PL3334697T3 - Sposób cięcia cienkiej warstwy szkła - Google Patents
Sposób cięcia cienkiej warstwy szkłaInfo
- Publication number
- PL3334697T3 PL3334697T3 PL16750819T PL16750819T PL3334697T3 PL 3334697 T3 PL3334697 T3 PL 3334697T3 PL 16750819 T PL16750819 T PL 16750819T PL 16750819 T PL16750819 T PL 16750819T PL 3334697 T3 PL3334697 T3 PL 3334697T3
- Authority
- PL
- Poland
- Prior art keywords
- cutting
- glass layer
- thin glass
- thin
- layer
- Prior art date
Links
- 239000011521 glass Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15180376 | 2015-08-10 | ||
| EP16750819.1A EP3334697B1 (de) | 2015-08-10 | 2016-08-10 | Verfahren zum schneiden einer dünnen glassschicht |
| PCT/EP2016/069008 WO2017025550A1 (de) | 2015-08-10 | 2016-08-10 | Verfahren zum schneiden einer dünnen glassschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3334697T3 true PL3334697T3 (pl) | 2022-01-24 |
Family
ID=53938107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL16750819T PL3334697T3 (pl) | 2015-08-10 | 2016-08-10 | Sposób cięcia cienkiej warstwy szkła |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US10759690B2 (pl) |
| EP (1) | EP3334697B1 (pl) |
| JP (1) | JP6552717B2 (pl) |
| KR (1) | KR102077667B1 (pl) |
| CN (1) | CN106604898B (pl) |
| BR (1) | BR112017028312B1 (pl) |
| CA (1) | CA2991444C (pl) |
| ES (1) | ES2893949T3 (pl) |
| HU (1) | HUE057430T2 (pl) |
| MX (1) | MX2018001587A (pl) |
| PL (1) | PL3334697T3 (pl) |
| RU (1) | RU2694089C1 (pl) |
| WO (1) | WO2017025550A1 (pl) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| KR102445217B1 (ko) | 2014-07-08 | 2022-09-20 | 코닝 인코포레이티드 | 재료를 레이저 가공하는 방법 및 장치 |
| LT3169477T (lt) | 2014-07-14 | 2020-05-25 | Corning Incorporated | Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami |
| JP7292006B2 (ja) | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
| CN109803786B (zh) | 2016-09-30 | 2021-05-07 | 康宁股份有限公司 | 使用非轴对称束斑对透明工件进行激光加工的设备和方法 |
| US11542190B2 (en) | 2016-10-24 | 2023-01-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| CN106944746A (zh) * | 2017-04-26 | 2017-07-14 | 深圳迈进自动化科技有限公司 | 一种主动引导切割路线的激光加工工艺及系统 |
| US10906832B2 (en) * | 2017-08-11 | 2021-02-02 | Corning Incorporated | Apparatuses and methods for synchronous multi-laser processing of transparent workpieces |
| JP6896344B2 (ja) * | 2017-09-22 | 2021-06-30 | 株式会社ディスコ | チップの製造方法 |
| EP3717238A1 (de) | 2017-11-30 | 2020-10-07 | Saint-Gobain Glass France | Verbundscheibe mit integriertem elektrischen anbauteil |
| CN109909601A (zh) | 2017-12-13 | 2019-06-21 | 京东方科技集团股份有限公司 | 一种激光加工系统及方法 |
| DE102018126381A1 (de) * | 2018-02-15 | 2019-08-22 | Schott Ag | Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element |
| SG10202006597QA (en) * | 2019-07-26 | 2021-02-25 | Heraeus Deutschland Gmbh & Co Kg | Process for preparing a processed filament by interaction of a filament with at least one processing beam in N processing steps |
| CN110590147B (zh) * | 2019-09-18 | 2022-08-02 | 彩虹(合肥)液晶玻璃有限公司 | 分离方法、装置、设备和切割设备 |
| DE102019129036A1 (de) * | 2019-10-28 | 2021-04-29 | Schott Ag | Verfahren zur Herstellung von Glasscheiben und verfahrensgemäß hergestellte Glasscheibe sowie deren Verwendung |
| DE102019217021A1 (de) * | 2019-11-05 | 2021-05-06 | Photon Energy Gmbh | Laserschneidverfahren und zugehörige Laserschneidvorrichtung |
| CN110828615A (zh) * | 2019-11-20 | 2020-02-21 | 苏州沃特维自动化系统有限公司 | 叠瓦电池串的制作方法 |
| US11199658B2 (en) * | 2019-12-20 | 2021-12-14 | Magic Leap, Inc. | Singulation of optical waveguide materials |
| JP7302824B2 (ja) * | 2020-02-25 | 2023-07-04 | Agc株式会社 | 基材の加工方法 |
| TWI733604B (zh) * | 2020-06-10 | 2021-07-11 | 財團法人工業技術研究院 | 玻璃工件雷射處理系統及方法 |
| IL299291B2 (en) | 2020-06-25 | 2024-09-01 | Magic Leap Inc | Eyepiece for head-mounted display and method for making the same |
| CN111799352A (zh) * | 2020-07-07 | 2020-10-20 | 苏州市汇邦自动化系统有限公司 | 一种用于光伏电池片的激光无损切割设备及工艺 |
| DE102020123928A1 (de) * | 2020-09-15 | 2022-03-17 | Schott Ag | Verfahren und Vorrichtung zum Zuschneiden von Glasfolien |
| CN112404747B (zh) * | 2020-11-09 | 2022-05-24 | 松山湖材料实验室 | 一种晶圆剥离方法和晶圆剥离装置 |
| CN112846536A (zh) * | 2021-01-07 | 2021-05-28 | 卡门哈斯激光科技(苏州)有限公司 | 一种太阳能电池片激光低损切割装置及方法 |
| CN112846537A (zh) * | 2021-01-07 | 2021-05-28 | 卡门哈斯激光科技(苏州)有限公司 | 一种太阳能电池片的激光低损切割装置及方法 |
| KR102475957B1 (ko) * | 2021-03-25 | 2022-12-09 | 로체 시스템즈(주) | 취성 재료를 갖는 구조물의 절단 방법 |
| FR3121438B1 (fr) * | 2021-04-02 | 2023-03-24 | Saint Gobain | Procede de decoupe d’un vitrage feuillete au moyen d’une source laser |
| US20240174544A1 (en) * | 2022-11-30 | 2024-05-30 | Corning Incorporated | Methods of laser cutting material |
| CN116393846B (zh) * | 2023-06-08 | 2023-10-03 | 江西联创电子有限公司 | 光学器件的激光切割方法及系统 |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| US5622540A (en) | 1994-09-19 | 1997-04-22 | Corning Incorporated | Method for breaking a glass sheet |
| DE19544127C1 (de) | 1995-11-27 | 1997-03-20 | Gimsa Jan Dr | Verfahren und Vorrichtung zur Erzeugung von Resonanzerscheinungen in Partikelsuspensionen und ihre Verwendung |
| TW419867B (en) | 1998-08-26 | 2001-01-21 | Samsung Electronics Co Ltd | Laser cutting apparatus and method |
| US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| JP2001212683A (ja) | 2000-01-31 | 2001-08-07 | Toshiba Corp | 脆性材料の割断装置、脆性材料の割断方法および液晶表示装置の製造方法 |
| US6744009B1 (en) * | 2002-04-02 | 2004-06-01 | Seagate Technology Llc | Combined laser-scribing and laser-breaking for shaping of brittle substrates |
| JP3929393B2 (ja) | 2002-12-03 | 2007-06-13 | 株式会社日本エミック | 切断装置 |
| KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
| EP1478034A2 (en) | 2003-05-16 | 2004-11-17 | Kabushiki Kaisha Toyota Jidoshokki | Light-emitting apparatus and method for forming the same |
| JP2006035710A (ja) * | 2004-07-28 | 2006-02-09 | Cyber Laser Kk | レーザによるガラス加工方法ならびに装置 |
| KR100636852B1 (ko) | 2005-03-22 | 2006-10-19 | (주)한빛레이저 | 모드라킹된 자외선 레이저를 이용한 유리기판의 스크라이빙방법 및 절단 방법 |
| US20080236199A1 (en) | 2005-07-28 | 2008-10-02 | Vladislav Sklyarevich | Method of Separating Non-Metallic Material Using Microwave Radiation |
| TW200722218A (en) | 2005-12-05 | 2007-06-16 | Foxsemicon Integrated Tech Inc | Laser cutting apparatus |
| JPWO2007119740A1 (ja) | 2006-04-13 | 2009-08-27 | 東レエンジニアリング株式会社 | スクライブ方法、スクライブ装置、及びこの方法または装置を用いて割断した割断基板 |
| FR2901891B1 (fr) | 2006-05-30 | 2008-09-26 | Schefenacker Vision Systems Fr | Cellule electrochrome, son utilisation dans la realisation d'une vitre ou d'un retroviseur et son procede de realisation. |
| DE202007001346U1 (de) | 2007-01-24 | 2007-04-05 | H2B Photonics Gmbh | Einrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material |
| KR100876502B1 (ko) * | 2007-09-21 | 2008-12-31 | 한국정보통신대학교 산학협력단 | 초단파 레이저 빔을 이용한 기판 절단장치 및 그 절단방법 |
| JP2009262188A (ja) * | 2008-04-24 | 2009-11-12 | Disco Abrasive Syst Ltd | 透明板状物のレーザー加工方法 |
| US8053704B2 (en) * | 2008-05-27 | 2011-11-08 | Corning Incorporated | Scoring of non-flat materials |
| DE102008026339A1 (de) | 2008-05-31 | 2009-12-03 | Saint-Gobain Sekurit Deutschland Gmbh & Co. Kg | Elektrisch schaltbares Sichtschutzfenster |
| US8051679B2 (en) * | 2008-09-29 | 2011-11-08 | Corning Incorporated | Laser separation of glass sheets |
| FR2944148B1 (fr) | 2009-04-02 | 2012-03-02 | Saint Gobain | Procede de fabrication d'une structure a surface texturee pour dispositif a diode electroluminescente organique et structure a surface texturee obtenue par ce procede |
| PT104635A (pt) | 2009-06-16 | 2010-12-16 | Univ Nova De Lisboa | Dispositivo electrocrómico e método para a sua produção |
| EP2463249B1 (en) | 2009-08-07 | 2015-04-29 | Asahi Glass Company, Limited | Method for manufacturing ultra-thin glass substrate |
| KR20120073249A (ko) * | 2009-08-28 | 2012-07-04 | 코닝 인코포레이티드 | 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법 |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| GB0916379D0 (en) | 2009-09-18 | 2009-10-28 | Pilkington Group Ltd | Laminated glazing |
| KR102088722B1 (ko) | 2010-07-12 | 2020-03-17 | 로핀-시나르 테크놀로지스 엘엘씨 | 레이저 필라멘테이션에 의한 재료 가공 방법 |
| FR2962818B1 (fr) | 2010-07-13 | 2013-03-08 | Saint Gobain | Dispositif electrochimique a proprietes de transmission optique et/ou energetique electrocommandables. |
| JP5696393B2 (ja) | 2010-08-02 | 2015-04-08 | 日本電気硝子株式会社 | ガラスフィルムの割断方法 |
| US8164818B2 (en) | 2010-11-08 | 2012-04-24 | Soladigm, Inc. | Electrochromic window fabrication methods |
| JP5838966B2 (ja) | 2010-11-18 | 2016-01-06 | 旭硝子株式会社 | ガラス板の製造装置およびガラス板の製造方法 |
| JP5743182B2 (ja) | 2010-11-19 | 2015-07-01 | 日本電気硝子株式会社 | ガラスフィルムの製造方法 |
| FR2971960B1 (fr) * | 2011-02-25 | 2013-02-22 | Saint Gobain | Traitement thermique de revetement par laser |
| TWI547369B (zh) | 2011-05-27 | 2016-09-01 | 康寧公司 | 玻璃塑膠積層之裝置、處理線、及方法 |
| US8635887B2 (en) * | 2011-08-10 | 2014-01-28 | Corning Incorporated | Methods for separating glass substrate sheets by laser-formed grooves |
| DE102011084128A1 (de) | 2011-10-07 | 2013-04-11 | Schott Ag | Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante |
| US9828278B2 (en) * | 2012-02-28 | 2017-11-28 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| WO2013130581A1 (en) * | 2012-02-28 | 2013-09-06 | Electro Scientific Industries, Inc. | Method and apparatus for separation of strengthened glass and articles produced thereby |
| JP2015171953A (ja) | 2012-07-11 | 2015-10-01 | 旭硝子株式会社 | 機能性基板の製造方法 |
| KR20150045957A (ko) | 2012-08-21 | 2015-04-29 | 아사히 가라스 가부시키가이샤 | 복합 시트의 절단 방법, 유리 시트의 절단 방법, 복합 시트의 절단편 |
| DE102012110971B4 (de) * | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| EP2969549A1 (en) | 2013-03-14 | 2016-01-20 | Corning Incorporated | Methods for fabricating and cutting flexible glass and polymer composite structures and apparatus |
| WO2014144322A1 (en) * | 2013-03-15 | 2014-09-18 | Kinestral Technologies, Inc. | Laser cutting strengthened glass |
| KR101483746B1 (ko) * | 2013-05-24 | 2015-01-19 | (주)하드램 | 레이저 유리 커팅 시스템 및 이를 이용한 유리 커팅 방법 |
| EP3024616B1 (de) | 2013-07-23 | 2019-04-10 | 3D-Micromac AG | Verfahren und vorrichtung zur trennung eines flachen werkstücks in mehrere teilstücke |
| US9102007B2 (en) | 2013-08-02 | 2015-08-11 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser filamentation within transparent materials |
| US11053156B2 (en) * | 2013-11-19 | 2021-07-06 | Rofin-Sinar Technologies Llc | Method of closed form release for brittle materials using burst ultrafast laser pulses |
| US20150166393A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser cutting of ion-exchangeable glass substrates |
| US20150165560A1 (en) * | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| WO2015108991A2 (en) | 2014-01-17 | 2015-07-23 | Imra America, Inc. | Laser-based modification of transparent materials |
| CN106458693B (zh) | 2014-02-20 | 2020-06-16 | 康宁股份有限公司 | 用于在柔性薄玻璃中切割多个半径的方法和设备 |
| CN106061911B (zh) | 2014-03-04 | 2019-02-12 | 法国圣戈班玻璃厂 | 用于切割被层叠的、超薄的玻璃层的方法 |
| US9757815B2 (en) * | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
| JP7292006B2 (ja) * | 2015-03-24 | 2023-06-16 | コーニング インコーポレイテッド | ディスプレイガラス組成物のレーザ切断及び加工 |
-
2016
- 2016-08-10 KR KR1020187003719A patent/KR102077667B1/ko not_active Expired - Fee Related
- 2016-08-10 MX MX2018001587A patent/MX2018001587A/es unknown
- 2016-08-10 BR BR112017028312-3A patent/BR112017028312B1/pt not_active IP Right Cessation
- 2016-08-10 PL PL16750819T patent/PL3334697T3/pl unknown
- 2016-08-10 JP JP2018506844A patent/JP6552717B2/ja not_active Expired - Fee Related
- 2016-08-10 ES ES16750819T patent/ES2893949T3/es active Active
- 2016-08-10 WO PCT/EP2016/069008 patent/WO2017025550A1/de not_active Ceased
- 2016-08-10 CA CA2991444A patent/CA2991444C/en not_active Expired - Fee Related
- 2016-08-10 EP EP16750819.1A patent/EP3334697B1/de not_active Not-in-force
- 2016-08-10 RU RU2018108198A patent/RU2694089C1/ru active
- 2016-08-10 US US15/741,226 patent/US10759690B2/en not_active Expired - Fee Related
- 2016-08-10 HU HUE16750819A patent/HUE057430T2/hu unknown
- 2016-08-10 CN CN201680001627.6A patent/CN106604898B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| BR112017028312B1 (pt) | 2022-10-11 |
| CA2991444A1 (en) | 2017-02-16 |
| MX2018001587A (es) | 2018-05-22 |
| KR20180030579A (ko) | 2018-03-23 |
| BR112017028312A2 (pt) | 2018-09-04 |
| HUE057430T2 (hu) | 2022-05-28 |
| US20180186678A1 (en) | 2018-07-05 |
| WO2017025550A1 (de) | 2017-02-16 |
| US10759690B2 (en) | 2020-09-01 |
| CN106604898B (zh) | 2021-06-04 |
| CN106604898A (zh) | 2017-04-26 |
| KR102077667B1 (ko) | 2020-02-14 |
| EP3334697B1 (de) | 2021-09-22 |
| ES2893949T3 (es) | 2022-02-10 |
| EP3334697A1 (de) | 2018-06-20 |
| RU2694089C1 (ru) | 2019-07-09 |
| JP2018525309A (ja) | 2018-09-06 |
| CA2991444C (en) | 2020-03-31 |
| JP6552717B2 (ja) | 2019-07-31 |
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