SG10201405742XA - Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece - Google Patents

Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece

Info

Publication number
SG10201405742XA
SG10201405742XA SG10201405742XA SG10201405742XA SG10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA SG 10201405742X A SG10201405742X A SG 10201405742XA
Authority
SG
Singapore
Prior art keywords
multiplicity
wafers
workpiece
simultaneously cutting
cutting
Prior art date
Application number
SG10201405742XA
Inventor
Georg Pietsch
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201405742XA publication Critical patent/SG10201405742XA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B23D57/0023—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires with a plurality of saw wires or saw wires having plural cutting zones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B24B27/0691—Accessories therefor for controlling the feeding or return movement of the saw

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
SG10201405742XA 2013-09-26 2014-09-15 Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece SG10201405742XA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201310219468 DE102013219468B4 (en) 2013-09-26 2013-09-26 A method of simultaneously separating a plurality of slices from a workpiece

Publications (1)

Publication Number Publication Date
SG10201405742XA true SG10201405742XA (en) 2015-04-29

Family

ID=52623649

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201405742XA SG10201405742XA (en) 2013-09-26 2014-09-15 Method For Simultaneously Cutting A Multiplicity Of Wafers From A Workpiece

Country Status (7)

Country Link
US (1) US9333673B2 (en)
JP (1) JP5853081B2 (en)
KR (1) KR101670132B1 (en)
CN (1) CN104511975B (en)
DE (1) DE102013219468B4 (en)
SG (1) SG10201405742XA (en)
TW (1) TWI556933B (en)

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JP6402700B2 (en) * 2015-10-20 2018-10-10 信越半導体株式会社 Work cutting method and wire saw
JP6625926B2 (en) * 2016-04-13 2019-12-25 株式会社ディスコ Wafer processing method
JP6249319B1 (en) * 2017-03-30 2017-12-20 パナソニックＩｐマネジメント株式会社 Saw wire and cutting device
WO2018203448A1 (en) * 2017-05-02 2018-11-08 信越半導体株式会社 Workpiece cutting method and joining member
JP6751900B2 (en) * 2018-01-29 2020-09-09 パナソニックＩｐマネジメント株式会社 Metal wire and saw wire
DE102018218016A1 (en) 2018-10-22 2020-04-23 Siltronic Ag Method and device for simultaneously separating a plurality of disks from a workpiece
JP7266398B2 (en) * 2018-12-11 2023-04-28 株式会社ディスコ Wafer processing method using cutting device and cutting device
DE102018221922A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon
DE102018221921A1 (en) * 2018-12-17 2020-06-18 Siltronic Ag Method for manufacturing semiconductor wafers using a wire saw
CN109676811A (en) * 2018-12-27 2019-04-26 江苏纳沛斯半导体有限公司 A kind of segmentizing unit for semiconductor crystal wafer production
DE102019207719A1 (en) * 2019-05-27 2020-12-03 Siltronic Ag Method for severing a multiplicity of wafers from workpieces during a number of severing operations by means of a wire saw and semiconductor wafer made of monocrystalline silicon
EP3858569A1 (en) 2020-01-28 2021-08-04 Siltronic AG Method for separating a plurality of slices from workpieces by means of a wire saw during a sequence of separation operations
CN111590770B (en) * 2020-06-12 2024-09-06 大连连城数控机器股份有限公司 Single silicon rod diamond wire squarer
EP3943265A1 (en) 2020-07-21 2022-01-26 Siltronic AG Method and device for simultaneously separating a plurality of plates from a workpiece
EP4047635A1 (en) 2021-02-18 2022-08-24 Siltronic AG Method of manufacturing wafers from a cylindrical rod of semiconductor material
CN114193644B (en) * 2021-12-27 2024-06-07 烟台力凯数控科技有限公司 Wire cutting operation method
CN114714525B (en) * 2022-03-18 2023-09-05 浙江晶盛机电股份有限公司 Parallel line detection method, parallel line detection optical device and parallel line detection system
CN114420446B (en) * 2022-03-29 2022-08-16 绵阳聚贤自动化设备有限公司 Winding pin manufacturing process of network filter
CN115070974A (en) * 2022-07-11 2022-09-20 台州市双辉机械设备有限公司 Multi-wire cutting process for tuning fork on resonator
CN115791536A (en) * 2022-11-08 2023-03-14 西安奕斯伟材料科技有限公司 System and method for inspecting contamination particles in wire slots of a rotating shaft of a multi-wire saw

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Also Published As

Publication number Publication date
DE102013219468B4 (en) 2015-04-23
JP2015066677A (en) 2015-04-13
KR101670132B1 (en) 2016-10-27
CN104511975A (en) 2015-04-15
KR20150034658A (en) 2015-04-03
TW201511909A (en) 2015-04-01
TWI556933B (en) 2016-11-11
US9333673B2 (en) 2016-05-10
US20150083104A1 (en) 2015-03-26
JP5853081B2 (en) 2016-02-09
CN104511975B (en) 2016-10-12
DE102013219468A1 (en) 2015-03-26

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