200633114A TW095102091A TW95102091A TW200633114A TW 200633114 A TW200633114 A TW 200633114A TW 095102091 A TW095102091 A TW 095102091A TW 95102091 A TW95102091 A TW 95102091A TW 200633114 A TW200633114 A TW 200633114A
Authority
TW
Taiwan
Prior art keywords
nano
manufacturing
chucking system
land
protrusions
Prior art date
Application number
TW095102091A
Other languages
Chinese (zh)
Other versions
TWI291212B (en
Inventor
Daniel A Babbs
Byung-Jin Choi
Anshuman Cherala
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,499 external-priority patent/US7636999B2/en
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of TW200633114A publication Critical patent/TW200633114A/en
Application granted granted Critical
Publication of TWI291212B publication Critical patent/TWI291212B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Abstract

The present invention is directed towards a chucking system, including, inter alia, a body having a surface with a pin extending therefrom having a throughway defined therein, and a land surrounding the protrusions defining a channel between the pin and the land. In a further embodiment, the body comprises a plurality of protrusions.
TW95102091A 2005-01-31 2006-01-19 Chucking system for nano-manufacturing TWI291212B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate

Publications (2)

Publication Number Publication Date
TW200633114A true TW200633114A (en) 2006-09-16
TWI291212B TWI291212B (en) 2007-12-11

Family

ID=36777728

Family Applications (2)

Application Number Title Priority Date Filing Date
TW95102091A TWI291212B (en) 2005-01-31 2006-01-19 Chucking system for nano-manufacturing
TW95102094A TWI277504B (en) 2005-01-31 2006-01-19 Method of separating a mold from a solidified layer disposed on a substrate

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW95102094A TWI277504B (en) 2005-01-31 2006-01-19 Method of separating a mold from a solidified layer disposed on a substrate

Country Status (4)

Country Link
EP (1) EP1843884A4 (en)
KR (1) KR101254042B1 (en)
TW (2) TWI291212B (en)
WO (3) WO2006083520A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773729B2 (en) * 2005-02-28 2011-09-14 キヤノン株式会社 Transfer apparatus and device manufacturing method
JP5069979B2 (en) * 2007-09-03 2012-11-07 東芝機械株式会社 Release device, supply / discharge system, and release method
WO2010005032A1 (en) * 2008-07-09 2010-01-14 東洋合成工業株式会社 Pattern-forming method
JP5438578B2 (en) * 2010-03-29 2014-03-12 富士フイルム株式会社 Method and apparatus for forming fine uneven pattern
JP4774125B2 (en) * 2010-10-04 2011-09-14 キヤノン株式会社 Transfer apparatus, mold, and device manufacturing method
JP6333031B2 (en) * 2014-04-09 2018-05-30 キヤノン株式会社 Imprint apparatus and article manufacturing method
JP6659104B2 (en) * 2014-11-11 2020-03-04 キヤノン株式会社 Imprint method, imprint apparatus, mold, and article manufacturing method
US10620532B2 (en) * 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP7284639B2 (en) 2019-06-07 2023-05-31 キヤノン株式会社 Molding apparatus and article manufacturing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110341C2 (en) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Method and apparatus for aligning a thin substrate in the image plane of a copier
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
JPH06244269A (en) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp Semiconductor manufacturing apparatus, wafer vacuum chuck device thereof, and gas cleaning and nitride film formation therefor
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6809802B1 (en) * 1999-08-19 2004-10-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
AU1507200A (en) * 1999-12-01 2001-06-12 Nokia Corporation Providing gateway functionality in a virtual private network
EP2264522A3 (en) * 2000-07-16 2011-12-14 The Board of Regents of The University of Texas System Method of forming a pattern on a substrate
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
AU2003232962A1 (en) * 2002-05-27 2003-12-12 Koninklijke Philips Electronics N.V. Method and device for transferring a pattern from a stamp to a substrate
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US6879191B2 (en) * 2003-08-26 2005-04-12 Intel Corporation Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

Also Published As

Publication number Publication date
EP1843884A4 (en) 2008-12-17
KR20070102723A (en) 2007-10-19
WO2006083519A2 (en) 2006-08-10
EP1843884A2 (en) 2007-10-17
WO2006083520A3 (en) 2009-05-14
WO2006083520A2 (en) 2006-08-10
KR101254042B1 (en) 2013-04-12
TWI277504B (en) 2007-04-01
TWI291212B (en) 2007-12-11
WO2006083518A3 (en) 2007-03-29
WO2006083518A2 (en) 2006-08-10
TW200633846A (en) 2006-10-01
WO2006083519A3 (en) 2009-04-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees