MY198033A - Epoxy resin composition, curable resin composition and electronic component device - Google Patents

Epoxy resin composition, curable resin composition and electronic component device

Info

Publication number
MY198033A
MY198033A MYPI2019005627A MYPI2019005627A MY198033A MY 198033 A MY198033 A MY 198033A MY PI2019005627 A MYPI2019005627 A MY PI2019005627A MY PI2019005627 A MYPI2019005627 A MY PI2019005627A MY 198033 A MY198033 A MY 198033A
Authority
MY
Malaysia
Prior art keywords
resin composition
epoxy
electronic component
component device
curable resin
Prior art date
Application number
MYPI2019005627A
Inventor
Yoshinori Endo
Akemi Yamaguchi
Takahiro Nakada
Shinya Nakamura
Tsuyoshi Ohshita
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of MY198033A publication Critical patent/MY198033A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A epoxy resin composition includes a monofunctional epoxy compound having one epoxy group in a molecule thereof , a polyfunctional epoxy compound having two or more epoxy groups in a molecule thereo f , and a curing agent. A curable resin composition includes a curable resin, a curing agent, and a compound having a (meth)acryloyl group. An electronic component device is provided with an element sealed with the epoxy resin 10 composition or the curable r esin composition.
MYPI2019005627A 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device MY198033A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017072119 2017-03-31
JP2017072118 2017-03-31
PCT/JP2018/012551 WO2018181384A1 (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Publications (1)

Publication Number Publication Date
MY198033A true MY198033A (en) 2023-07-27

Family

ID=63676022

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005627A MY198033A (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Country Status (5)

Country Link
JP (2) JP7226306B2 (en)
MY (1) MY198033A (en)
SG (2) SG11201908910VA (en)
TW (2) TWI824463B (en)
WO (1) WO2018181384A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927151B2 (en) * 2018-05-29 2021-08-25 味の素株式会社 Resin composition
KR20230102200A (en) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 High refractive index and high adhesion epoxy resin composition and encapsulation material compring the same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156657A (en) * 1988-12-09 1990-06-15 Matsushita Electron Corp Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JPH06283343A (en) * 1993-03-25 1994-10-07 Hitachi Ltd Manufacture of flyback transformer
JPH0725986A (en) * 1993-07-06 1995-01-27 Mitsubishi Chem Corp Fiber-reinforced resin composition
JPH07122115A (en) * 1993-10-25 1995-05-12 Hitachi Ltd Flyback transformer
JP2005132891A (en) 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP5330633B2 (en) * 2005-04-28 2013-10-30 日立化成株式会社 Resin composition, optical member using the same, and method for producing the same
JP2007320974A (en) 2006-05-30 2007-12-13 Daicel Chem Ind Ltd Resin composition for sealing optical semiconductor
TW200823244A (en) * 2006-10-24 2008-06-01 Nippon Steel Chemical Co Epoxy resin composition and cured product
JP4934085B2 (en) * 2008-03-06 2012-05-16 電気化学工業株式会社 Energy ray curable resin composition, adhesive and cured product using the same
WO2010007859A1 (en) * 2008-07-18 2010-01-21 Dic株式会社 Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device
WO2010047386A1 (en) 2008-10-24 2010-04-29 チェイル インダストリーズ インコーポレイテッド Adhesive composition and optical member
JP2010132849A (en) 2008-11-05 2010-06-17 Nagoya Institute Of Technology Epoxy resin composition and method for producing cured material
JP5354753B2 (en) 2011-01-13 2013-11-27 信越化学工業株式会社 Underfill material and semiconductor device
KR102085332B1 (en) * 2012-07-26 2020-03-05 덴카 주식회사 Resin composition
JP6392671B2 (en) * 2013-01-09 2018-09-19 株式会社ダイセル Curable epoxy resin composition
JP6340762B2 (en) * 2013-07-31 2018-06-13 日立化成株式会社 Manufacturing method of electronic component device using underfill material, underfill material, and electronic component device
JP6405867B2 (en) * 2013-12-16 2018-10-17 日立化成株式会社 Resin paste composition and semiconductor device
CN105916937B (en) * 2014-01-23 2018-11-16 电化株式会社 Resin combination
JP6656792B2 (en) * 2014-03-28 2020-03-04 日立化成株式会社 Liquid resin composition for electronic component and electronic component device
JP2016149393A (en) 2015-02-10 2016-08-18 昭和電工株式会社 Adhesive for semiconductor, and semiconductor device and manufacturing method thereof
JP6857837B2 (en) * 2015-04-15 2021-04-14 パナソニックＩｐマネジメント株式会社 Thermosetting resin composition for encapsulation, manufacturing method of semiconductor device and semiconductor device
CN107109190B (en) * 2015-04-17 2020-06-23 积水化学工业株式会社 Sealing agent for electronic device and method for manufacturing electronic device
JP6819067B2 (en) * 2016-03-31 2021-01-27 住友ベークライト株式会社 Thermosetting resin composition, resin film with carrier, printed wiring board and semiconductor device
JP6643949B2 (en) 2016-05-12 2020-02-12 日本化薬株式会社 New (meth) acrylic compound and resin composition using the same

Also Published As

Publication number Publication date
JPWO2018181384A1 (en) 2020-02-06
TW202229391A (en) 2022-08-01
SG10202101445YA (en) 2021-03-30
WO2018181384A1 (en) 2018-10-04
JP2022101587A (en) 2022-07-06
SG11201908910VA (en) 2019-11-28
TWI824463B (en) 2023-12-01
TW201839023A (en) 2018-11-01
JP7416116B2 (en) 2024-01-17
TWI801371B (en) 2023-05-11
JP7226306B2 (en) 2023-02-21

Similar Documents

Publication Publication Date Title
SG126882A1 (en) Die attach adhesives with improved stress performance
PH12018502363A1 (en) Liquid resin composition for sealing and electronic component device
WO2008143253A1 (en) Adhesive composition and adhesive film using the same
TW200602375A (en) Thermosetting resin composition and use thereof
EP3441385A4 (en) Amine compound, amine composition, and epoxy resin curing agent
MY194143A (en) Glove, composition for dip molding, and method for producing glove
TWI367394B (en) Curable resin composition, cured article using the same and various object derived thereof
ATE465497T1 (en) LOW STRESS CONDUCTIVE ADHESIVE
WO2009044732A1 (en) Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
HK1086851A1 (en) Curable resin composition, curable film and cured film
WO2009038960A3 (en) Flexible epoxy-based compositions
PH12017501624B1 (en) Semiconductor device and image sensor module
EP4036144A4 (en) Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device
MY198033A (en) Epoxy resin composition, curable resin composition and electronic component device
MX2017007220A (en) Curable formulations for laminating adhesives.
EP4083127A4 (en) Curable organopolysiloxane composition, cured product thereof, protective agent or adhesive, and electric/electronic device
MY179938A (en) Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element
TW200619257A (en) Epoxyresin compositions and articles
EP3564289A4 (en) Curable epoxy resin composition, and fiber-reinforced composite material using same
EP3805288A4 (en) Curing agent for water-based epoxy resin, water-based epoxy resin composition, and cured product thereof
EP2944381A3 (en) Optically variable device comprising magnetic flakes
PH12020500618A1 (en) Resin composition and cured material of same, adhesive, semiconductor device, and electronic component
WO2006084537A3 (en) Radiation cross-linkable hot-melt contact adhesives
EP4010446A4 (en) Uv curable adhesive composition and adhesive film, adhesive tape, and bonding component comprising thereof
PH12016501392B1 (en) Adhesive composition and adhesive film having same, substrate provided with adhesive composition, and semiconductor device and method for manufacturing same