SG10201400611VA - Method For Polishing A Semiconductor Material Wafer - Google Patents

Method For Polishing A Semiconductor Material Wafer

Info

Publication number
SG10201400611VA
SG10201400611VA SG10201400611VA SG10201400611VA SG10201400611VA SG 10201400611V A SG10201400611V A SG 10201400611VA SG 10201400611V A SG10201400611V A SG 10201400611VA SG 10201400611V A SG10201400611V A SG 10201400611VA SG 10201400611V A SG10201400611V A SG 10201400611VA
Authority
SG
Singapore
Prior art keywords
polishing
semiconductor material
material wafer
wafer
semiconductor
Prior art date
Application number
SG10201400611VA
Inventor
Schwandner Jürgen
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201400611VA publication Critical patent/SG10201400611VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
SG10201400611VA 2013-03-19 2014-03-13 Method For Polishing A Semiconductor Material Wafer SG10201400611VA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201310204839 DE102013204839A1 (en) 2013-03-19 2013-03-19 Method of polishing a wafer of semiconductor material

Publications (1)

Publication Number Publication Date
SG10201400611VA true SG10201400611VA (en) 2014-10-30

Family

ID=51484645

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201400611VA SG10201400611VA (en) 2013-03-19 2014-03-13 Method For Polishing A Semiconductor Material Wafer

Country Status (7)

Country Link
US (1) US9193026B2 (en)
JP (1) JP5853041B2 (en)
KR (1) KR101600171B1 (en)
CN (1) CN104064455B (en)
DE (1) DE102013204839A1 (en)
SG (1) SG10201400611VA (en)
TW (1) TWI566287B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016092247A (en) * 2014-11-06 2016-05-23 株式会社ディスコ Method for polishing silicon carbide substrate
JP6635003B2 (en) * 2016-11-02 2020-01-22 株式会社Sumco Method for polishing both sides of semiconductor wafer
DE102016222063A1 (en) * 2016-11-10 2018-05-17 Siltronic Ag Method for polishing both sides of a semiconductor wafer
JP6327329B1 (en) * 2016-12-20 2018-05-23 株式会社Sumco Silicon wafer polishing method and silicon wafer manufacturing method
JP6635088B2 (en) * 2017-04-24 2020-01-22 信越半導体株式会社 Polishing method of silicon wafer
JP6747376B2 (en) * 2017-05-15 2020-08-26 信越半導体株式会社 Silicon wafer polishing method
CN109290853B (en) * 2017-07-24 2021-06-04 蓝思科技（长沙）有限公司 Preparation method of ultrathin sapphire sheet
CN111095491B (en) * 2017-08-31 2023-05-30 胜高股份有限公司 Double-sided polishing method for silicon wafer
JP6844530B2 (en) * 2017-12-28 2021-03-17 株式会社Sumco Work double-sided polishing device and double-sided polishing method
DE102018202059A1 (en) * 2018-02-09 2019-08-14 Siltronic Ag Method for polishing a semiconductor wafer
CN109605207A (en) * 2018-12-27 2019-04-12 西安奕斯伟硅片技术有限公司 Wafer processing method and device

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DE102009030292B4 (en) * 2009-06-24 2011-12-01 Siltronic Ag Method for polishing both sides of a semiconductor wafer
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Also Published As

Publication number Publication date
JP5853041B2 (en) 2016-02-09
CN104064455B (en) 2018-02-06
KR20140114791A (en) 2014-09-29
US9193026B2 (en) 2015-11-24
DE102013204839A1 (en) 2014-09-25
TWI566287B (en) 2017-01-11
US20140287656A1 (en) 2014-09-25
CN104064455A (en) 2014-09-24
TW201438087A (en) 2014-10-01
KR101600171B1 (en) 2016-03-04
JP2014180753A (en) 2014-09-29

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