SG10201401250YA - Method For Polishing Semiconductor Wafers By Means Of Simultaneous Double-Side Polishing - Google Patents

Method For Polishing Semiconductor Wafers By Means Of Simultaneous Double-Side Polishing

Info

Publication number
SG10201401250YA
SG10201401250YA SG10201401250YA SG10201401250YA SG10201401250YA SG 10201401250Y A SG10201401250Y A SG 10201401250YA SG 10201401250Y A SG10201401250Y A SG 10201401250YA SG 10201401250Y A SG10201401250Y A SG 10201401250YA SG 10201401250Y A SG10201401250Y A SG 10201401250YA
Authority
SG
Singapore
Prior art keywords
polishing
semiconductor wafers
simultaneous double
side polishing
polishing semiconductor
Prior art date
Application number
SG10201401250YA
Inventor
Baumann Rainer
Staudhammer Johannes
Heilmaier Alexander
Mistur Leszek
Klaus Röttger Dr
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG10201401250YA publication Critical patent/SG10201401250YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
SG10201401250YA 2013-04-12 2014-04-04 Method For Polishing Semiconductor Wafers By Means Of Simultaneous Double-Side Polishing SG10201401250YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013206613.9A DE102013206613B4 (en) 2013-04-12 2013-04-12 Method for polishing semiconductor wafers by means of simultaneous two-sided polishing

Publications (1)

Publication Number Publication Date
SG10201401250YA true SG10201401250YA (en) 2014-11-27

Family

ID=51618384

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201401250YA SG10201401250YA (en) 2013-04-12 2014-04-04 Method For Polishing Semiconductor Wafers By Means Of Simultaneous Double-Side Polishing

Country Status (7)

Country Link
US (1) US9221149B2 (en)
JP (1) JP5957483B2 (en)
KR (1) KR101604076B1 (en)
CN (1) CN104097134B (en)
DE (1) DE102013206613B4 (en)
SG (1) SG10201401250YA (en)
TW (1) TWI521587B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013201663B4 (en) * 2012-12-04 2020-04-23 Siltronic Ag Process for polishing a semiconductor wafer
DE102015220090B4 (en) 2015-01-14 2021-02-18 Siltronic Ag Method for dressing polishing cloths
WO2016196216A1 (en) * 2015-05-29 2016-12-08 Sunedison Semiconductor Limited Methods for processing semiconductor wafers having a polycrystalline finish
SG11201806747QA (en) * 2016-02-16 2018-09-27 Shin Etsu Handotai Co Ltd Double-side polishing method and double-side polishing apparatus
JP7232763B2 (en) * 2016-12-21 2023-03-03 スリーエム イノベイティブ プロパティズ カンパニー Pad conditioner with spacer and wafer planarization system
CN108400081A (en) * 2017-02-08 2018-08-14 上海新昇半导体科技有限公司 The production method of silicon chip
KR102561647B1 (en) * 2018-05-28 2023-07-31 삼성전자주식회사 Conditioner and chemical mechanical polishing apparatus including the same
CN109551360B (en) * 2018-12-27 2020-07-28 西安奕斯伟硅片技术有限公司 Method and apparatus for dressing polishing pad, and double-side polishing apparatus
JP2020171996A (en) * 2019-04-11 2020-10-22 信越半導体株式会社 Double-sided polishing method
JP7308074B2 (en) * 2019-05-14 2023-07-13 東京エレクトロン株式会社 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
CN113561052A (en) * 2021-07-19 2021-10-29 山西汇智博科科技发展有限公司 Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof
CN113561051B (en) * 2021-07-28 2022-04-19 上海申和投资有限公司 Wafer regeneration processing device and control system

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US5538460A (en) * 1992-01-16 1996-07-23 System Seiko Co., Ltd. Apparatus for grinding hard disk substrates
US5718618A (en) * 1996-02-09 1998-02-17 Wisconsin Alumni Research Foundation Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
JPH1110530A (en) * 1997-06-25 1999-01-19 Shin Etsu Handotai Co Ltd Carrier for both-sided polishing
US6338672B1 (en) * 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
US6206765B1 (en) * 1999-08-16 2001-03-27 Komag, Incorporated Non-rotational dresser for grinding stones
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP3791302B2 (en) * 2000-05-31 2006-06-28 株式会社Ｓｕｍｃｏ Semiconductor wafer polishing method using a double-side polishing apparatus
JP2002217149A (en) * 2001-01-19 2002-08-02 Shin Etsu Handotai Co Ltd Wafer polishing apparatus and method
US6752687B2 (en) * 2001-04-30 2004-06-22 International Business Machines Corporation Method of polishing disks
TWI229381B (en) * 2003-12-11 2005-03-11 Promos Technologies Inc Chemical mechanical polishing apparatus, profile control system and conditioning method of polishing pad thereof
JP4777727B2 (en) * 2005-09-05 2011-09-21 不二越機械工業株式会社 Polishing pad pasting method and polishing pad pasting jig
JP2007069323A (en) * 2005-09-08 2007-03-22 Shinano Denki Seiren Kk Grinding tool for adjusting surface of surface plate and surface adjusting method
JP2007118146A (en) 2005-10-28 2007-05-17 Speedfam Co Ltd Dresser for pad-attached surface of surface plate, and pad-attached surface dressing method
JP4904960B2 (en) * 2006-07-18 2012-03-28 信越半導体株式会社 Carrier for double-side polishing apparatus, double-side polishing apparatus and double-side polishing method using the same
WO2010128631A1 (en) 2009-05-08 2010-11-11 株式会社Sumco Semiconductor wafer polishing method and polishing pad shaping jig
DE102010032501B4 (en) 2010-07-28 2019-03-28 Siltronic Ag Method and device for dressing the working layers of a double-side sanding device
CN102554748B (en) * 2010-12-23 2014-11-05 中芯国际集成电路制造(北京)有限公司 Polishing method
DE102011003006B4 (en) 2011-01-21 2013-02-07 Siltronic Ag A method for providing each a level working layer on each of the two working wheels of a double-sided processing device
CN102229105A (en) * 2011-06-28 2011-11-02 清华大学 Chemically mechanical polishing method
DE102013202488B4 (en) * 2013-02-15 2015-01-22 Siltronic Ag Process for dressing polishing cloths for simultaneous two-sided polishing of semiconductor wafers

Also Published As

Publication number Publication date
TWI521587B (en) 2016-02-11
US20140308878A1 (en) 2014-10-16
DE102013206613A1 (en) 2014-10-16
KR20140123442A (en) 2014-10-22
DE102013206613B4 (en) 2018-03-08
JP5957483B2 (en) 2016-07-27
TW201440135A (en) 2014-10-16
CN104097134B (en) 2017-05-17
CN104097134A (en) 2014-10-15
US9221149B2 (en) 2015-12-29
JP2014207450A (en) 2014-10-30
KR101604076B1 (en) 2016-03-16

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