SG11201500481RA - Resin composition - Google Patents

Resin composition

Info

Publication number
SG11201500481RA
SG11201500481RA SG11201500481RA SG11201500481RA SG11201500481RA SG 11201500481R A SG11201500481R A SG 11201500481RA SG 11201500481R A SG11201500481R A SG 11201500481RA SG 11201500481R A SG11201500481R A SG 11201500481RA SG 11201500481R A SG11201500481R A SG 11201500481RA
Authority
SG
Singapore
Prior art keywords
resin composition
resin
composition
Prior art date
Application number
SG11201500481RA
Other languages
English (en)
Inventor
Takako Hoshino
Yoshitsugu Goto
Kimihiko Yoda
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of SG11201500481RA publication Critical patent/SG11201500481RA/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/34—Epoxy compounds containing three or more epoxy groups obtained by epoxidation of an unsaturated polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/159—Heterocyclic compounds having oxygen in the ring having more than two oxygen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/422—Luminescent, fluorescent, phosphorescent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/22—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the initiator used in polymerisation
    • C08G2650/24—Polymeric initiators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Electroluminescent Light Sources (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)
SG11201500481RA 2012-07-26 2013-07-24 Resin composition SG11201500481RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012165431 2012-07-26
PCT/JP2013/070013 WO2014017524A1 (ja) 2012-07-26 2013-07-24 樹脂組成物

Publications (1)

Publication Number Publication Date
SG11201500481RA true SG11201500481RA (en) 2015-04-29

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201500481RA SG11201500481RA (en) 2012-07-26 2013-07-24 Resin composition
SG10201706103VA SG10201706103VA (en) 2012-07-26 2013-07-24 Resin composition

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201706103VA SG10201706103VA (en) 2012-07-26 2013-07-24 Resin composition

Country Status (8)

Country Link
US (1) US10273389B2 (zh)
EP (1) EP2878611A4 (zh)
JP (3) JPWO2014017524A1 (zh)
KR (2) KR102091871B1 (zh)
CN (1) CN104487474B (zh)
SG (2) SG11201500481RA (zh)
TW (1) TWI637974B (zh)
WO (1) WO2014017524A1 (zh)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物
JP6163043B2 (ja) * 2013-08-08 2017-07-12 株式会社Adeka エネルギー線感受性組成物
JP6560985B2 (ja) * 2014-01-23 2019-08-14 デンカ株式会社 樹脂組成物
CN105940767B (zh) * 2014-05-20 2018-02-09 积水化学工业株式会社 有机电致发光显示元件用密封剂
JP2016050230A (ja) * 2014-08-29 2016-04-11 日東電工株式会社 光学用感光性樹脂組成物およびそれを用いた光学材料
JP6378985B2 (ja) * 2014-09-10 2018-08-22 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
KR102040469B1 (ko) * 2015-06-09 2019-11-05 주식회사 엘지화학 유기전자장치
CN107849414B (zh) 2015-06-09 2020-06-05 株式会社Lg化学 粘合剂组合物、包含其的粘合膜和包含其的有机电子器件
CN107852790B (zh) * 2015-11-19 2020-05-12 积水化学工业株式会社 有机电致发光显示元件用密封剂
JP6804023B2 (ja) * 2016-02-10 2020-12-23 日東電工株式会社 光学用感光性樹脂組成物およびそれを用いた光学材料
KR102392860B1 (ko) * 2016-10-19 2022-04-29 세키스이가가쿠 고교가부시키가이샤 유기 el 표시 소자용 봉지제
CN109076660B (zh) * 2016-10-19 2021-10-29 积水化学工业株式会社 有机el显示元件用密封剂
CN114621634B (zh) * 2016-12-09 2023-07-14 株式会社Lg化学 封装组合物、包括该组合物的有机电子器件及其制造方法
JP7065396B2 (ja) * 2017-03-08 2022-05-12 パナソニックＩｐマネジメント株式会社 紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
MY198033A (en) * 2017-03-31 2023-07-27 Resonac Corp Epoxy resin composition, curable resin composition and electronic component device
WO2018199705A1 (ko) * 2017-04-28 2018-11-01 주식회사 엘지화학 밀봉재 조성물
KR101891737B1 (ko) * 2017-04-28 2018-09-28 주식회사 엘지화학 밀봉재 조성물
TWI800534B (zh) * 2017-09-29 2023-05-01 南韓商Ｌｇ化學股份有限公司 用於封裝有機電子元件之方法
JP6979326B2 (ja) * 2017-10-20 2021-12-15 日本化薬株式会社 樹脂組成物及び電子部品用接着剤
KR20200115573A (ko) * 2018-01-26 2020-10-07 아지노모토 가부시키가이샤 밀봉용 경화성 수지 조성물
CN108485183B (zh) * 2018-02-11 2020-11-24 东莞爱的合成材料科技有限公司 一种可用于临床医学的高韧性透明光敏树脂及其制备方法
KR20210104644A (ko) * 2018-12-18 2021-08-25 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 경화물, 및 유기 el 표시 소자
WO2020129794A1 (ja) * 2018-12-18 2020-06-25 積水化学工業株式会社 硬化性樹脂組成物、硬化物、及び、有機ｅｌ表示素子
JP2020100796A (ja) * 2018-12-25 2020-07-02 株式会社Adeka 組成物、それを用いた接着剤、その硬化物および硬化物の製造方法
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JPWO2020149362A1 (ja) * 2019-01-18 2021-11-25 積水化学工業株式会社 硬化物及び有機ｅｌ表示素子
KR20210116426A (ko) * 2019-01-18 2021-09-27 세키스이가가쿠 고교가부시키가이샤 경화물 및 유기 el 표시 소자
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JP2019206717A (ja) * 2019-08-08 2019-12-05 三井化学株式会社 画像表示装置封止材
DE102019006820A1 (de) * 2019-09-30 2021-04-01 Daimler Ag Verfahren zum Verkleben von Komponenten einer Brennstoffzelle
US20230107203A1 (en) * 2020-02-21 2023-04-06 Dow Toray Co., Ltd Solventless photocurable liquid composition, cured product thereof, optical filler containing same, and display device including layer comprising said cured product
JPWO2021201013A1 (zh) 2020-04-01 2021-10-07
CN115698095B (zh) * 2020-05-29 2024-04-02 电化株式会社 感光性组合物、其固化物、有机电致发光显示装置及感光性组合物的制造方法
WO2021248077A1 (en) * 2020-06-05 2021-12-09 Archer Daniels Midland Company Process for sulfonation of 2-aminoethanol hydrogen sulfate ester to produce taurine

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1118433A (en) 1977-06-30 1982-02-16 Robert H. Siegmann Preparation of polyglycidyl ethers of polyhydric phenols
US4401537A (en) * 1978-12-26 1983-08-30 Minnesota Mining And Manufacturing Company Liquid crystal display and photopolymerizable sealant therefor
JPS58189223A (ja) 1982-04-28 1983-11-04 Sumitomo Chem Co Ltd エポキシ樹脂の製造方法
JPH0759616B2 (ja) 1987-04-10 1995-06-28 住友化学工業株式会社 エポキシ樹脂の製造方法
JPH1074583A (ja) 1996-08-30 1998-03-17 Sanyo Electric Co Ltd 有機ｅｌディスプレイ及び有機ｅｌディスプレイの 製造方法
JPH10173336A (ja) 1996-12-06 1998-06-26 Sumitomo Bakelite Co Ltd 感光性アディティブ接着剤組成物
JPH11224771A (ja) * 1998-02-05 1999-08-17 Matsushita Electric Ind Co Ltd 有機エレクトロルミネッセンス素子
KR100461474B1 (ko) * 1998-12-28 2004-12-16 이데미쓰 고산 가부시키가이샤 유기 전기발광 소자
DE19943149A1 (de) * 1999-09-09 2001-04-05 Siemens Ag Verfahren zur Verkapselung von Bauelementen
SG98433A1 (en) 1999-12-21 2003-09-19 Ciba Sc Holding Ag Iodonium salts as latent acid donors
KR20100080632A (ko) * 2002-06-17 2010-07-09 세키스이가가쿠 고교가부시키가이샤 유기 전계 발광 소자의 밀봉 방법
JP2004035862A (ja) * 2002-07-08 2004-02-05 Polyplastics Co 環状アセタール化合物含有光硬化性樹脂組成物及び硬化物
JP2004061925A (ja) 2002-07-30 2004-02-26 Nippon Kayaku Co Ltd 液晶シール剤およびそれを用いた液晶表示セル
JPWO2005061583A1 (ja) * 2003-12-22 2007-07-12 三井化学株式会社 カチオン重合性樹脂組成物
WO2005084083A1 (ja) * 2004-03-02 2005-09-09 Idemitsu Kosan Co., Ltd. 有機エレクトロルミネッセンス素子
JP2005302401A (ja) * 2004-04-08 2005-10-27 Three Bond Co Ltd 有機ｅｌ素子封止材
JP2005336314A (ja) 2004-05-26 2005-12-08 Sekisui Chem Co Ltd 光硬化性樹脂組成物
JP2006063261A (ja) * 2004-08-30 2006-03-09 Asahi Kasei Chemicals Corp 感光性組成物
JP4656290B2 (ja) * 2004-09-02 2011-03-23 株式会社スリーボンド 光硬化性組成物
JP4780275B2 (ja) 2004-09-06 2011-09-28 株式会社スリーボンド 有機ｅｌ素子封止材
JP4452683B2 (ja) * 2005-01-26 2010-04-21 積水化学工業株式会社 有機エレクトロルミネッセンス素子用封止剤、有機エレクトロルミネッセンス表示装置の製造方法、及び、有機エレクトロルミネッセンス表示装置
JP2006225545A (ja) * 2005-02-18 2006-08-31 Yokohama Rubber Co Ltd:The 硬化性樹脂組成物
JP4786663B2 (ja) * 2005-10-03 2011-10-05 三井化学株式会社 フラットパネルディスプレイ用シール材
JP5288150B2 (ja) * 2005-10-24 2013-09-11 株式会社スリーボンド 有機ｅｌ素子封止用熱硬化型組成物
JP2008059868A (ja) 2006-08-30 2008-03-13 Seiko Epson Corp 有機エレクトロルミネッセンス装置とその製造方法及び電子機器
JP2008059945A (ja) 2006-08-31 2008-03-13 Nagase Chemtex Corp 電子デバイスの製造方法
KR101435410B1 (ko) 2006-10-24 2014-08-29 시바 홀딩 인크 열 안정성 양이온 광경화성 조성물
JP2008115338A (ja) * 2006-11-07 2008-05-22 Shin Etsu Chem Co Ltd 熱硬化及び紫外線硬化型エポキシ樹脂組成物およびその硬化物からなるシール材
JP2009047879A (ja) * 2007-08-20 2009-03-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、電子機器
JP2009249569A (ja) * 2008-04-09 2009-10-29 Japan Epoxy Resin Kk 光学素子封止材用エポキシ樹脂組成物
JP2009259656A (ja) 2008-04-18 2009-11-05 Toyo Ink Mfg Co Ltd 封止剤
JP2009286954A (ja) 2008-05-30 2009-12-10 Fujifilm Corp 光硬化性組成物およびインク組成物
JP2010018797A (ja) * 2008-06-11 2010-01-28 Sekisui Chem Co Ltd 光学部品用硬化性組成物、光学部品用接着剤及び有機エレクトロルミネッセンス素子用封止剤
JP4991648B2 (ja) * 2008-06-30 2012-08-01 積水化学工業株式会社 有機エレクトロルミネッセンス素子封止剤
JP5153498B2 (ja) 2008-07-22 2013-02-27 電気化学工業株式会社 樹脂組成物
JP5201347B2 (ja) * 2008-11-28 2013-06-05 株式会社スリーボンド 有機ｅｌ素子封止用光硬化性樹脂組成物
JP2010163566A (ja) 2009-01-16 2010-07-29 Three M Innovative Properties Co エポキシ樹脂組成物
JP5498832B2 (ja) 2009-03-25 2014-05-21 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
CN102640564B (zh) 2009-09-04 2016-01-20 三键精密化学有限公司 有机el元件密封部件
JP5069731B2 (ja) * 2009-09-17 2012-11-07 パナソニック株式会社 カチオン硬化性樹脂組成物、回路装置及びその製造方法
JP2011111598A (ja) 2009-11-30 2011-06-09 Sekisui Chem Co Ltd タッチパネル用光硬化性樹脂組成物及びタッチパネル
WO2011104997A1 (ja) * 2010-02-23 2011-09-01 Jsr株式会社 有機ｅｌ素子、有機ｅｌ表示装置、有機ｅｌ照明装置及びシール剤用硬化性組成物
JP5543879B2 (ja) * 2010-09-02 2014-07-09 旭化成イーマテリアルズ株式会社 エポキシ樹脂用硬化剤組成物及び一液性エポキシ樹脂組成物
WO2012039051A1 (ja) * 2010-09-24 2012-03-29 電気化学工業株式会社 エネルギー線硬化性樹脂組成物とそれを用いた接着剤及び硬化体
JP5229510B2 (ja) * 2010-10-21 2013-07-03 山栄化学株式会社 カチオン重合性樹脂組成物
JP6014325B2 (ja) 2010-12-28 2016-10-25 積水化学工業株式会社 有機エレクトロルミネッセンス表示素子用封止剤
JPWO2012165448A1 (ja) * 2011-06-01 2015-02-23 日本ゼオン株式会社 樹脂組成物および半導体素子基板
WO2012176472A1 (ja) * 2011-06-23 2012-12-27 三井化学株式会社 光半導体用の面封止剤、それを用いた有機ｅｌデバイスの製造方法、有機ｅｌデバイスおよび有機ｅｌディスプレイパネル
KR20140043441A (ko) * 2011-07-20 2014-04-09 제온 코포레이션 네거티브형 감광성 수지 조성물, 수지막 및 전자 부품
JPWO2014017524A1 (ja) * 2012-07-26 2016-07-11 デンカ株式会社 樹脂組成物

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JP2018090806A (ja) 2018-06-14
JP6578339B2 (ja) 2019-09-18
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