SG11201908910VA - Epoxy resin composition, curable resin composition and electronic component device - Google Patents

Epoxy resin composition, curable resin composition and electronic component device

Info

Publication number
SG11201908910VA
SG11201908910VA SG11201908910VA SG11201908910VA SG 11201908910V A SG11201908910V A SG 11201908910VA SG 11201908910V A SG11201908910V A SG 11201908910VA SG 11201908910V A SG11201908910V A SG 11201908910VA
Authority
SG
Singapore
Prior art keywords
resin composition
curable resin
epoxy
electronic component
component device
Prior art date
Application number
Inventor
Akemi Yamaguchi
Takahiro Nakada
Shinya Nakamura
Tsuyoshi Ohshita
Yoshinori Endo
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG11201908910VA publication Critical patent/SG11201908910VA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

A epoxy resin composition includes a monofunctional epoxy compound having one epoxy group in a molecule thereof, a polyfunctional epoxy compound having two or more epoxy groups in a molecule thereof, and a curing agent. A curable resin composition includes a curable resin, a curing agent, and a compound having a (meth)acryloyl group. An electronic component device is provided with an element sealed with the epoxy resin composition or the curable resin composition. [No suitable figure]
SG11201908910V 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device SG11201908910VA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017072118 2017-03-31
JP2017072119 2017-03-31
PCT/JP2018/012551 WO2018181384A1 (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Publications (1)

Publication Number Publication Date
SG11201908910VA true SG11201908910VA (en) 2019-11-28

Family

ID=63676022

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201908910V SG11201908910VA (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device
SG10202101445YA SG10202101445YA (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10202101445YA SG10202101445YA (en) 2017-03-31 2018-03-27 Epoxy resin composition, curable resin composition and electronic component device

Country Status (5)

Country Link
JP (2) JP7226306B2 (en)
MY (1) MY198033A (en)
SG (2) SG11201908910VA (en)
TW (2) TWI801371B (en)
WO (1) WO2018181384A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6927151B2 (en) * 2018-05-29 2021-08-25 味の素株式会社 Resin composition
KR20230102200A (en) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 High refractive index and high adhesion epoxy resin composition and encapsulation material compring the same

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02156657A (en) * 1988-12-09 1990-06-15 Matsushita Electron Corp Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device
JPH06283343A (en) * 1993-03-25 1994-10-07 Hitachi Ltd Manufacture of flyback transformer
JPH0725986A (en) * 1993-07-06 1995-01-27 Mitsubishi Chem Corp Fiber-reinforced resin composition
JPH07122115A (en) * 1993-10-25 1995-05-12 Hitachi Ltd Flyback transformer
JP2005132891A (en) 2003-10-28 2005-05-26 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP5330633B2 (en) 2005-04-28 2013-10-30 日立化成株式会社 Resin composition, optical member using the same, and method for producing the same
JP2007320974A (en) 2006-05-30 2007-12-13 Daicel Chem Ind Ltd Resin composition for sealing optical semiconductor
TW200823244A (en) * 2006-10-24 2008-06-01 Nippon Steel Chemical Co Epoxy resin composition and cured product
JP4934085B2 (en) 2008-03-06 2012-05-16 電気化学工業株式会社 Energy ray curable resin composition, adhesive and cured product using the same
WO2010007859A1 (en) 2008-07-18 2010-01-21 Dic株式会社 Epoxy resin composition, cured product thereof, method for producing cured product, optical semiconductor sealing material, and optical semiconductor device
EP2348081B1 (en) 2008-10-24 2017-03-01 Cheil Industries Inc. Adhesive composition and optical member
JP2010132849A (en) 2008-11-05 2010-06-17 Nagoya Institute Of Technology Epoxy resin composition and method for producing cured material
JP5354753B2 (en) * 2011-01-13 2013-11-27 信越化学工業株式会社 Underfill material and semiconductor device
SG10201706103VA (en) 2012-07-26 2017-09-28 Denki Kagaku Kogyo Kk Resin composition
WO2014109212A1 (en) * 2013-01-09 2014-07-17 株式会社ダイセル Curable epoxy resin composition
JP6340762B2 (en) 2013-07-31 2018-06-13 日立化成株式会社 Manufacturing method of electronic component device using underfill material, underfill material, and electronic component device
JP6405867B2 (en) * 2013-12-16 2018-10-17 日立化成株式会社 Resin paste composition and semiconductor device
KR20160111377A (en) * 2014-01-23 2016-09-26 덴카 주식회사 Resin composition
JP6656792B2 (en) 2014-03-28 2020-03-04 日立化成株式会社 Liquid resin composition for electronic component and electronic component device
JP2016149393A (en) 2015-02-10 2016-08-18 昭和電工株式会社 Adhesive for semiconductor, and semiconductor device and manufacturing method thereof
JP6857837B2 (en) 2015-04-15 2021-04-14 パナソニックＩｐマネジメント株式会社 Thermosetting resin composition for encapsulation, manufacturing method of semiconductor device and semiconductor device
TWI695059B (en) * 2015-04-17 2020-06-01 日商積水化學工業股份有限公司 Sealant for electronic device and manufacturing method of electronic device
JP6819067B2 (en) 2016-03-31 2021-01-27 住友ベークライト株式会社 Thermosetting resin composition, resin film with carrier, printed wiring board and semiconductor device
JP6643949B2 (en) 2016-05-12 2020-02-12 日本化薬株式会社 New (meth) acrylic compound and resin composition using the same

Also Published As

Publication number Publication date
JPWO2018181384A1 (en) 2020-02-06
TW202229391A (en) 2022-08-01
TW201839023A (en) 2018-11-01
WO2018181384A1 (en) 2018-10-04
MY198033A (en) 2023-07-27
TWI824463B (en) 2023-12-01
TWI801371B (en) 2023-05-11
SG10202101445YA (en) 2021-03-30
JP7226306B2 (en) 2023-02-21
JP7416116B2 (en) 2024-01-17
JP2022101587A (en) 2022-07-06

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