SG10201503001XA - Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece - Google Patents

Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece

Info

Publication number
SG10201503001XA
SG10201503001XA SG10201503001XA SG10201503001XA SG10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA SG 10201503001X A SG10201503001X A SG 10201503001XA
Authority
SG
Singapore
Prior art keywords
slices
multiplicity
workpiece
uniform thickness
particularly uniform
Prior art date
Application number
SG10201503001XA
Other languages
English (en)
Inventor
Georg Pietsch
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201503001XA publication Critical patent/SG10201503001XA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • B23D61/185—Saw wires; Saw cables; Twisted saw strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201503001XA 2014-04-30 2015-04-16 Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece SG10201503001XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102014208187.4A DE102014208187B4 (de) 2014-04-30 2014-04-30 Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben mit besonders gleichmäßiger Dicke von einem Werkstück

Publications (1)

Publication Number Publication Date
SG10201503001XA true SG10201503001XA (en) 2015-11-27

Family

ID=54326027

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201503001XA SG10201503001XA (en) 2014-04-30 2015-04-16 Method For Simultaneously Cutting A Multiplicity Of Slices Of Particularly Uniform Thickness From A Workpiece

Country Status (7)

Country Link
US (1) US9573296B2 (zh)
JP (3) JP2015212007A (zh)
KR (3) KR101689302B1 (zh)
CN (2) CN105034181B (zh)
DE (1) DE102014208187B4 (zh)
SG (1) SG10201503001XA (zh)
TW (1) TWI578392B (zh)

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DE102013219468B4 (de) * 2013-09-26 2015-04-23 Siltronic Ag Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück
TWM481811U (zh) * 2014-02-11 2014-07-11 Green Energy Technology Inc 切片裝置
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JP6304118B2 (ja) * 2015-05-01 2018-04-04 信越半導体株式会社 ワイヤソー装置
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
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CN105904027A (zh) * 2016-04-27 2016-08-31 藤县正钻门业有限公司 一种带有数控夹具的线锯机
CN106444630A (zh) * 2016-11-24 2017-02-22 常州协鑫光伏科技有限公司 砂浆在线调控方法及装置
JP3215089U (ja) * 2017-01-09 2018-03-01 べカルト ビンジャン スチール コード カンパニー．，リミテッドＢｅｋａｅｒｔ Ｂｉｎｊｉａｎｇ Ｓｔｅｅｌ Ｃｏｒｄ Ｃｏ．，Ｌｔｄ 弾性回転及び塑性回転を有するソーワイヤ付きスプール
CN108284529B (zh) * 2017-01-09 2024-07-16 江阴贝卡尔特合金材料有限公司 具有有着弹性和塑性旋转的锯丝的卷轴
DE102017202314A1 (de) * 2017-02-14 2018-08-16 Siltronic Ag Drahtsäge, Drahtführungsrolle und Verfahren zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Stab
JP6222393B1 (ja) * 2017-03-21 2017-11-01 信越半導体株式会社 インゴットの切断方法
JP6249319B1 (ja) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 ソーワイヤー及び切断装置
KR102476617B1 (ko) * 2017-05-02 2022-12-12 신에쯔 한도타이 가부시키가이샤 워크의 절단 방법 및 접합 부재
CN107199643B (zh) * 2017-06-28 2019-10-01 苏州阿特斯阳光电力科技有限公司 一种金刚线切割硅棒的方法
WO2019008530A1 (en) * 2017-07-07 2019-01-10 Meyer Burger (Switzerland) Ag METHOD FOR WINDING A CUTTING WIRE
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DE102018221921A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge
WO2020213112A1 (ja) * 2019-04-18 2020-10-22 三菱電機株式会社 ワイヤ放電加工装置
CN110000942A (zh) * 2019-05-14 2019-07-12 玉田县昌通电子有限公司 一种多线切割机的罗拉绕线方法及其罗拉绕线结构
DE102019207719A1 (de) * 2019-05-27 2020-12-03 Siltronic Ag Verfahren zum Abtrennen einer Vielzahl von Scheiben von Werkstücken während einer Anzahl von Abtrennvorgängen mittels einer Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
JP7103305B2 (ja) * 2019-05-29 2022-07-20 信越半導体株式会社 インゴットの切断方法
CN110253775A (zh) * 2019-07-26 2019-09-20 内蒙古中环光伏材料有限公司 一种切片机张力臂测控装置及切片工艺
CN112793021A (zh) * 2019-10-28 2021-05-14 洛阳阿特斯光伏科技有限公司 一种硅棒拼接方法、拼接硅棒及拼接硅棒的切割方法
JP6761917B1 (ja) * 2019-11-29 2020-09-30 Ｊｘ金属株式会社 リン化インジウム基板、半導体エピタキシャルウエハ、及びリン化インジウム基板の製造方法
EP3858569A1 (de) * 2020-01-28 2021-08-04 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
CN111421688A (zh) * 2020-05-09 2020-07-17 西安奕斯伟硅片技术有限公司 多线切割装置及多线切割方法
EP3922386A1 (de) * 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben von werkstücken mittels einer drahtsäge während einer abfolge von abtrennvorgängen
EP3922389A1 (de) * 2020-06-10 2021-12-15 Siltronic AG Verfahren zum abtrennen einer vielzahl von scheiben mittels einer drahtsäge von werkstücken während einer abfolge von abtrennvorgängen
KR102350628B1 (ko) 2020-11-25 2022-01-14 주식회사 원광에스앤티 태양광 패널 처리 장치
CN112372489A (zh) * 2020-12-02 2021-02-19 上饶师范学院 一种晶圆切割加工所用导辊表面导槽快速加工方法及装置
CN112974222A (zh) * 2021-01-29 2021-06-18 华油惠博普科技股份有限公司 一种用于硫膏上料的破袋筛分装置
CN113059707B (zh) * 2021-02-23 2022-05-17 厦门大学 线锯加工过程中调节线网间距的装置及加工方法
JP7198881B2 (ja) * 2021-05-14 2023-01-04 日揚科技股▲分▼有限公司 硬質材料加工システム
CN113370406A (zh) * 2021-05-24 2021-09-10 福州天瑞线锯科技有限公司 一种硅晶棒料双向切割方法
US11717930B2 (en) * 2021-05-31 2023-08-08 Siltronic Corporation Method for simultaneously cutting a plurality of disks from a workpiece
CN113799277B (zh) * 2021-08-10 2024-04-19 威科赛乐微电子股份有限公司 一种晶体多线切割方法
TWI803972B (zh) * 2021-09-11 2023-06-01 環球晶圓股份有限公司 晶錠切割方法
CN113815138B (zh) * 2021-09-29 2023-08-22 西安奕斯伟材料科技股份有限公司 改善氮掺杂晶圆翘曲度的加工方法和系统
CN114290542A (zh) * 2021-12-17 2022-04-08 中国船舶重工集团公司第七一五研究所 一种基于多线切割技术的1-3复合材料制备方法
CN114474443B (zh) * 2022-02-22 2023-03-21 河北同光半导体股份有限公司 晶体的偏置切割方法
CN115056151A (zh) * 2022-04-18 2022-09-16 安徽琼钰刷业有限公司 一种斜纹抛光辊刷及其生产工艺
CN114799498A (zh) * 2022-04-18 2022-07-29 江苏中邦木业有限公司 一种可快速切割地板的激光切割装置
CN115635141A (zh) * 2022-05-27 2023-01-24 长沙韵为科技有限公司 基于数控技术的高速多环连续切割线锯机和连续切割方法
CN115275873A (zh) * 2022-08-04 2022-11-01 国网福建省电力有限公司 输电线张力放线走板过转角塔的张力机出口张力调整方法
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Also Published As

Publication number Publication date
JP6590756B2 (ja) 2019-10-16
KR101685329B1 (ko) 2016-12-09
KR101689302B1 (ko) 2016-12-23
CN105034181B (zh) 2018-05-18
US20150314484A1 (en) 2015-11-05
CN107052452B (zh) 2019-10-15
JP2016174173A (ja) 2016-09-29
CN105034181A (zh) 2015-11-11
DE102014208187A1 (de) 2015-11-05
US9573296B2 (en) 2017-02-21
KR20160069512A (ko) 2016-06-16
JP6366783B2 (ja) 2018-08-01
TWI578392B (zh) 2017-04-11
DE102014208187B4 (de) 2023-07-06
KR101715565B1 (ko) 2017-03-13
KR20160070738A (ko) 2016-06-20
JP2017208553A (ja) 2017-11-24
KR20150125577A (ko) 2015-11-09
CN107052452A (zh) 2017-08-18
JP2015212007A (ja) 2015-11-26
TW201545225A (zh) 2015-12-01

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