SG102037A1 - Device and method for conveying and holding plate-like member - Google Patents

Device and method for conveying and holding plate-like member

Info

Publication number
SG102037A1
SG102037A1 SG200200839A SG200200839A SG102037A1 SG 102037 A1 SG102037 A1 SG 102037A1 SG 200200839 A SG200200839 A SG 200200839A SG 200200839 A SG200200839 A SG 200200839A SG 102037 A1 SG102037 A1 SG 102037A1
Authority
SG
Singapore
Prior art keywords
conveying
holding plate
holding
plate
Prior art date
Application number
SG200200839A
Other languages
English (en)
Inventor
Kabeshita Akira
Okuda Osamu
Mimura Naoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of SG102037A1 publication Critical patent/SG102037A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0411—Pick-and-place heads or apparatus, e.g. with jaws having multiple mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
SG200200839A 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member SG102037A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14159799 1999-05-21

Publications (1)

Publication Number Publication Date
SG102037A1 true SG102037A1 (en) 2004-02-27

Family

ID=15295719

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200200838A SG111046A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member
SG200200839A SG102037A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200200838A SG111046A1 (en) 1999-05-21 2000-05-19 Device and method for conveying and holding plate-like member

Country Status (9)

Country Link
US (3) US6988612B1 (ja)
EP (2) EP1185156B1 (ja)
JP (2) JP4523217B2 (ja)
KR (1) KR100532015B1 (ja)
CN (2) CN100566537C (ja)
DE (1) DE60038292T2 (ja)
SG (2) SG111046A1 (ja)
TW (1) TW474122B (ja)
WO (1) WO2001026440A1 (ja)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10125398B4 (de) * 2001-05-23 2005-10-06 Siemens Ag Bestücksystem und Verfahren zum Bestücken von Substraten mit Bauelementen
EP1389344B1 (de) * 2001-05-23 2014-07-16 ASM Assembly Systems GmbH & Co. KG Bestücksystem und verfahren zum bestücken von substraten mit bauelementen
JP2004128400A (ja) * 2002-10-07 2004-04-22 Fuji Mach Mfg Co Ltd 部品実装装置、その作動を制御するプログラムおよび部品実装システム
JP4503954B2 (ja) * 2003-08-21 2010-07-14 株式会社日立ハイテクインスツルメンツ 基板位置決め装置及び基板位置決め方法
KR101006449B1 (ko) * 2004-04-08 2011-01-06 삼성전자주식회사 액정 표시 장치 제조를 위한 분배 시스템
KR100651815B1 (ko) * 2005-01-14 2006-12-01 삼성테크윈 주식회사 부품 실장기
US7802671B2 (en) * 2006-06-23 2010-09-28 Talyst Inc. Apparatus for delivering a container to a marking apparatus
US7779988B2 (en) * 2006-06-23 2010-08-24 Talyst Inc. Method for delivering a container to a marking apparatus
JP2008049356A (ja) * 2006-08-23 2008-03-06 Murata Mach Ltd 板材搬出装置
KR101138705B1 (ko) * 2006-10-24 2012-04-19 삼성테크윈 주식회사 기판이송장치
US7836582B2 (en) * 2006-12-12 2010-11-23 Universal Instruments Corporation Printed circuit board assembly machine
JP4970023B2 (ja) * 2006-12-25 2012-07-04 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
EP1971197A3 (de) 2007-03-14 2011-01-12 Siemens Electronics Assembly Systems GmbH & Co. KG Unterstützung von zwei mit einem Doppel-Transportsystem bereitgestellten zu bestückenden Substraten mit unterschiedlicher Breite
EP2140746B1 (de) * 2007-04-27 2011-11-09 ASM Assembly Systems GmbH & Co. KG Bestückautomat und verfahren zum bestücken von substraten mit bauelementen
JP4883181B2 (ja) * 2007-08-17 2012-02-22 富士通株式会社 部品実装方法
JP5003350B2 (ja) * 2007-08-23 2012-08-15 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP2009056656A (ja) * 2007-08-30 2009-03-19 Mimaki Engineering Co Ltd 印刷装置
JP5023904B2 (ja) * 2007-09-11 2012-09-12 パナソニック株式会社 スクリーン印刷装置
JP4832410B2 (ja) * 2007-11-30 2011-12-07 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
US8447566B2 (en) * 2008-02-21 2013-05-21 Panasonic Corporation Mounting condition determining method
JP5342159B2 (ja) * 2008-03-25 2013-11-13 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP4935745B2 (ja) * 2008-04-10 2012-05-23 パナソニック株式会社 粘性体の試し塗布装置
JP5199947B2 (ja) * 2009-05-20 2013-05-15 ヤマハ発動機株式会社 部品実装装置
TWI365023B (en) * 2009-07-23 2012-05-21 Wistron Corp Method for assembling componets on a circuit board and related assembling system
JP2011060829A (ja) * 2009-09-07 2011-03-24 Bonmaaku:Kk フレキシブルプリント基板の搬送用キャリア及びそれを用いたフレキシブルプリント基板の印刷装置
JP5615081B2 (ja) * 2010-07-26 2014-10-29 富士機械製造株式会社 部品実装装置
JP5450338B2 (ja) 2010-10-05 2014-03-26 富士機械製造株式会社 電子部品実装機
JP5477255B2 (ja) * 2010-10-25 2014-04-23 パナソニック株式会社 部品実装方法
JP5083701B2 (ja) * 2011-01-31 2012-11-28 アキム株式会社 部品搬送装置
JP5432950B2 (ja) * 2011-05-11 2014-03-05 ヤマハ発動機株式会社 基板製造装置および印刷機
JP5752998B2 (ja) * 2011-05-31 2015-07-22 ヤマハ発動機株式会社 スクリーン印刷装置
JP5723221B2 (ja) * 2011-05-31 2015-05-27 ヤマハ発動機株式会社 スクリーン印刷装置
KR101353587B1 (ko) * 2011-10-25 2014-01-23 김창남 웨이퍼 이송장치
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
CN106217038A (zh) * 2012-06-28 2016-12-14 环球仪器公司 灵活的装配机械、系统及方法
JP5870863B2 (ja) * 2012-06-29 2016-03-01 オムロン株式会社 基板検査装置
JP6166903B2 (ja) 2013-01-11 2017-07-19 ヤマハ発動機株式会社 電子部品実装装置
CN103128590B (zh) * 2013-03-12 2015-09-16 宁夏巨能机器人系统有限公司 抽屉料仓纯机械式抓取定位装置
US10180677B2 (en) 2013-07-08 2019-01-15 Fuji Corporation Substrate stopping position determination method and substrate stopping position determination device
JP6191006B2 (ja) * 2013-07-12 2017-09-06 パナソニックＩｐマネジメント株式会社 部品実装装置
JP6106065B2 (ja) * 2013-11-05 2017-03-29 ヤマハ発動機株式会社 部品実装装置
US10087011B2 (en) 2013-12-31 2018-10-02 Keith Manufacturing Co. Chain rail loading system
WO2015151246A1 (ja) 2014-04-02 2015-10-08 富士機械製造株式会社 部品実装機
KR101878768B1 (ko) * 2014-04-07 2018-07-16 야마하하쓰도키 가부시키가이샤 프린트 기판용 반송장치
JP6403435B2 (ja) * 2014-05-28 2018-10-10 ヤマハ発動機株式会社 部品実装装置、部品実装方法および実装データの修正方法
JP6315803B2 (ja) * 2014-07-18 2018-04-25 ヤマハ発動機株式会社 部品実装装置および搬送装置
DE102015108448B3 (de) * 2015-05-28 2016-05-12 Asm Assembly Systems Gmbh & Co. Kg Fördervorrichtung und Verfahren zum Fördern von Substraten für einen Bestückautomaten
WO2017017802A1 (ja) 2015-07-29 2017-02-02 富士機械製造株式会社 部品実装機
DE102015115560B4 (de) * 2015-09-15 2021-02-25 Asm Assembly Systems Gmbh & Co. Kg Seitenwangensystem eines Transportsystems für Leiterplatten, Transportsystem für Leiterplatten sowie Verfahren zum Verändern der Seitenwangenverstellmöglichkeit und der Spurbreite eines Seitenwangensystems eines Transportsystems für Leiterplatten
US11116121B2 (en) 2017-01-06 2021-09-07 Yamaha Hatsudoki Kabushiki Kaisha Mounting target working device
JP6793050B2 (ja) * 2017-01-30 2020-12-02 ヤマハ発動機株式会社 表面実装機
DE102017102700A1 (de) 2017-02-10 2018-09-13 Atg Luther & Maelzer Gmbh Prüfvorrichtung und Verfahren zum Prüfen von Leiterplatten
WO2019069438A1 (ja) * 2017-10-06 2019-04-11 株式会社Ｆｕｊｉ 対基板作業システム
CN107797210A (zh) * 2017-10-17 2018-03-13 安徽电信器材贸易工业有限责任公司 一种光缆排列装置
CN108357940A (zh) * 2018-02-12 2018-08-03 黄晓静 一种医疗手术器械清洗消毒用自动化输送装置
US11457551B2 (en) * 2018-03-15 2022-09-27 Fuji Corporation Mounting-related device and mounting system
CN108463101A (zh) * 2018-05-22 2018-08-28 深圳中科工控智能科技有限公司 全自动高速按键插件机
CN112262620B (zh) * 2018-06-13 2022-06-17 株式会社富士 对基板作业机
CN108910469B (zh) * 2018-07-27 2020-04-10 温州大学 薄片激光自动检测设备
CN110282341A (zh) * 2019-06-25 2019-09-27 英业达科技有限公司 取放装置
US11792968B2 (en) * 2019-08-01 2023-10-17 Fuji Corporation Automatic conveyance apparatus and production system comprising same
JP7381250B2 (ja) * 2019-08-21 2023-11-15 株式会社Fuji 部品装着機
CN114287174B (zh) * 2019-09-06 2023-07-14 株式会社富士 元件安装机的支撑销自动配置系统
WO2021057603A1 (zh) * 2019-09-23 2021-04-01 常州铭赛机器人科技股份有限公司 用于轨道机构的宽度调节装置和宽度调节方法
CN112770621A (zh) * 2019-11-02 2021-05-07 陈斌 一种同步贴装台式贴片机
EP4163233A1 (de) * 2021-10-08 2023-04-12 thyssenkrupp Automotive Body Solutions GmbH Rollenbahnsystem und verfahren zum verbringen eines rollenbahnsystems von einem betriebszustand in einen wartungszustand
DE102021129127A1 (de) * 2021-11-09 2023-05-11 Ersa Gmbh Transportsystem zum Transportieren von Lötgut durch eine Lötanlage und Lötanlage
CN114260746A (zh) * 2022-01-04 2022-04-01 青岛博岷斯智能科技有限公司 用于加工长方形钢板工件的双头铣床自动化上下料装置
CN114803515B (zh) * 2022-06-13 2023-04-25 青岛融合装备科技有限公司 一种玻璃基板缓存装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452509A (en) * 1992-01-21 1995-09-26 Yamaha Hatsudoki Kabushiki Kaisha Surface mounter
US5729892A (en) * 1995-02-28 1998-03-24 Nippondenso Co., Ltd. Component feeding system
US5778524A (en) * 1994-01-10 1998-07-14 Mydata Automation Ab Surface mount machine concept

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4315705A (en) * 1977-03-18 1982-02-16 Gca Corporation Apparatus for handling and treating wafers
US4371075A (en) * 1980-08-04 1983-02-01 Polaroid Corporation Modular production line unit and system
US4573566A (en) * 1984-01-13 1986-03-04 The Cross Company Dual stroke transfer drive
JPH0691358B2 (ja) 1984-04-25 1994-11-14 松下電器産業株式会社 薄板保持装置
US4658947A (en) * 1984-11-08 1987-04-21 Raymond Production Systems Transfer mechanism
US4845843A (en) * 1985-10-28 1989-07-11 Cimm, Inc. System for configuring, automating and controlling the test and repair of printed circuit boards
US6288561B1 (en) 1988-05-16 2001-09-11 Elm Technology Corporation Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
US5249662A (en) * 1989-04-05 1993-10-05 Sanyo Electric Co., Ltd. Parts feeding apparatus
JPH04127499A (ja) * 1990-05-22 1992-04-28 Yamatake Honeywell Co Ltd 表面実装機
JP2887925B2 (ja) * 1991-03-20 1999-05-10 松下電器産業株式会社 基板の位置決め装置
DE59208321D1 (de) * 1991-11-13 1997-05-15 Ciba Geigy Ag Beschichtungsvorrichtung für Platten
JP2863682B2 (ja) * 1992-01-21 1999-03-03 ヤマハ発動機株式会社 表面実装機
JP2878899B2 (ja) * 1992-05-07 1999-04-05 三菱電機株式会社 薄板フレームの搬送及び位置決め方法、並びにその装置
JP3307990B2 (ja) * 1992-08-31 2002-07-29 ヤマハ発動機株式会社 物品認識方法および同装置
JPH06310898A (ja) * 1993-04-21 1994-11-04 Canon Inc 部品実装設計装置
JP3165289B2 (ja) * 1993-07-12 2001-05-14 ヤマハ発動機株式会社 表面実装機
JP2914177B2 (ja) 1994-06-17 1999-06-28 松下電器産業株式会社 基板位置決め装置
JPH08162797A (ja) * 1994-12-08 1996-06-21 Matsushita Electric Ind Co Ltd 電子部品実装装置
JP2792829B2 (ja) * 1994-12-12 1998-09-03 ヤマハ発動機株式会社 実装機の部品認識装置
JP3339230B2 (ja) * 1995-01-17 2002-10-28 松下電器産業株式会社 プリント基板の支持装置および方法および実装装置
JPH0997999A (ja) 1995-09-29 1997-04-08 Matsushita Electric Ind Co Ltd プリント基板位置決め装置
JP3402876B2 (ja) * 1995-10-04 2003-05-06 ヤマハ発動機株式会社 表面実装機
US5813514A (en) * 1995-12-19 1998-09-29 Midaco Corporation Automated end loading pallet system
JP3553724B2 (ja) 1996-03-18 2004-08-11 松下電器産業株式会社 基板搬送装置
JP2761480B2 (ja) 1996-08-05 1998-06-04 ニチデン機械株式会社 ワ−ク収納幅切換装置及びマガジンへのワ−ク収納方法
JPH10135684A (ja) * 1996-10-28 1998-05-22 Sony Corp 電子回路部品の自動挿入システム
JP4162741B2 (ja) * 1996-11-27 2008-10-08 富士機械製造株式会社 回路部品装着システム
US6073342A (en) * 1996-11-27 2000-06-13 Fuji Machine Mfg., Co., Ltd. Circuit-substrate-related-operation performing system
US6066206A (en) * 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
DE19707267A1 (de) * 1997-02-24 1998-08-27 Siemens Ag Vorrichtung zum Herstellen von elektrischen Baugruppen
JP3459533B2 (ja) * 1997-02-28 2003-10-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP3079062B2 (ja) * 1997-04-21 2000-08-21 ヤマハ発動機株式会社 表面実装機
US6032788A (en) * 1998-02-26 2000-03-07 Dek Printing Machines Limited Multi-rail board transport system
DE50113833D1 (de) * 2000-06-29 2008-05-21 Cross Hueller Gmbh Anlage zur bearbeitung von werkstücken mit wenigstens einer werkzeug-maschine
KR100363898B1 (ko) * 2000-11-24 2002-12-11 미래산업 주식회사 표면실장장치 및 그 방법
US6688458B2 (en) * 2001-10-09 2004-02-10 Speedline Technologies, Inc. System and method for controlling a conveyor system configuration to accommodate different size substrates
EP2043420B1 (en) * 2006-06-29 2016-04-27 Yamaha Motor Co., Ltd. Surface mounting apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452509A (en) * 1992-01-21 1995-09-26 Yamaha Hatsudoki Kabushiki Kaisha Surface mounter
US5778524A (en) * 1994-01-10 1998-07-14 Mydata Automation Ab Surface mount machine concept
US5729892A (en) * 1995-02-28 1998-03-24 Nippondenso Co., Ltd. Component feeding system

Also Published As

Publication number Publication date
EP1940215A2 (en) 2008-07-02
EP1185156A1 (en) 2002-03-06
WO2001026440A1 (fr) 2001-04-12
US7219787B2 (en) 2007-05-22
DE60038292T2 (de) 2009-03-12
EP1185156B1 (en) 2008-03-12
US20050204553A1 (en) 2005-09-22
EP1185156A4 (en) 2005-11-30
CN1258312C (zh) 2006-05-31
EP1940215A3 (en) 2011-03-16
JP4523217B2 (ja) 2010-08-11
CN1838871A (zh) 2006-09-27
KR100532015B1 (ko) 2005-11-29
KR20010113949A (ko) 2001-12-28
DE60038292D1 (de) 2008-04-24
CN1351817A (zh) 2002-05-29
US20050133346A1 (en) 2005-06-23
US7077262B2 (en) 2006-07-18
JP2010157767A (ja) 2010-07-15
SG111046A1 (en) 2005-05-30
JP4975845B2 (ja) 2012-07-11
US6988612B1 (en) 2006-01-24
TW474122B (en) 2002-01-21
CN100566537C (zh) 2009-12-02

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