SG11202001464XA - Three dimensional memory arrays - Google Patents
Three dimensional memory arraysInfo
- Publication number
- SG11202001464XA SG11202001464XA SG11202001464XA SG11202001464XA SG11202001464XA SG 11202001464X A SG11202001464X A SG 11202001464XA SG 11202001464X A SG11202001464X A SG 11202001464XA SG 11202001464X A SG11202001464X A SG 11202001464XA SG 11202001464X A SG11202001464X A SG 11202001464XA
- Authority
- SG
- Singapore
- Prior art keywords
- memory arrays
- dimensional memory
- dimensional
- arrays
- memory
- Prior art date
Links
- 238000003491 array Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/84—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays
- H10B63/845—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays arranged in a direction perpendicular to the substrate, e.g. 3D cell arrays the switching components being connected to a common vertical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0688—Integrated circuits having a three-dimensional layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/883—Oxides or nitrides
- H10N70/8836—Complex metal oxides, e.g. perovskites, spinels
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/689,155 US10461125B2 (en) | 2017-08-29 | 2017-08-29 | Three dimensional memory arrays |
PCT/US2018/047143 WO2019046030A1 (en) | 2017-08-29 | 2018-08-21 | THREE DIMENSIONAL MEMORY NETWORKS |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001464XA true SG11202001464XA (en) | 2020-03-30 |
Family
ID=65436141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001464XA SG11202001464XA (en) | 2017-08-29 | 2018-08-21 | Three dimensional memory arrays |
Country Status (8)
Country | Link |
---|---|
US (3) | US10461125B2 (zh) |
EP (1) | EP3676871B1 (zh) |
JP (1) | JP7038198B2 (zh) |
KR (1) | KR102233131B1 (zh) |
CN (1) | CN111052376B (zh) |
SG (1) | SG11202001464XA (zh) |
TW (1) | TWI686931B (zh) |
WO (1) | WO2019046030A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2019192321A (ja) * | 2018-04-25 | 2019-10-31 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US11244855B2 (en) * | 2019-05-03 | 2022-02-08 | Micron Technology, Inc. | Architecture of three-dimensional memory device and methods regarding the same |
US11244953B2 (en) | 2020-02-26 | 2022-02-08 | Sandisk Technologies Llc | Three-dimensional memory device including molybdenum word lines and metal oxide spacers and method of making the same |
US11569260B2 (en) | 2020-02-26 | 2023-01-31 | Sandisk Technologies Llc | Three-dimensional memory device including discrete memory elements and method of making the same |
JP2021150346A (ja) * | 2020-03-16 | 2021-09-27 | キオクシア株式会社 | 半導体記憶装置 |
US11355554B2 (en) | 2020-05-08 | 2022-06-07 | Micron Technology, Inc. | Sense lines in three-dimensional memory arrays, and methods of forming the same |
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KR102190350B1 (ko) * | 2014-05-02 | 2020-12-11 | 삼성전자주식회사 | 반도체 메모리 장치 및 그 제조 방법 |
JP5843931B2 (ja) * | 2014-09-09 | 2016-01-13 | 株式会社東芝 | 不揮発性半導体記憶装置 |
TW201624623A (zh) * | 2014-12-25 | 2016-07-01 | 力晶科技股份有限公司 | 非揮發性記憶體及其製造方法 |
KR102435524B1 (ko) * | 2015-10-21 | 2022-08-23 | 삼성전자주식회사 | 반도체 메모리 장치 |
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CN106847820B (zh) * | 2017-03-07 | 2018-10-16 | 长江存储科技有限责任公司 | 一种三维存储器及其制作方法 |
-
2017
- 2017-08-29 US US15/689,155 patent/US10461125B2/en active Active
-
2018
- 2018-08-21 KR KR1020207006114A patent/KR102233131B1/ko active IP Right Grant
- 2018-08-21 WO PCT/US2018/047143 patent/WO2019046030A1/en unknown
- 2018-08-21 EP EP18852517.4A patent/EP3676871B1/en active Active
- 2018-08-21 SG SG11202001464XA patent/SG11202001464XA/en unknown
- 2018-08-21 JP JP2020511793A patent/JP7038198B2/ja active Active
- 2018-08-21 CN CN201880055601.9A patent/CN111052376B/zh active Active
- 2018-08-28 TW TW107129879A patent/TWI686931B/zh active
-
2019
- 2019-08-26 US US16/550,532 patent/US10937829B2/en active Active
-
2021
- 2021-02-26 US US17/187,213 patent/US11765912B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20190067371A1 (en) | 2019-02-28 |
CN111052376B (zh) | 2023-08-08 |
US10937829B2 (en) | 2021-03-02 |
KR20200028032A (ko) | 2020-03-13 |
EP3676871A4 (en) | 2021-05-19 |
WO2019046030A1 (en) | 2019-03-07 |
JP7038198B2 (ja) | 2022-03-17 |
EP3676871A1 (en) | 2020-07-08 |
EP3676871B1 (en) | 2024-04-17 |
US10461125B2 (en) | 2019-10-29 |
CN111052376A (zh) | 2020-04-21 |
US11765912B2 (en) | 2023-09-19 |
JP2020532863A (ja) | 2020-11-12 |
US20210183947A1 (en) | 2021-06-17 |
TW201921651A (zh) | 2019-06-01 |
US20190378877A1 (en) | 2019-12-12 |
KR102233131B1 (ko) | 2021-03-30 |
TWI686931B (zh) | 2020-03-01 |
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