CN113561052A - Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof - Google Patents
Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof Download PDFInfo
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- CN113561052A CN113561052A CN202110811311.6A CN202110811311A CN113561052A CN 113561052 A CN113561052 A CN 113561052A CN 202110811311 A CN202110811311 A CN 202110811311A CN 113561052 A CN113561052 A CN 113561052A
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- 238000005498 polishing Methods 0.000 title claims abstract description 118
- 239000000428 dust Substances 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000004576 sand Substances 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000005086 pumping Methods 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 12
- 239000000463 material Substances 0.000 description 5
- 238000007517 polishing process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/02—Bench grinders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/04—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of solid grinding, polishing or lapping agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a semiconductor processing grinding and polishing machine with a dust removal structure and a working method thereof, and relates to the technical field of semiconductor production. The invention comprises a workbench, an adjusting frame and a driving frame, wherein the adjusting frame is in sliding fit with the driving frame; the surface of the adjusting frame is provided with a polishing pressure plate, a plurality of polishing wheels are arranged in the workbench, and the polishing wheels and the workbench are matched with each other. According to the invention, the polishing pressure plate and the polishing disk are arranged, and the wafer to be polished is placed in the polishing pressure plate and the polishing disk by utilizing the position relation of the polishing pressure plate and the polishing disk, so that double-side grinding and polishing are carried out, and the grinding efficiency is improved; the grinding vessel is arranged and the polishing sand is filled, so that gaps among the polishing sand particles can be used for absorbing a large amount of scraps generated in the grinding process; in this in-process, when the sweeps spill appears, through setting up the vacuum pump to loop through air flue, dust removal way in with the sweeps suction clean chamber, avoid scattering to the outside, in order to protect operational environment and staff's healthy.
Description
Technical Field
The invention belongs to the technical field of semiconductor production, and particularly relates to a semiconductor processing grinding and polishing machine with a dust removal structure and a working method thereof.
Background
The semiconductor is an important material with the conductivity between a conductor and an insulator at normal temperature, and is widely applied to the fields of integrated circuit production, communication system products, photovoltaic power generation and the like due to the special conductivity; in the semiconductor production process, several processes are required, namely polycrystalline silicon, monocrystalline silicon, silicon ingots and wafers, and particularly the final wafer state, the production of related semiconductor parts can be directly carried out; therefore, the quality of the wafer is critical;
in the prior art, after a wafer is prepared, grinding and polishing are often needed, however, a large amount of scraps are often generated in the grinding and polishing process, and the scraps float in the air and are inhaled by a human body to cause serious damage to the lung and harm the human health; meanwhile, the working environment is influenced, and the working efficiency is reduced; in order to solve the problems, a semiconductor processing grinding and polishing machine with a dust removal structure is designed.
Disclosure of Invention
The invention aims to provide a semiconductor processing grinding and polishing machine with a dust removal structure and a working method thereof, and solves the problem that the working environment and the human health are harmed by scraps generated in the conventional semiconductor wafer grinding and polishing process.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a semiconductor processing grinding and polishing machine with a dust removal structure, which comprises a workbench, an adjusting frame and a driving frame, wherein the upper surface of the workbench is bolted with the driving frame; a plurality of electric hydraulic rods are arranged in the workbench, and the upper end faces of the electric hydraulic rods are bolted with the adjusting frame; the adjusting frame is clamped with the driving frame and is in sliding fit with the driving frame;
the upper surface of the workbench is provided with a working groove, and the inner surface of the working groove is connected with a supporting plate through a bearing; the upper surface of the supporting plate is connected with a plurality of polishing plates in a bearing way; the polishing disc gear disc structure is characterized in that a plurality of tooth grooves are formed in the inner side surface of the working groove; the polishing discs are meshed with the inner side face of the working groove through tooth grooves, namely the supporting disc can drive the polishing discs to rotate simultaneously by utilizing the tooth grooves in the working groove when rotating; the middle section bearing of the adjusting frame is connected with a polishing pressure plate, the polishing pressure plate is opposite to the working groove in position and covers the supporting plate and the polishing plate; a grinding vessel is adhered to the upper end face of the polishing disc, and polishing sand is filled in the grinding vessel; the upper surface of the grinding dish is matched with the polishing pressure plate; when the two are attached, polishing sand can be used for simultaneously grinding and polishing the two sides of the wafer;
a cleaning cavity is formed in the workbench, and the cleaning cavity is communicated with the working groove through a dust removal channel; a plurality of air passages are formed in the supporting disc, and the dust removing passage is communicated with the upper part of the supporting disc through the air passages; an air duct is formed in the inner surface of the cleaning cavity, a vacuum pump is connected to one side face of the workbench in a bolted mode and communicated with the air duct through a pipeline, and under the action of the vacuum pump, scraps generated in the grinding and polishing process can enter the cleaning cavity through the air duct and the dust removal duct in sequence; a filter screen is clamped between the air duct and the cleaning cavity.
Furthermore, a sliding groove is formed in one side face of the driving frame and is clamped with the adjusting frame; the upper surface of the adjusting frame is connected with a driving motor in a bolted mode, and the driving motor is located inside the driving frame.
Further, the upper end surface of the rotary shaft of the polishing pressure plate extends to the upper part of the adjusting frame; a chain is arranged between the rotating shaft of the polishing pressure plate and the output shaft of the driving motor, a clamping bolt is adhered to the upper end face of the supporting plate, a clamping groove is formed in the lower surface of the polishing pressure plate, and the clamping groove is clamped with the clamping bolt; wherein through the mutual transmission fit of installation sprocket between diaxon and the chain, can utilize driving motor to drive the polishing pressure disk rotatory, and then utilize the polishing pressure disk to drive the supporting disk rotatory to make polishing dish and polishing pressure disk synchronous opposite rotation, improve the efficiency of grinding and polishing.
The working method of the semiconductor processing grinding and polishing machine with the dust removing structure comprises the following steps:
step one, starting an electric hydraulic rod, and adjusting the height between a polishing platen and a working groove so as to install and fill materials inside;
secondly, paving polishing sand in the grinding vessel, and then placing the wafer to be ground on the surface of the polishing sand;
thirdly, starting the electric hydraulic rod again, and lowering the polishing pressure plate to enable the polishing pressure plate to be attached to the upper surface of the grinding dish, but paying attention to the fact that the polishing pressure plate cannot be compressed so as to avoid damaging the wafer;
and step four, starting the driving motor and the vacuum pump, and pumping the polished scraps to the cleaning cavity by using the vacuum pump while grinding and polishing.
The invention has the following beneficial effects:
according to the invention, the polishing pressure plate and the polishing disk are arranged, and the wafer to be polished is placed in the polishing pressure plate and the polishing disk by utilizing the position relation of the polishing pressure plate and the polishing disk, so that double-side grinding and polishing are carried out, and the grinding efficiency is improved; the grinding vessel is arranged and the polishing sand is filled, so that gaps among the polishing sand particles can be used for absorbing a large amount of scraps generated in the grinding process; in this in-process, when the sweeps spill appears, through setting up the vacuum pump to loop through air flue, dust removal way in with the sweeps suction clean chamber, avoid scattering to the outside, in order to protect operational environment and staff's healthy.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of the overall structure of a semiconductor processing grinding and polishing machine with a dust removing structure according to the present invention;
FIG. 2 is a top view of a semiconductor processing grinder/polisher with dust removal features in accordance with the present invention;
FIG. 3 is a schematic structural view of section A-A in FIG. 2;
FIG. 4 is a partial display view of portion C of FIG. 3;
FIG. 5 is a partial display view of portion D of FIG. 3;
FIG. 6 is a partial display view of portion E of FIG. 3;
FIG. 7 is a schematic structural view of section F-F in FIG. 3;
fig. 8 is a schematic structural view of a section B-B in fig. 2.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a work table; 2. an adjusting bracket; 3. a driving frame; 101. an electro-hydraulic lever; 102. a working groove; 103. a support disc; 1031. a polishing disk; 201. polishing the platen; 104. cleaning the cavity; 105. a dust removal channel; 1032. an airway; 1041. an air duct; 106. a vacuum pump; 301. a chute; 202. a drive motor; 203. a chain; 1033. grinding a dish; 1034. polishing sand; 1035. fastening a bolt; 2011. a card slot; 1042. and (4) a filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1-8, the present invention is a semiconductor processing grinding and polishing machine with a dust removing structure, which includes a worktable 1, an adjusting frame 2 and a driving frame 3, wherein the upper surface of the worktable 1 is bolted to the driving frame 3; a plurality of electric hydraulic rods 101 are arranged in the workbench 1, and the upper end faces of the electric hydraulic rods 101 are bolted with the adjusting frame 2; the adjusting frame 2 is clamped with the driving frame 3, and the adjusting frame 2 is in sliding fit with the driving frame 3;
the upper surface of the workbench 1 is provided with a working groove 102, and the inner surface of the working groove 102 is in bearing connection with a supporting plate 103; the upper surface of the support plate 103 is connected with a plurality of polishing plates 1031 in a bearing manner; a polishing disk 1031 gear disk structure, wherein a plurality of tooth grooves are formed in the inner side surface of the working groove 102; the polishing disks 1031 are meshed with the inner side surface of the working groove 102 through tooth grooves, namely, the supporting disk 103 can drive each polishing disk 1031 to rotate simultaneously by utilizing the tooth grooves in the working groove 102 when rotating; a polishing pressure plate 201 is connected to the middle section of the adjusting frame 2 through a bearing, the polishing pressure plate 201 is opposite to the working groove 102, and the polishing pressure plate covers the supporting plate 103 and the polishing plate 1031; a grinding vessel 1033 is adhered to the upper end surface of the polishing disk 1031, and polishing sand 1034 is filled in the grinding vessel 1033; the upper surface of the grinding pan 1033 is matched with the polishing platen 201; when the two are attached, polishing sand 1034 can be used for simultaneously grinding and polishing the two surfaces of the wafer;
a cleaning cavity 104 is formed in the workbench 1, and the cleaning cavity 104 is communicated with the working groove 102 through a dust removal channel 105; a plurality of air channels 1032 are formed in the supporting disc 103, and the dust removing channel 105 is communicated with the upper part of the supporting disc 103 through the air channels 1032; an air duct 1041 is formed in the inner surface of the cleaning cavity 104, a vacuum pump 106 is bolted to one side surface of the workbench 1, the vacuum pump 106 is communicated with the air duct 1041 through a pipeline, and under the action of the vacuum pump 106, scraps generated in the grinding and polishing process can enter the cleaning cavity 104 through the air duct 1032 and the dust removal duct 105 in sequence; a filter screen 1042 is clamped between the air passage 1041 and the cleaning chamber 104.
Preferably, a sliding groove 301 is formed in one side surface of the driving frame 3, and the sliding groove 301 is clamped with the adjusting frame 2; the upper surface of the adjusting frame 2 is bolted with a driving motor 202, and the driving motor 202 is positioned inside the driving frame 3.
Preferably, the upper end surface of the rotating shaft of the polishing platen 201 extends above the adjusting frame 2; a chain 203 is arranged between the rotating shaft of the polishing pressure plate 201 and the output shaft of the driving motor 202, a clamping bolt 1035 is adhered to the upper end face of the supporting plate 103, a clamping groove 2011 is formed in the lower surface of the polishing pressure plate 201, and the clamping groove 2011 is clamped with the clamping bolt 1035; wherein through the mutual transmission fit of installation sprocket between diaxon and the chain 203, can utilize driving motor 202 to drive polishing pressure disk 201 rotatory, and then utilize polishing pressure disk 201 to drive supporting disk 103 rotatory to make polishing disk 1031 and polishing pressure disk 201 synchronous opposite rotation, improve the efficiency of grinding and polishing.
Example 2:
the working method of the semiconductor processing grinding and polishing machine with the dust removing structure comprises the following steps:
step one, starting an electric hydraulic rod 101, and adjusting the height between a polishing platen 201 and a working groove 102 so as to install and fill materials into the polishing platen;
secondly, paving polishing sand 1034 in the grinding vessel 1033, and then placing the wafer to be ground on the surface of the polishing sand 1034;
thirdly, starting the electric hydraulic rod 101 again, and lowering the polishing platen 201 to enable the polishing platen to be attached to the upper surface of the grinding dish 1033, but paying attention to the fact that the polishing platen cannot be compressed tightly so as to avoid damaging the wafer;
and step four, starting the driving motor 202 and the vacuum pump 106, and pumping the polishing waste scraps to the cleaning cavity 104 by using the vacuum pump 106 while grinding and polishing.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (7)
1. The utility model provides a semiconductor processing grinding and polishing machine with dust removal structure, includes workstation (1), alignment jig (2) and drive frame (3), its characterized in that: the upper surface of the workbench (1) is bolted with the driving frame (3); a plurality of electric hydraulic rods (101) are arranged in the workbench (1), and the upper end faces of the electric hydraulic rods (101) are bolted with the adjusting frame (2); the adjusting frame (2) is clamped with the driving frame (3), and the adjusting frame (2) is in sliding fit with the driving frame (3);
a working groove (102) is formed in the upper surface of the workbench (1), and a supporting plate (103) is connected to the inner surface of the working groove (102) in a bearing mode; the upper surface of the supporting disc (103) is connected with a plurality of polishing discs (1031) in a bearing way; the polishing disc (1031) is of a gear disc structure, and a plurality of tooth grooves are formed in the inner side surface of the working groove (102); the polishing disc (1031) is meshed with the inner side face of the working groove (102) through a tooth groove; the middle section of the adjusting frame (2) is connected with a polishing pressure plate (201) in a bearing mode, the polishing pressure plate (201) is opposite to the position of the working groove (102) and covers the supporting plate (103) and the polishing plate (1031);
a cleaning cavity (104) is formed in the workbench (1), and the cleaning cavity (104) is communicated with the working groove (102) through a dust removal channel (105); a plurality of air passages (1032) are formed in the supporting disc (103), and the dust removing channel (105) is communicated with the upper part of the supporting disc (103) through the air passages (1032); an air duct (1041) is formed in the inner surface of the cleaning cavity (104), a vacuum pump (106) is bolted to one side face of the workbench (1), and the vacuum pump (106) is communicated with the air duct (1041) through a pipeline.
2. The semiconductor processing grinding and polishing machine with the dust removal structure as claimed in claim 1, wherein a sliding groove (301) is formed in one side surface of the driving frame (3), and the sliding groove (301) is clamped with the adjusting frame (2); the upper surface of the adjusting frame (2) is bolted with a driving motor (202), and the driving motor (202) is positioned inside the driving frame (3).
3. The semiconductor processing grinding and polishing machine with the dust removing structure as claimed in claim 2, characterized in that the upper end face of the rotating shaft of the polishing platen (201) extends to above the adjusting frame (2); and a chain (203) is arranged between the rotary shaft of the polishing pressure plate (201) and the output shaft of the driving motor (202).
4. The semiconductor processing grinding and polishing machine with the dust removing structure of claim 3, characterized in that a grinding pan (1033) is adhered to the upper end face of the polishing disk (1031), and the grinding pan (1033) is filled with polishing sand (1034) inside; the upper surface of the grinding dish (1033) is matched with the polishing pressing plate (201).
5. The semiconductor processing grinding and polishing machine with the dust removing structure of claim 4, wherein a latch (1035) is adhered to the upper end face of the supporting plate (103), a clamping groove (2011) is formed in the lower surface of the polishing platen (201), and the clamping groove (2011) is clamped with the latch (1035).
6. The semiconductor processing grinding and polishing machine with the dust removing structure of claim 5, wherein a filter screen (1042) is clamped between the air duct (1041) and the cleaning cavity (104).
7. The working method of the semiconductor processing grinding and polishing machine with the dust removal structure is characterized by comprising the following steps of:
step one, starting an electric hydraulic rod (101) and adjusting the height between a polishing platen (201) and a working groove (102);
secondly, paving polishing sand (1034) in the grinding vessel (1033), and then placing the wafer to be ground on the surface of the polishing sand (1034);
thirdly, the electric hydraulic rod (101) is started again, and the polishing platen (201) is placed down to be attached to the upper surface of the grinding dish (1033);
and step four, starting the driving motor (202) and the vacuum pump (106), and pumping the polishing waste scraps to the cleaning cavity (104) by using the vacuum pump (106) while grinding and polishing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811311.6A CN113561052A (en) | 2021-07-19 | 2021-07-19 | Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110811311.6A CN113561052A (en) | 2021-07-19 | 2021-07-19 | Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof |
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| CN113561052A true CN113561052A (en) | 2021-10-29 |
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| CN202110811311.6A Pending CN113561052A (en) | 2021-07-19 | 2021-07-19 | Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117260526A (en) * | 2023-10-31 | 2023-12-22 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
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2021
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| JPH0547723A (en) * | 1991-08-16 | 1993-02-26 | Furukawa Electric Co Ltd:The | Carrier for double side polishing |
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| CN211728758U (en) * | 2020-01-08 | 2020-10-23 | 深圳市新顺鑫科技有限公司 | Ultra-precise high-efficiency silicon wafer double-side grinding equipment |
| CN212553370U (en) * | 2020-06-17 | 2021-02-19 | 昆山市誉特展精密钨钢模具有限公司 | Automobile fastener polishing equipment with high dust absorption effect |
| CN112355759A (en) * | 2020-12-07 | 2021-02-12 | 江苏力星通用钢球股份有限公司 | Planetary gear set mechanism for grinding double end faces of precise cylindrical roller |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117260526A (en) * | 2023-10-31 | 2023-12-22 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
| CN117260526B (en) * | 2023-10-31 | 2024-06-14 | 南通星维海威精密机械有限公司 | Grinding equipment and grinding method for pressure valve |
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
| CN117564917B (en) * | 2024-01-15 | 2024-04-02 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
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