SG10201508134VA - Workpiece Processing Method - Google Patents

Workpiece Processing Method

Info

Publication number
SG10201508134VA
SG10201508134VA SG10201508134VA SG10201508134VA SG10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA SG 10201508134V A SG10201508134V A SG 10201508134VA
Authority
SG
Singapore
Prior art keywords
processing method
workpiece processing
workpiece
processing
Prior art date
Application number
SG10201508134VA
Other languages
English (en)
Inventor
Yoshihide Kihara
Toru Hisamatsu
Masanobu Honda
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG10201508134VA publication Critical patent/SG10201508134VA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6302—Non-deposition formation processes
    • H10P14/6324—Formation by anodic treatments, e.g. anodic oxidation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6328—Deposition from the gas or vapour phase
    • H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
    • H10P14/6336—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Formation Of Insulating Films (AREA)
SG10201508134VA 2014-10-07 2015-09-30 Workpiece Processing Method SG10201508134VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014206614A JP6382055B2 (ja) 2014-10-07 2014-10-07 被処理体を処理する方法

Publications (1)

Publication Number Publication Date
SG10201508134VA true SG10201508134VA (en) 2016-05-30

Family

ID=54199559

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201508134VA SG10201508134VA (en) 2014-10-07 2015-09-30 Workpiece Processing Method

Country Status (7)

Country Link
US (1) US9607811B2 (enExample)
EP (1) EP3007205B1 (enExample)
JP (1) JP6382055B2 (enExample)
KR (1) KR102311575B1 (enExample)
CN (2) CN112133630B (enExample)
SG (1) SG10201508134VA (enExample)
TW (1) TWI661464B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6559430B2 (ja) 2015-01-30 2019-08-14 東京エレクトロン株式会社 被処理体を処理する方法
JP6462477B2 (ja) 2015-04-27 2019-01-30 東京エレクトロン株式会社 被処理体を処理する方法
WO2017170411A1 (ja) 2016-03-29 2017-10-05 東京エレクトロン株式会社 被処理体を処理する方法
KR20170114579A (ko) 2016-04-05 2017-10-16 주식회사 만도 전압 제어 방법 및 그 제어 시스템
JP6541618B2 (ja) * 2016-05-25 2019-07-10 東京エレクトロン株式会社 被処理体を処理する方法
JP6832171B2 (ja) 2017-01-24 2021-02-24 東京エレクトロン株式会社 プラズマ処理装置のチャンバ本体の内部のクリーニングを含むプラズマ処理方法
JP6895352B2 (ja) * 2017-09-12 2021-06-30 東京エレクトロン株式会社 被加工物を処理する方法
JP6886940B2 (ja) * 2018-04-23 2021-06-16 東京エレクトロン株式会社 プラズマ処理方法
CN110581050B (zh) * 2018-06-07 2024-06-11 东京毅力科创株式会社 处理方法和等离子体处理装置
TWI820667B (zh) * 2018-06-19 2023-11-01 美商應用材料股份有限公司 間隙填充物沉積方法及類金剛石之碳的間隙填充物材料
CN110777361B (zh) * 2018-07-26 2023-08-01 东京毅力科创株式会社 等离子体处理方法和等离子体处理装置
JP7345283B2 (ja) * 2018-07-26 2023-09-15 東京エレクトロン株式会社 プラズマ処理方法およびプラズマ処理装置
JP7178918B2 (ja) 2019-01-30 2022-11-28 東京エレクトロン株式会社 エッチング方法、プラズマ処理装置、及び処理システム
JP7240946B2 (ja) * 2019-04-26 2023-03-16 株式会社トリケミカル研究所 酸化珪素膜形成方法
US11955318B2 (en) * 2021-03-12 2024-04-09 Applied Materials, Inc. Ash rate recovery method in plasma strip chamber
JP7854771B2 (ja) * 2021-06-22 2026-05-07 東京エレクトロン株式会社 プラズマ処理方法、プラズマ処理装置及びプラズマ処理システム

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JPH04137725A (ja) * 1990-09-28 1992-05-12 Tonen Corp ガラス基板多結晶シリコン薄膜
JP4137725B2 (ja) * 2002-07-10 2008-08-20 松下電器産業株式会社 接合部材の加工寸法決定方法および装置
JP4515278B2 (ja) * 2005-02-16 2010-07-28 東京エレクトロン株式会社 エッチング方法、エッチング方法を実行するための制御プログラム、制御プログラム記憶媒体及び処理装置
JP2007123766A (ja) * 2005-10-31 2007-05-17 Tokyo Electron Ltd エッチング方法、プラズマ処理装置及び記憶媒体
KR101217778B1 (ko) 2007-06-08 2013-01-02 도쿄엘렉트론가부시키가이샤 패터닝 방법
US7790531B2 (en) * 2007-12-18 2010-09-07 Micron Technology, Inc. Methods for isolating portions of a loop of pitch-multiplied material and related structures
US8647722B2 (en) * 2008-11-14 2014-02-11 Asm Japan K.K. Method of forming insulation film using plasma treatment cycles
JP5698950B2 (ja) * 2009-10-23 2015-04-08 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4733214B1 (ja) * 2010-04-02 2011-07-27 東京エレクトロン株式会社 マスクパターンの形成方法及び半導体装置の製造方法
US8252691B2 (en) * 2010-04-14 2012-08-28 Asm Genitech Korea Ltd. Method of forming semiconductor patterns
KR20120001339A (ko) * 2010-06-29 2012-01-04 삼성전자주식회사 반도체 소자의 미세 패턴 형성 방법
JP5674375B2 (ja) * 2010-08-03 2015-02-25 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US8298951B1 (en) * 2011-04-13 2012-10-30 Asm Japan K.K. Footing reduction using etch-selective layer
US9666414B2 (en) * 2011-10-27 2017-05-30 Applied Materials, Inc. Process chamber for etching low k and other dielectric films
US9922802B2 (en) * 2012-02-20 2018-03-20 Tokyo Electron Limited Power supply system, plasma etching apparatus, and plasma etching method
WO2014042192A1 (ja) * 2012-09-13 2014-03-20 東京エレクトロン株式会社 被処理基体を処理する方法、及びプラズマ処理装置
KR102052936B1 (ko) * 2012-11-13 2019-12-06 삼성전자 주식회사 반도체 소자 제조 방법
JP6366454B2 (ja) * 2014-10-07 2018-08-01 東京エレクトロン株式会社 被処理体を処理する方法

Also Published As

Publication number Publication date
US20160099131A1 (en) 2016-04-07
US9607811B2 (en) 2017-03-28
CN112133630B (zh) 2024-08-13
CN112133630A (zh) 2020-12-25
KR20160041764A (ko) 2016-04-18
KR102311575B1 (ko) 2021-10-08
EP3007205B1 (en) 2017-08-16
TW201626434A (zh) 2016-07-16
TWI661464B (zh) 2019-06-01
CN105489483A (zh) 2016-04-13
EP3007205A1 (en) 2016-04-13
JP2016076621A (ja) 2016-05-12
JP6382055B2 (ja) 2018-08-29

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