CN108311959A - A kind of non-magnetic plane polishing device and polishing method - Google Patents

A kind of non-magnetic plane polishing device and polishing method Download PDF

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Publication number
CN108311959A
CN108311959A CN201810125489.3A CN201810125489A CN108311959A CN 108311959 A CN108311959 A CN 108311959A CN 201810125489 A CN201810125489 A CN 201810125489A CN 108311959 A CN108311959 A CN 108311959A
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CN
China
Prior art keywords
polishing
magnetic
dynamometer
polishing body
matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810125489.3A
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Chinese (zh)
Inventor
刘顺
许召宽
韩冰
刘冬冬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Science and Technology Liaoning USTL
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University of Science and Technology Liaoning USTL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Science and Technology Liaoning USTL filed Critical University of Science and Technology Liaoning USTL
Priority to CN201810125489.3A priority Critical patent/CN108311959A/en
Publication of CN108311959A publication Critical patent/CN108311959A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/005Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using a magnetic polishing agent

Abstract

The present invention relates to non-magnetic mirror polish technical field more particularly to a kind of non-magnetic plane polishing devices.Including upper polishing body, lower polishing body, support device, dynamometer;Upper polishing body, lower polishing body, support device, dynamometer are set gradually from top to bottom, and dynamometer is fixed on milling machine table, and support device is fixed on dynamometer, and lower polishing body is mounted in support device, and upper polishing body is fixed in the shaft of milling machine;Upper polishing body is rotated with lower polishing body by magnetic coupling coaxial synchronous, and dynamometer measures normal force and torque, and then adjusts workpiece and pole pitch and rotating speed.The present invention is suitable for non-magnetic plane, can effectively be handled the non-magnetic plane that can not be polished using magnetic grinding method;It is at low cost, efficient;The polishing to entire workpiece is completed by the scraping of " magnetic force brush ", rolling effect, ensure that the surface quality and flatness of workpiece.

Description

A kind of non-magnetic plane polishing device and polishing method
Technical field
The present invention relates to non-magnetic mirror polish technical field more particularly to a kind of non-magnetic plane polishing devices.
Background technology
Plane polishing refers to that flat work pieces are carried out Ultra-precision Turning, dispels the cut of workpiece surface, spot, and turned-down edge is existing As keeping workpiece surface bright, smoothly, at mirror effect, the polishing of plane is processing method common and important in industry, zero diopter The quality of polishing directly affects the surface quality, flatness and workpiece performance of workpiece.The polishing method of plane is mainly divided at present It it is two kinds, first, being polished using milling machine, second is that using hand polish.The quality of milling machine surface polishing quality depends primarily on milling cutter Difference, and polishing cost is very high, cannot be widely applied very much in many fields;Although hand polish can be greatly lowered into This, but the flatness polished cannot be guaranteed.
Invention content
For overcome the deficiencies in the prior art, the present invention provides a kind of non-magnetic plane polishing device.It is at low cost, Ji Nengbao The surface quality and flatness of plane are demonstrate,proved, and can efficiently complete the processing to non-magnetic plane.
In order to achieve the above object, the present invention is realized using following technical scheme:
A kind of non-magnetic plane polishing device, including upper polishing body, lower polishing body, support device and dynamometer;Upper polishing Body, lower polishing body, support device, dynamometer are set gradually from top to bottom, and dynamometer is fixed on milling machine table, support device It is fixed on dynamometer, lower polishing body is mounted in support device, and upper polishing body is fixed in the shaft of milling machine;Upper polishing body with Lower polishing body is rotated by magnetic coupling coaxial synchronous, and dynamometer measures normal force and torque, and then adjusts workpiece and pole pitch And rotating speed.
The upper polishing body includes upper polishing matrix, magnetic pole, abrasive grains;4 magnetic poles according to N-S-N-S clockwise arrangement Mode circumference uniform distribution is adsorbed on after abrasive grains lapping liquid uniform stirring on magnetic pole, upper polishing matrix and milling on polishing matrix Bed main shaft connection, milling machine spindle drive polishing matrix rotation.
The lower polishing body includes lower polishing matrix, magnetic pole, abrasive grains, connector;4 magnetic poles are according to S-N-S- clockwise The arrangement mode circumference uniform distribution of N is adsorbed on after abrasive grains lapping liquid uniform stirring on magnetic pole, lower polishing base on polishing matrix Body is mounted on by bearing on connector, and connector is fixed in support device, and lower polishing matrix can be rotated around own axes.
The support device includes u-bracket, tablet, supporting block;Justify corresponding with plate round hole is equipped at the top of u-bracket Pin, to fixed tablet;U-bracket bottom is equipped with small sircle hole corresponding with dynamometer roundlet pin, to be fixed on dynamometry On meter;U-bracket upper surface fixed support block, supporting block are equipped with connecting pin corresponding with the lower connector mounting hole of polishing body, To the connector of fixed lower polishing body.
The u-bracket is made of transparent material.
The tablet is made of the good metal material of wear-resistant conductive performance.
The dynamometer lower surface is fixed on milling machine table, and upper surface is fixed on u-bracket bottom by roundlet pin Portion.
A kind of polishing method of non-magnetic plane, specifically comprises the following steps:
(1) by non-magnetic clamping workpiece on tablet, abrasive grains are adsorbed on 4 magnetic poles, 4 magnetic poles of upper polishing matrix It is arranged according to N-S-N-S clockwise, lower polishing matrix magnetic pole arrangement mode is complementary with upper polishing matrix;
(2) adjustment magnetic pole is at a distance from workpiece, pole pitch workpiece surface 1-2mm;
(3) dynamometer is fixed on milling machine table, upper polishing body is connected on milling machine spindle, is adjusted rotating speed and is opened Dynamic milling machine, upper and lower polishing body pass through magnetic coupling synchronous rotary;
Polishing particles are formed the " magnetic force with polishing action by the magnetic force of (4) 4 pairs of complementary poles according to magnetic line of force direction Brush " completes the polishing to entire workpiece by the scraping of " magnetic force brush ", rolling effect;" magnetic force when polishing is measured by dynamometer Brush " acts on normal force and torque on workpiece.
Compared with the conventional method, the beneficial effects of the invention are as follows:
(1) present invention is suitable for non-magnetic plane, can to the non-magnetic plane that can not be polished using magnetic grinding method into Row is effectively handled;
(2) present invention only need to add the raw materials such as abrasive grains, adjust workpiece at a distance from magnetic pole, start milling machine and be just polished Processing, it is at low cost, efficient;
Abrasive grain is formed " magnetic force brush " with polishing action by the magnetic force of (3) 4 pairs of complementary poles according to magnetic line of force direction, The polishing to entire workpiece is completed by the scraping of " magnetic force brush ", rolling effect;It ensure that the surface quality and flatness of workpiece.
Description of the drawings
Fig. 1 is the structural representation front view of the present invention;
Fig. 2 is dimensional structure diagram of the present invention;
Fig. 3 is polishing body dimensional structure diagram in the present invention;
Fig. 4 is polishing body dimensional structure diagram under the present invention;
Fig. 5 is tablet installation dimensional structure diagram of the present invention;
Fig. 6 is support device dimensional structure diagram of the present invention;
Fig. 7 is dynamometer dimensional structure diagram of the present invention;
Fig. 8 is polishing principles schematic diagram of the present invention.
In figure:It is polished on polishing body 5- magnetic pole 6- abrasive grains 7- on polishing body 2- supporting blocks 3- dynamometers 4- under 1- Matrix 9- connector 10- straight pin 11- small sircle hole 12- connecting pin 13- tablet 14- roundlet pins are polished under matrix 8- 15-U type holder 16- support device 17- workpiece
Specific implementation mode
The specific implementation mode of the present invention is described further below, but is not limited to the scope of the present invention:
As shown in Figs. 1-2, a kind of non-magnetic plane polishing device, by polishing part, auxiliary supporting part and measurement portion It is grouped as.
Upper polishing body 4 and lower polishing body 1 are polishing part.As shown in figure 3, upper polishing body 4 includes upper polishing matrix 7, magnetic Pole 5, abrasive grains 6.Polishing matrix 7 be made of round platform and shaft, 4 magnetic poles 5 according to N-S-N-S clockwise arrangement mode circumference It is distributed on the round platform of polishing matrix 7, is adsorbed on magnetic pole 5 after the lapping liquid uniform stirring of abrasive grains 6, upper polishing matrix 7 Shaft is connect with milling machine spindle, and milling machine spindle drives polishing matrix 7 and magnetic pole 5 to rotate.
As shown in figure 4, lower polishing body includes lower polishing matrix 8, magnetic pole 5, abrasive grains 6, connector 9;Matrix 7 is polished by justifying Platform is formed with shaft, and 4 magnetic poles 5 are according to the arrangement mode circumference uniform distribution of S-N-S-N clockwise in the lower round platform for polishing matrix 8 On, it is adsorbed on magnetic pole 5 after the lapping liquid uniform stirring of abrasive grains 6, the shaft of lower polishing matrix 8 is mounted on connection by bearing On body 9, connector 9 is fixed in support device 16, and lower polishing matrix 8 can be rotated around own axes.
As shown in Figure 5, Figure 6, support device 16 is auxiliary supporting part, and support device 16 includes u-bracket 15, tablet 13, supporting block 2.U-bracket 15 is made of glass material, and tablet 13 is copper coin.15 top of u-bracket is equipped with justifies with tablet 13 The corresponding straight pin 10 in hole, to fixed tablet 13.U-bracket bottom is equipped with roundlet corresponding with 3 roundlet pin 14 of dynamometer Hole 11, to be fixed on dynamometer 3.15 upper surface fixed support block 2 of u-bracket, supporting block 2 are equipped with the company with lower polishing body The corresponding connecting pin of 9 mounting hole of junctor, to the connector 9 of fixed lower polishing body.
Shown in Fig. 6, dynamometer 3 selects column type pressure gauge, and model SGZF, range 0-2KN are aobvious using 5 section-type LCDs Show, inside uses Delta-Sigma algorithms, and there are 2 programmable switches to export, and dynamometer 3 is mainly used for producing when measuring polishing Raw normal force.3 lower surface of dynamometer is fixed on milling machine table, and upper surface is fixed on u-bracket by roundlet pin 14 15 bottoms.
As shown in figure 8, the polishing method of the present invention includes the following steps:
(1) by 17 clamping of non-magnetic workpiece on copper coin, abrasive grains 6 are adsorbed on 4 magnetic poles 5, and the four of upper polishing matrix 7 A magnetic pole 5 is arranged according to N-S-N-S clockwise, and 7 magnetic pole of lower polishing matrix, 5 arrangement mode is complementary with upper polishing matrix 7.
(2) adjustment magnetic pole 5 is at a distance from workpiece 17, and magnetic pole 5 is away from 17 surface 1mm of workpiece;
(3) dynamometer 3 is fixed on milling machine table, upper polishing body 4 is connected on milling machine spindle, adjusts rotating speed simultaneously Start milling machine, upper and lower polishing body 4 passes through magnetic coupling synchronous rotary;
Abrasive grain is formed the " magnetic force with polishing action by the magnetic force of (4) 4 pairs of complementary poles 5 according to magnetic line of force direction Brush " completes the polishing to entire workpiece 17 by the scraping of " magnetic force brush ", rolling effect;When measuring polishing by dynamometer 3 " magnetic force brush " acts on normal force and torque on workpiece.
The present invention is suitable for non-magnetic plane, can have to the non-magnetic plane that can not be polished using magnetic grinding method The processing of effect ground.The present invention need to only add the raw materials such as abrasive grains, adjust workpiece 17 at a distance from magnetic pole 5, start milling machine and just thrown Light is processed, at low cost, efficient.The magnetic force of 4 pairs of complementary poles forms polishing particles according to magnetic line of force direction, and there is polishing to make " magnetic force brush " completes the polishing to entire workpiece by the scraping of " magnetic force brush ", rolling effect, ensure that the surface of workpiece Quality and flatness.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto, Any one skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.

Claims (8)

1. a kind of non-magnetic plane polishing device, it is characterised in that:Including upper polishing body, lower polishing body, support device and survey Power meter;Upper polishing body, lower polishing body, support device, dynamometer are set gradually from top to bottom, and dynamometer is fixed on milling machine table On, support device is fixed on dynamometer, and lower polishing body is mounted in support device, and upper polishing body is fixed on the shaft of milling machine On;Upper polishing body is rotated with lower polishing body by magnetic coupling coaxial synchronous, and dynamometer measures normal force and torque, and then adjusts work Part and pole pitch and rotating speed.
2. a kind of non-magnetic plane polishing device according to claim 1, it is characterised in that:The upper polishing body includes upper Polish matrix, magnetic pole, abrasive grains;4 magnetic poles according to N-S-N-S clockwise arrangement mode circumference uniform distribution polishing matrix on, It is adsorbed on magnetic pole after abrasive grains lapping liquid uniform stirring, upper polishing matrix is connect with milling machine spindle, in milling machine spindle drive Polish matrix rotation.
3. a kind of non-magnetic plane polishing device according to claim 1, it is characterised in that:Under the lower polishing body includes Polish matrix, magnetic pole, abrasive grains, connector;4 magnetic poles are being polished according to the arrangement mode circumference uniform distribution of S-N-S-N clockwise On matrix, it is adsorbed on magnetic pole after abrasive grains lapping liquid uniform stirring, lower polishing matrix is mounted on by bearing on connector, Connector is fixed in support device, and lower polishing matrix can be rotated around own axes.
4. a kind of non-magnetic plane polishing device according to claim 1, it is characterised in that:The support device includes U Type holder, tablet, supporting block;Straight pin corresponding with plate round hole is equipped at the top of u-bracket, to fixed tablet;U-bracket Bottom is equipped with small sircle hole corresponding with dynamometer roundlet pin, to be fixed on dynamometer;Support is fixed in u-bracket upper surface Block, supporting block are equipped with connecting pin corresponding with the lower connector mounting hole of polishing body, to the connector of fixed lower polishing body.
5. a kind of non-magnetic plane polishing device according to claim 4, it is characterised in that:The u-bracket is using saturating Bright material makes.
6. a kind of non-magnetic plane polishing device according to claim 4, it is characterised in that:The tablet is led using wear-resisting The metal material of good electrical property makes.
7. a kind of non-magnetic plane polishing device according to claim 1, it is characterised in that:The dynamometer lower surface is solid It is scheduled on milling machine table, upper surface is fixed on u-bracket bottom by roundlet pin.
8. based on a kind of polishing method of non-magnetic plane polishing device described in claim 1, it is characterised in that:It specifically includes Following steps:
(1) by non-magnetic clamping workpiece on tablet, abrasive grains are adsorbed on 4 magnetic poles, it is upper polishing matrix 4 magnetic poles according to N-S-N-S arrangements clockwise, lower polishing matrix magnetic pole arrangement mode are complementary with upper polishing matrix;
(2) adjustment magnetic pole is at a distance from workpiece, pole pitch workpiece surface 1-2mm;
(3) dynamometer is fixed on milling machine table, upper polishing body is connected on milling machine spindle, is adjusted rotating speed and is started milling Bed, upper and lower polishing body pass through magnetic coupling synchronous rotary;
Polishing particles are formed " magnetic force brush " with polishing action by the magnetic force of (4) 4 pairs of complementary poles according to magnetic line of force direction, are led to Cross the polishing of the scraping, rolling effect completion of " magnetic force brush " to entire workpiece;It is measured when polishing " magnetic force brush " and is made by dynamometer With the normal force and torque on workpiece.
CN201810125489.3A 2018-02-08 2018-02-08 A kind of non-magnetic plane polishing device and polishing method Pending CN108311959A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810125489.3A CN108311959A (en) 2018-02-08 2018-02-08 A kind of non-magnetic plane polishing device and polishing method

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Application Number Priority Date Filing Date Title
CN201810125489.3A CN108311959A (en) 2018-02-08 2018-02-08 A kind of non-magnetic plane polishing device and polishing method

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CN108311959A true CN108311959A (en) 2018-07-24

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109926873A (en) * 2019-01-25 2019-06-25 辽宁科技大学 A kind of grinding and polishing device and method for non-magnetic sheet parts
CN113103076A (en) * 2021-04-13 2021-07-13 霖鼎光学(上海)有限公司 Wafer polishing device based on inductively coupled plasma

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101537598A (en) * 2008-03-20 2009-09-23 湖州星星研磨有限公司 Manufacturing method of magnetic grinder and magnetic grinder thereof
CN103273385A (en) * 2013-06-09 2013-09-04 湖南大学 Surface contact magneto-rheological flat polishing device and method with uniform magnetic field
CN105904333A (en) * 2016-06-08 2016-08-31 广东工业大学 Double-side polishing device and method capable of controlling rigidity of polishing pad through cluster dynamic magnetic field
CN105922125A (en) * 2016-05-24 2016-09-07 广东工业大学 Magneto-rheological fluid dynamic pressure composite polishing device and method
CN106312796A (en) * 2016-10-20 2017-01-11 广东工业大学 Planarization machining device and single-face and double-face planarization machining system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101537598A (en) * 2008-03-20 2009-09-23 湖州星星研磨有限公司 Manufacturing method of magnetic grinder and magnetic grinder thereof
CN103273385A (en) * 2013-06-09 2013-09-04 湖南大学 Surface contact magneto-rheological flat polishing device and method with uniform magnetic field
CN105922125A (en) * 2016-05-24 2016-09-07 广东工业大学 Magneto-rheological fluid dynamic pressure composite polishing device and method
CN105904333A (en) * 2016-06-08 2016-08-31 广东工业大学 Double-side polishing device and method capable of controlling rigidity of polishing pad through cluster dynamic magnetic field
CN106312796A (en) * 2016-10-20 2017-01-11 广东工业大学 Planarization machining device and single-face and double-face planarization machining system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109926873A (en) * 2019-01-25 2019-06-25 辽宁科技大学 A kind of grinding and polishing device and method for non-magnetic sheet parts
CN113103076A (en) * 2021-04-13 2021-07-13 霖鼎光学(上海)有限公司 Wafer polishing device based on inductively coupled plasma

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Application publication date: 20180724