CN212553359U - Automatic oilstone correcting device for silicon wafer grinding equipment consolidation grinding disc - Google Patents
Automatic oilstone correcting device for silicon wafer grinding equipment consolidation grinding disc Download PDFInfo
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- CN212553359U CN212553359U CN202021347926.5U CN202021347926U CN212553359U CN 212553359 U CN212553359 U CN 212553359U CN 202021347926 U CN202021347926 U CN 202021347926U CN 212553359 U CN212553359 U CN 212553359U
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Abstract
The utility model relates to a silicon chip grinding device's consolidation abrasive pad's correction processing field, specifically be a silicon chip grinding device consolidates oilstone automatic correction device for mill, including coaxial last abrasive disc system that sets up, abrasive disc system down and a plurality of maintenance wheel that sets up between last abrasive disc system and the abrasive disc system down, the last equipartition of maintenance wheel has a plurality of holes of placing that run through, the oilstone post has been placed in this hole of placing, the both ends face of oilstone post vertical direction is contradicted with last abrasive disc system and abrasive disc system down respectively and is set up, it adopts the oilstone post to replace traditional stereoplasm cast iron nodular grinding correction dish, grind the consolidation abrasive pad of pasting at last abrasive disc system and abrasive disc system down and revise through the oilstone post, with less volume of getting rid of, make consolidation abrasive pad reach preset correction precision fast, effectively reduce manufacturing cost, replace the grinding fluid of configuration with pure water and appropriate amount of grinding aid simultaneously, the problem of the water pollution that current grinding equipment produced when revising is solved.
Description
Technical Field
The utility model relates to a processing field is revised to silicon chip grinding equipment, specifically is a silicon chip grinding equipment concreties oilstone automatic correction device for mill.
Background
Silicon wafer grinding is one of important processes in silicon wafer processing, generally adopts a double-side grinding mode, and mainly has the main functions of removing tool marks on the surface of a silicon wafer, finishing thickness deviation, improving flatness and obtaining a uniform and consistent surface damage layer; the main principle is that a silicon wafer is placed between grinding discs which are very flat up and down, certain pressure is applied, and the grinding discs and the silicon wafer move relatively while grinding fluid is added, so that micro-cutting on the surface of the silicon wafer is completed.
The silicon wafer grinding disc is made of hard nodular cast iron, is a forming tool for grinding the surface and a carrier for bearing grinding materials, and is provided with uniform lattice-shaped grooves on the surface, so that the grinding materials can flow uniformly, and can be supplied and discharged conveniently. When the surface material of the silicon wafer is removed, the grinding disc is also worn correspondingly, and in order to ensure the flatness of the silicon wafer and prevent grinding damage and the like, the flatness of the grinding disc must be ensured and maintained, so the surface of the grinding disc must be trimmed after a certain time or a certain amount of silicon wafer processing. The existing method for trimming the silicon wafer grinding disc mainly comprises the steps of trimming by using a disc-shaped trimming wheel matched with a grinding machine, wherein the material of the trimming wheel is cast iron which is the same as that of the grinding disc, uniformly placing 3-5 trimming wheels with the same specification on the grinding disc when the grinding disc is trimmed, simultaneously uniformly adding grinding liquid prepared by grinding sand, water and grinding aid, and taking the external diameter phi 1355mm of the grinding disc of a 20B grinding machine as an example when the grinding disc is trimmed for about 2-3 hours each time. The dressing method has the problems that a certain amount of prepared grinding fluid is needed, the environment is polluted to a certain degree, and the cast iron material are mutually dressed, so that the efficiency is low, the dressing precision is not high, the loss of a grinding disc is too large, and the like.
Therefore, the innovative silicon wafer grinding disc finishing method realizes the finishing effect of high precision, high efficiency and green cleaning, and has important practical significance for improving the technical level of high-precision shape control of the silicon wafer grinding disc, enriching the silicon wafer grinding disc finishing method, improving the quality of the ground surface of the silicon wafer and reducing the production cost.
The patent application number CN201822053269.2 discloses a quartz crystal wafer grinder with self-correcting function, which comprises a worktable, an upper grinding disc, a lower grinding disc, an upright post and a control panel; the center of the lower grinding disc is provided with a rotating shaft, the rotating shaft is arranged at the center of the upper surface of the workbench, the upright post is in an inverted L shape, the bottom of the upright post is arranged on one side of the upper surface of the workbench, the top of the upright post is connected with the rotating shaft of the upper grinding disc through an air cylinder, and the control panel is arranged on the other side of the upper surface of the workbench; the rotating shafts of the upper grinding disc and the lower grinding disc are coaxial. The utility model has the advantages that: the sun gear is driven to revolve and rotate by the central gear ring and the outer gear ring together, and the quartz crystal wafer is ground by the upper grinding disc and the lower grinding disc at the same time, so that the efficiency is high; the self-adaptive finishing grinding disc has the advantages of scientific design, strong practicability, convenient use, high efficiency of disc finishing and the like, and the technical problems of high precision, high efficiency, green cleanness are not solved in the patent literature.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a silicon chip grinding device consolidates oilstone automatic correction device for mill, more traditional correction device, it adopts the oilstone post to replace traditional stereoplasm nodular cast iron to grind the correction disk, grind the correction to pasting the consolidation abrasive material pad of last abrasive disk system under and at abrasive disk system through the oilstone post, with less volume of getting rid of, make consolidation abrasive material pad reach predetermined correction precision fast, effectively reduce production cost, replace the lapping liquid of configuration with pure water and proper amount grinding aid simultaneously, solve the water pollution problem that current grinding device produced when revising.
In order to achieve the above object, the utility model provides a following technical scheme:
an automatic oilstone correcting device for a consolidation grinding disc of silicon wafer grinding equipment comprises an upper grinding disc system, a lower grinding disc system and a plurality of finishing wheels, wherein the upper grinding disc system and the lower grinding disc system are coaxially arranged, the finishing wheels are arranged between the upper grinding disc system and the lower grinding disc system, the upper grinding disc system and the lower grinding disc system rotate in opposite directions, a liquid supply system for supplying grinding liquid is arranged on the upper grinding disc system, a planetary gear linkage system is arranged between the lower grinding disc system and the finishing wheels, and the finishing wheels rotate around the central axis of the finishing wheels while revolving around the central axis of the lower grinding disc system through the planetary gear linkage system;
the trimming wheel is uniformly provided with a plurality of through placing holes, oilstone columns are placed in the placing holes, and two end faces of the oilstone columns in the vertical direction are respectively abutted to the upper grinding disc system and the lower grinding disc system.
As an improvement, the end faces of the upper grinding disk system and the lower grinding disk system, which are contacted with the dressing wheel, are provided with consolidated abrasive pads.
As a modification, the placing holes on the dressing wheel comprise inner placing holes and outer placing holes which are arranged at equal intervals along the circumference of the central axis of the dressing wheel.
As an improvement, the trimming wheel is respectively provided with a plurality of chip grooves which are arranged in a circumferential and equidistant way on the end surfaces of two sides of the upper grinding disc system and the lower grinding disc system which are contacted with each other.
As a refinement, the chip flutes are arranged in the radial direction of the dressing wheel.
As a modification, the chip grooves are communicated with the placing holes distributed in the radial direction along the radial direction of the dressing wheel.
As an improvement, the planetary gear linkage system comprises:
the central main shaft vertically penetrates through the middle line position of the lower grinding disc system and drives the upper grinding disc system to horizontally rotate;
the sun gear is sleeved on the central main shaft and synchronously rotates along with the central main shaft;
the gear ring is coaxially arranged with the central spindle and fixedly arranged at the outer circumference of the lower grinding disc system; and
and the planetary gears and the trimming wheels are arranged in a one-to-one correspondence manner, are arranged on the outer circumferences of the trimming wheels, and are respectively meshed with the sun gear and the gear ring.
As an improvement, the upper end part of the central main shaft is arranged in a spline head mode, and the spline head is correspondingly inserted into a spline groove in the central position of the upper grinding disc system.
The beneficial effects of the utility model reside in that:
(1) the utility model discloses more traditional correcting unit, it adopts the oilstone post to replace traditional stereoplasm nodular cast iron to grind the correction dish, grinds the correction to the consolidation abrasive material pad of pasting at last abrasive disc system and lower abrasive disc system through the oilstone post, with less volume of getting rid of, makes consolidation abrasive material pad reach preset correction precision fast, effectively reduces manufacturing cost, replaces the lapping liquid of configuration with pure water and proper amount grinding aid simultaneously, solves the water pollution problem that current grinding equipment produced when revising;
(2) the utility model discloses an utilize and all seted up the chip groove on the both sides terminal surface of dresser wheel and last abrasive disc system and lower abrasive disc system contact, grind the sweeps that revises the in-process and produce through the chip groove with the oilstone post and outwards discharge, avoid the sweeps to concentrate on between dresser wheel and consolidation abrasive pad, lead to grinding the correction precision and descend.
To sum up, the utility model has the advantages of grind correction precision height, efficient fast, clean pollution-free, be particularly useful for silicon chip grinding equipment's consolidation grinding apparatus's correction processing field.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention showing a local fracture;
FIG. 2 is a schematic view of the three-dimensional structure of the lower grinding pan system of the present invention;
FIG. 3 is a schematic view of a partial structure of the upper grinding plate system of the present invention;
FIG. 4 is a schematic view of the three-dimensional structure of the dressing wheel of the present invention;
fig. 5 is a schematic structural view of the planetary gear linkage system of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Example (b):
as shown in fig. 1 to 4, an automatic oilstone correcting device for a fixed grinding disc of a silicon wafer grinding device comprises an upper grinding disc system 1, a lower grinding disc system 2 and a plurality of dressing wheels 3 arranged between the upper grinding disc system 1 and the lower grinding disc system 2, which are coaxially arranged, wherein the upper grinding disc system 1 and the lower grinding disc system 2 rotate in opposite directions, a liquid supply system for supplying grinding liquid is arranged on the upper grinding disc system 1, a planetary gear linkage system 5 is arranged between the lower grinding disc system 2 and the dressing wheels 3, and the dressing wheels 3 revolve around the central axis of the lower grinding disc system 2 through the planetary gear linkage system 5 while the dressing wheels 3 revolve around the central axis of the lower grinding disc system 2;
a plurality of through placing holes 31 are uniformly distributed on the dressing wheel 3, oilstone columns 6 are placed in the placing holes 31, and two end faces of the oilstone columns 6 in the vertical direction are respectively abutted to the upper grinding disc system 1 and the lower grinding disc system 2.
The end surfaces of the upper grinding disk system 1 and the lower grinding disk system 2, which are in contact with the dressing wheel 3, are provided with consolidated abrasive pads 21, and the consolidated abrasive pads 21 are pad-type grinding structures which fixedly concentrate granular grinding materials on carriers.
Further, the placing holes 31 of the dressing wheel 3 include inner placing holes 311 and outer placing holes 312 arranged at equal intervals along the circumference of the central axis of the dressing wheel 3, and the material of the dressing wheel 3 is preferably epoxy resin, which can be well matched with the fixed abrasive pad without damaging the surface of the fixed abrasive pad.
In addition, the trimming wheel 3 is provided with a plurality of chip grooves 32 which are arranged in a circumferential and equidistant manner on the end surfaces of two sides of the upper grinding disk system 1 and the lower grinding disk system 2 which are contacted with each other.
Further, the chip grooves 32 are arranged in the radial direction of the dresser wheel 3.
Furthermore, the chip grooves 32 are connected with the radially distributed placement holes 31 along the radial direction of the dressing wheel 3.
It should be noted that, the oilstone is fine and tough, can be used as a grinding tool, and is the first material for precision grinding of machine manufacturing, mold manufacturing, and instruments, and the oilstone is more suitable for the correction grinding process of the bonded grinding tool of silicon wafer grinding equipment than hard nodular cast iron.
The utility model discloses a hole 31 is placed in setting up on correction wheel 3, places oilstone post 6 in placing hole 31, utilizes the revolution and the rotation of correction wheel 3, drives oilstone post 6 and last abrasive disc system 1's the grinding end face and the consolidation abrasive material pad 21 of abrasive disc system 2 down and grinds, opens the cutting edge of a knife or a sword, goes up the impurity processing, improves the grinding precision of the last consolidation abrasive material pad of abrasive disc system 1 and lower abrasive disc system 2.
Further, in order to improve the precision of grinding correction, in the grinding process, the chip discharge groove 32 is formed in the correction wheel 3, impurities are discharged outwards through the chip discharge groove 32, and the phenomenon that the grinding correction precision is reduced due to the fact that waste chips are concentrated between the correction wheel and the fixed abrasive pad is avoided.
As shown in fig. 5, as a preferred embodiment, the planetary gear linkage system 5 includes:
the central spindle 51 is vertically arranged at the central line position of the lower grinding disc system 2 in a penetrating manner, and drives the upper grinding disc system 1 to horizontally rotate;
the sun gear 52 is sleeved on the central main shaft 51 and synchronously rotates along with the central main shaft 51;
a ring gear 53, wherein the ring gear 53 is arranged coaxially with the central spindle 51 and is fixedly arranged at the outer circumference of the lower grinding disc system 2; and
The upper end of the central spindle 51 is provided with a spline head 511, which is inserted into the spline groove 11 at the central position of the upper grinding disc system 1.
It should be noted that, the upper polishing disk system 1 and the lower polishing disk system 2 are driven by the central spindle 51 to rotate in opposite directions, wherein the lower polishing disk system 2 is driven by a separately provided driving mechanism to rotate, the driving mechanism may be a power device such as a motor that can drive the lower polishing disk system 2 to rotate independently, and the correction wheel 3 revolves around the central axis of the lower polishing system 2, and at the same time, the correction wheel 3 rotates around its own axis, so that the correction wheel 3 and the upper polishing disk system 1 and the lower polishing disk system 2 have relative displacement.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. An automatic oilstone correcting device for a consolidation grinding disc of silicon wafer grinding equipment comprises an upper grinding disc system (1), a lower grinding disc system (2) and a plurality of finishing wheels (3) which are coaxially arranged, wherein the finishing wheels (3) are arranged between the upper grinding disc system (1) and the lower grinding disc system (2), the automatic oilstone correcting device is characterized in that the upper grinding disc system (1) and the lower grinding disc system (2) rotate in opposite directions, a liquid supply system for supplying grinding liquid is arranged on the upper grinding disc system (1), a planetary gear linkage system (5) is arranged between the lower grinding disc system (2) and the finishing wheels (3), and the finishing wheels (3) revolve around the central axis of the lower grinding disc system (2) through the planetary gear linkage system (5) and rotate around the central axis of the finishing wheels (3);
a plurality of through placing holes (31) are uniformly distributed in the dressing wheel (3), oilstone columns (6) are placed in the placing holes (31), and two end faces of the oilstone columns (6) in the vertical direction are respectively abutted to the upper grinding disc system (1) and the lower grinding disc system (2).
2. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 1, characterized in that the consolidation abrasive pad (21) is arranged on the end face of the upper grinding disc system (1) and the end face of the lower grinding disc system (2) which are contacted with the dressing wheel (3).
3. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 1, characterized in that the placing holes (31) on the dressing wheel (3) comprise inner placing holes (311) and outer placing holes (312) which are equidistantly arranged along the circumference of the central axis of the dressing wheel (3).
4. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 1, characterized in that the two side end faces of the dressing wheel (3) contacting the upper grinding disc system (1) and the lower grinding disc system (2) are respectively provided with a plurality of circumferentially equidistantly arranged chip grooves (32).
5. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 4, characterized in that the chip grooves (32) are arranged along the radial direction of the dressing wheel (3).
6. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 4, characterized in that the chip grooves (32) are communicated with the radially distributed placing holes (31) along the radial direction of the dressing wheel (3).
7. The automatic oilstone correction device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 1, characterized in that the planetary gear linkage system (5) comprises:
the central spindle (51) vertically penetrates through the center line of the lower grinding disc system (2) and drives the upper grinding disc system (1) to horizontally rotate;
the sun gear (52) is sleeved on the central main shaft (51) and synchronously rotates along with the central main shaft (51);
a gear ring (53), wherein the gear ring (53) is arranged coaxially with the central spindle (51) and is fixedly arranged at the outer circumference of the lower grinding disc system (2); and
and the planetary gears (54) are arranged in one-to-one correspondence with the trimming wheels (3), are arranged on the outer circumferences of the trimming wheels (3), and are meshed with the sun gear (52) and the ring gear (53) respectively.
8. The automatic oilstone correcting device for the consolidation grinding disc of the silicon wafer grinding equipment as recited in claim 7, characterized in that the upper end of the central spindle (51) is provided with a spline head (511) which is correspondingly inserted into a spline groove (11) at the central position of the upper grinding disc system (1).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021347926.5U CN212553359U (en) | 2020-07-10 | 2020-07-10 | Automatic oilstone correcting device for silicon wafer grinding equipment consolidation grinding disc |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202021347926.5U CN212553359U (en) | 2020-07-10 | 2020-07-10 | Automatic oilstone correcting device for silicon wafer grinding equipment consolidation grinding disc |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113714935A (en) * | 2021-08-16 | 2021-11-30 | 蚌埠高华电子股份有限公司 | Automatic polishing pad correction equipment and use method thereof |
| CN115284161A (en) * | 2022-07-04 | 2022-11-04 | 上海中欣晶圆半导体科技有限公司 | Grinding disc processing method for reducing TTV (time to live) of wafer |
| CN117207069A (en) * | 2023-11-08 | 2023-12-12 | 苏州博宏源机械制造有限公司 | Wafer polishing disc surface correction device and method |
-
2020
- 2020-07-10 CN CN202021347926.5U patent/CN212553359U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113714935A (en) * | 2021-08-16 | 2021-11-30 | 蚌埠高华电子股份有限公司 | Automatic polishing pad correction equipment and use method thereof |
| CN113714935B (en) * | 2021-08-16 | 2022-07-12 | 蚌埠高华电子股份有限公司 | Automatic polishing pad correction equipment and use method thereof |
| CN115284161A (en) * | 2022-07-04 | 2022-11-04 | 上海中欣晶圆半导体科技有限公司 | Grinding disc processing method for reducing TTV (time to live) of wafer |
| CN115284161B (en) * | 2022-07-04 | 2024-03-01 | 上海中欣晶圆半导体科技有限公司 | Abrasive disc processing method for reducing TTV of wafer |
| CN117207069A (en) * | 2023-11-08 | 2023-12-12 | 苏州博宏源机械制造有限公司 | Wafer polishing disc surface correction device and method |
| CN117207069B (en) * | 2023-11-08 | 2024-01-23 | 苏州博宏源机械制造有限公司 | Wafer polishing disc surface correction device and method |
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