CN201235498Y - Lapping machine for two-side of wafer - Google Patents

Lapping machine for two-side of wafer Download PDF

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Publication number
CN201235498Y
CN201235498Y CNU2008200411403U CN200820041140U CN201235498Y CN 201235498 Y CN201235498 Y CN 201235498Y CN U2008200411403 U CNU2008200411403 U CN U2008200411403U CN 200820041140 U CN200820041140 U CN 200820041140U CN 201235498 Y CN201235498 Y CN 201235498Y
Authority
CN
China
Prior art keywords
wafer
grinding
disk
abradant
abrasive disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2008200411403U
Other languages
Chinese (zh)
Inventor
任先林
宋秦川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU SONGJING ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU SONGJING ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU SONGJING ELECTRONICS Co Ltd filed Critical CHANGZHOU SONGJING ELECTRONICS Co Ltd
Priority to CNU2008200411403U priority Critical patent/CN201235498Y/en
Application granted granted Critical
Publication of CN201235498Y publication Critical patent/CN201235498Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a wafer twin grinder which belongs to grinding machinery in the field of mechanical equipment and particularly relates to a grinder used for grinding a wafer. An upper grinding disk with an upper grinding surface and a lower grinding disk with a lower grinding surface are arranged on a stander, and the upper grinding disk is driven by an upper disk shaft; the upper grinding surface is correspondingly and tightly adjacent to the lower grinding surface, and a peripheral gear of an internal tooth type is arranged on the periphery of the lower grinding disk; a middle rotating shaft in coupling with a driving gear is arranged in the middle of the lower grinding disk, and a plurality of traveling gear sheets are engaged between the driving gear and the peripheral gear. The utility model has the advantages that both surfaces of the wafer can be ground so as to improve the work efficiency and have good wafer traveling track, high wafer parallelism and smoothness and the accurate control of the wafer thickness, and the ground wafer is easy to clean without paste.

Description

The wafer twin grinder
Technical field
The utility model relates to the grinding machinery in plant equipment field, particularly a kind of grinder that is used for the wafer grinding.
Background technology
Quartz wafer is to make the electronic component that usefulness takes place and controls frequency, the thickness same frequency of quartz wafer is inversely proportional to, and quartz crystal will be according to the designing requirement of wafer through the wafer after cutting, be ground to fixed thickness together, reaching fixed frequency through excessive erosion again could use.Therefore, grinding is the critical process in the wafer process.
The grinding of wafer, main at present four grinders or two grinders of adopting grind, the two grinding principle is the same, be wafer is pasted or to be adsorbed on top lap, following abrasive disk rotation drives top lap and rotates, and top lap rotates and swings the one side of grinding wafers against following abrasive disk simultaneously, again with crystal wafer back face, grind another side after ground.This type of Ginding process is to transplant the method for coming from the optical mirror slip Ginding process, and its disadvantage is that efficient is low, the bad control of wafer thickness in the process of lapping, and the running orbit of wafer in process of lapping is bad, and the wafer depth of parallelism, flatness are not high.
Summary of the invention
The new purpose of this practicality is to provide a kind of wafer twin grinder that can solve above-mentioned deficiency.
The purpose of this utility model is achieved in that the wafer twin grinder, comprise frame, frame be provided with have abradant surface by the shaft-driven top lap of last dish and have the down following abrasive disk of abradant surface, last abradant surface is close to abradant surface down relatively, the periphery of following abrasive disk is provided with the outer ring gear of inner tooth type, have an intermediate rotary shaft that is connected with driven wheel at the following middle part of abrasive disk, be engaged with some walking gear sheets between driven wheel and outer ring gear.
In the technical program, the wafer twin grinder is that upper lower burrs relative motion, intermediate rotary shaft drive driven wheel and outer ring gear and do relative motion and drive the walking gear sheet and rotate, and wafer relative motion between upper and lower abrasive disk that the walking gear sheet drives on the following abradant surface that is placed and is limited in its circle reaches the purpose of simultaneously two sides of wafer being ground.
The beneficial effects of the utility model are: energy is two faces of grinding wafers simultaneously, increase work efficiency; The wafer running orbit is good, the depth of parallelism of wafer, flatness height, and the THICKNESS CONTROL of wafer is accurate; The wafer that grinds through pasting, does not clean easily.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the structural representation of top lap and following abrasive disk among Fig. 1.
Among the figure, 1 is frame, and 2 is top lap, and 21 is last abradant surface, and 22 is last dish axle, and 3 are abrasive disk down, and 31 are abradant surface down, and 4 is the outer ring gear, and 5 is driven wheel, and 51 is intermediate rotary shaft, and 6 is the walking gear sheet, and 7 is wafer.
The specific embodiment
Below in conjunction with the description of drawings specific embodiment of the present utility model:
With reference to Fig. 1, Fig. 2, the wafer twin grinder, frame 1 is provided with and has being coiled the top laps 2 of axle 22 drivings and had the following abrasive disk 3 of abradant surface 31 down by last of abradant surface 21, last abradant surface 21 is close to abradant surface 31 down relatively, the periphery of following abrasive disk 3 is provided with the outer ring gear 4 of inner tooth type, have an intermediate rotary shaft 51 that is connected with driven wheel 5 at the following middle part of abrasive disk 3,4 of driven wheel 5 and outer ring gears are engaged with 5 walking gear sheets 6.
The utility model is that upper and lower abrasive disk relative motion, intermediate rotary shaft drive driven wheel and outer ring gear and do relative motion and drive the walking gear sheet and rotate, and the walking gear sheet drives wafer relative motion between upper and lower abrasive disk on the following abradant surface that is placed and is limited in its circle and reaches simultaneously the two sides of wafer is ground.

Claims (1)

1, wafer twin grinder, comprise frame, it is characterized in that: frame be provided with have abradant surface by the shaft-driven top lap of last dish and have the down following abrasive disk of abradant surface, last abradant surface is close to abradant surface down relatively, the periphery of following abrasive disk is provided with the outer ring gear of inner tooth type, have an intermediate rotary shaft that is connected with driven wheel at the following middle part of abrasive disk, be engaged with some walking gear sheets between driven wheel and outer ring gear.
CNU2008200411403U 2008-07-30 2008-07-30 Lapping machine for two-side of wafer Expired - Fee Related CN201235498Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200411403U CN201235498Y (en) 2008-07-30 2008-07-30 Lapping machine for two-side of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200411403U CN201235498Y (en) 2008-07-30 2008-07-30 Lapping machine for two-side of wafer

Publications (1)

Publication Number Publication Date
CN201235498Y true CN201235498Y (en) 2009-05-13

Family

ID=40648236

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2008200411403U Expired - Fee Related CN201235498Y (en) 2008-07-30 2008-07-30 Lapping machine for two-side of wafer

Country Status (1)

Country Link
CN (1) CN201235498Y (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102107392A (en) * 2010-12-24 2011-06-29 江苏大学 Wafer grinding tray supporting device
CN102975132A (en) * 2011-09-05 2013-03-20 二和金刚石工业株式会社 Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel
CN103182675A (en) * 2013-03-28 2013-07-03 铜陵迈维电子科技有限公司 Silica wafer grinding machine
CN103737480A (en) * 2010-07-28 2014-04-23 硅电子股份公司 Method and apparatus for trimming working layers of double-side grinding apparatus
CN105881131A (en) * 2016-06-08 2016-08-24 济源石晶光电频率技术有限公司 Automatic frequency measurement type wafer polishing device
CN108581823A (en) * 2018-04-28 2018-09-28 湖南宇晶机器股份有限公司 Hanging wall in grinder device oscillation system
CN110293481A (en) * 2019-06-26 2019-10-01 西安奕斯伟硅片技术有限公司 A kind of clean method of milling apparatus and milling apparatus
CN113561052A (en) * 2021-07-19 2021-10-29 山西汇智博科科技发展有限公司 Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103737480A (en) * 2010-07-28 2014-04-23 硅电子股份公司 Method and apparatus for trimming working layers of double-side grinding apparatus
CN102107392A (en) * 2010-12-24 2011-06-29 江苏大学 Wafer grinding tray supporting device
CN102975132A (en) * 2011-09-05 2013-03-20 二和金刚石工业株式会社 Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel
CN102975132B (en) * 2011-09-05 2015-05-20 二和金刚石工业株式会社 Multi grinding wheel for OLED substrate and method for grinding OLED substrate using the multi grinding wheel
CN103182675A (en) * 2013-03-28 2013-07-03 铜陵迈维电子科技有限公司 Silica wafer grinding machine
CN105881131A (en) * 2016-06-08 2016-08-24 济源石晶光电频率技术有限公司 Automatic frequency measurement type wafer polishing device
CN108581823A (en) * 2018-04-28 2018-09-28 湖南宇晶机器股份有限公司 Hanging wall in grinder device oscillation system
CN110293481A (en) * 2019-06-26 2019-10-01 西安奕斯伟硅片技术有限公司 A kind of clean method of milling apparatus and milling apparatus
CN110293481B (en) * 2019-06-26 2021-12-24 西安奕斯伟材料科技有限公司 Grinding equipment and cleaning method thereof
CN113561052A (en) * 2021-07-19 2021-10-29 山西汇智博科科技发展有限公司 Semiconductor processing grinding and polishing machine with dust removal structure and working method thereof

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090513

Termination date: 20120730