JPS5741164A - Dual carrier for lapping - Google Patents

Dual carrier for lapping

Info

Publication number
JPS5741164A
JPS5741164A JP55110753A JP11075380A JPS5741164A JP S5741164 A JPS5741164 A JP S5741164A JP 55110753 A JP55110753 A JP 55110753A JP 11075380 A JP11075380 A JP 11075380A JP S5741164 A JPS5741164 A JP S5741164A
Authority
JP
Japan
Prior art keywords
carrier
lapping
bluesteel
carriers
precision
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55110753A
Other languages
Japanese (ja)
Inventor
Katsura Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Holdings Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Holdings Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Holdings Co Ltd
Priority to JP55110753A priority Critical patent/JPS5741164A/en
Publication of JPS5741164A publication Critical patent/JPS5741164A/en
Pending legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To prevent works from being scratched, by rotating polygonal fragile material, such as for example thin quartz plate, freely, in an inner carrier of a dual carrier for lapping so as to make possible to perform the lapping of the works with an ultrahigh degree of precision. CONSTITUTION:Inner carriers 2 made of plastic material or soft metal material are incorporated in a carrier 1 made of bluesteel having a strength and a hardness which are sufficient for withstanding lapping. The shape of a recess in the inner carrier 2 is square corresponding to the external form of a work, and the external shape of the inner carrier 2 itself is round so as to make possible to freely rotate, readily in the bluesteel carrier 1 which holds the inner carriers 2 with 0.01-0.20mm. clearance therebetween, thereby the inner carriers 2 can be smoothly rotated when the bluesteel carrier 1 is made planetary motion during the lapping. Thus, A high degree of precision in the thickness of the work can be maintained under the lapping.
JP55110753A 1980-08-12 1980-08-12 Dual carrier for lapping Pending JPS5741164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55110753A JPS5741164A (en) 1980-08-12 1980-08-12 Dual carrier for lapping

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55110753A JPS5741164A (en) 1980-08-12 1980-08-12 Dual carrier for lapping

Publications (1)

Publication Number Publication Date
JPS5741164A true JPS5741164A (en) 1982-03-08

Family

ID=14543682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55110753A Pending JPS5741164A (en) 1980-08-12 1980-08-12 Dual carrier for lapping

Country Status (1)

Country Link
JP (1) JPS5741164A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201756A (en) * 1983-04-25 1984-11-15 Matsushima Kogyo Co Ltd Polishing carrier
JPS60249568A (en) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd Polishing of semiconductor wafer
JPS6224964A (en) * 1985-07-12 1987-02-02 ワツカ−・ケミトロニク・ゲゼルシヤフト・フユア・エレクトロニク・グルントシユトツフエ・ミツト・ベシユレンクテル・ハフツング Double polishing working method of discoid type workpiece and discoid carrier
DE102007049811A1 (en) 2007-10-17 2009-04-23 Siltronic Ag Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers
JP2009194631A (en) * 2008-02-14 2009-08-27 Seiko Instruments Inc Wafer, wafer polishing device, method of polishing wafer, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic equipment, and radio clock
DE102009047927A1 (en) 2009-10-01 2011-01-27 Siltronic Ag Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating
DE102012206398A1 (en) 2012-04-18 2012-06-21 Siltronic Ag Method for performing two-sided planarization of semiconductor material e.g. wafer, involves providing the insert inside recesses in rotary disc, while supplying the polishing agent in the recess
DE102011080323A1 (en) 2011-08-03 2013-02-07 Siltronic Ag Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring
DE102012218745A1 (en) 2012-10-15 2014-04-17 Siltronic Ag Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51113294A (en) * 1975-03-31 1976-10-06 Citizen Watch Co Ltd Carrier for lapping wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51113294A (en) * 1975-03-31 1976-10-06 Citizen Watch Co Ltd Carrier for lapping wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201756A (en) * 1983-04-25 1984-11-15 Matsushima Kogyo Co Ltd Polishing carrier
JPS60249568A (en) * 1984-05-21 1985-12-10 Sumitomo Electric Ind Ltd Polishing of semiconductor wafer
JPS6224964A (en) * 1985-07-12 1987-02-02 ワツカ−・ケミトロニク・ゲゼルシヤフト・フユア・エレクトロニク・グルントシユトツフエ・ミツト・ベシユレンクテル・ハフツング Double polishing working method of discoid type workpiece and discoid carrier
DE102007049811A1 (en) 2007-10-17 2009-04-23 Siltronic Ag Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers
DE102007049811B4 (en) * 2007-10-17 2016-07-28 Peter Wolters Gmbh Rotor disc, method for coating a rotor disc and method for the simultaneous double-sided material removing machining of semiconductor wafers
US9539695B2 (en) 2007-10-17 2017-01-10 Siltronic Ag Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
JP2009194631A (en) * 2008-02-14 2009-08-27 Seiko Instruments Inc Wafer, wafer polishing device, method of polishing wafer, method of manufacturing piezoelectric vibrator, piezoelectric vibrator, oscillator, electronic equipment, and radio clock
DE102009047927A1 (en) 2009-10-01 2011-01-27 Siltronic Ag Rotor disk for supporting one or multiple disks for conditioning polishing cloth in polishing machine, has core made of material, which have high rigidity and core is fully and partially provided with coating
DE102011080323A1 (en) 2011-08-03 2013-02-07 Siltronic Ag Method for simultaneously abrasive processing e.g. front surface of single crystalline silicon wafer in semiconductor industry, involves locating wafer and ring in recess of rotor disk such that edge of recess of disk guides wafer and ring
DE102012206398A1 (en) 2012-04-18 2012-06-21 Siltronic Ag Method for performing two-sided planarization of semiconductor material e.g. wafer, involves providing the insert inside recesses in rotary disc, while supplying the polishing agent in the recess
DE102012218745A1 (en) 2012-10-15 2014-04-17 Siltronic Ag Method for simultaneous two-sided material-removing machining of surfaces of disc of e.g. semiconductor wafer, involves conducting disc of semiconductor material during co-material-machining of surfaces of recess in rotor disc

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