CN104802220B - Flexible solar plate processing method, equipment and solar energy spike - Google Patents
Flexible solar plate processing method, equipment and solar energy spike Download PDFInfo
- Publication number
- CN104802220B CN104802220B CN201510204405.1A CN201510204405A CN104802220B CN 104802220 B CN104802220 B CN 104802220B CN 201510204405 A CN201510204405 A CN 201510204405A CN 104802220 B CN104802220 B CN 104802220B
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- Prior art keywords
- flexible solar
- flexible
- crystal silicon
- punch die
- solar plate
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- 238000003672 processing method Methods 0.000 title claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 35
- 239000010703 silicon Substances 0.000 claims abstract description 35
- 239000013078 crystal Substances 0.000 claims abstract description 34
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 12
- 238000003466 welding Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 230000010355 oscillation Effects 0.000 claims description 2
- 230000006378 damage Effects 0.000 abstract description 4
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 230000002950 deficient Effects 0.000 abstract description 3
- 230000035939 shock Effects 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
There is provided a kind of flexible solar plate processing method, equipment and solar energy spike, flexible solar plate includes flexible base board, and the spherical crystal silicon of arranged crosswise multiple lines and multiple rows of end face on flexible substrates；Processing method includes：Configuration step, by solar panels configuration on workbench；Setting steps, punch die is arranged on the gap between solar panels crystal silicon；Punch steps, pressure is applied to punch die, with punching press solar panels, make solar panels in the gap separation set by punch die.Because punch die is arranged on the gap between solar panels crystal silicon so that when separating solar panels punch die application pressure, reduce the destruction to solar panels crystal silicon, reduce percent defective.Power supply is provided for signal lamp as a result of flexible solar plate, therefore, there is more preferable resistance to compression, shock resistance, the service life for out of doors, extending solar energy spike is more conducively set.
Description
Technical field
The present invention relates to solar panels field, and in particular to a kind of flexible solar plate processing method, equipment and solar energy
Railway spike.
Background technology
Flexible solar plate is to be laid in flexible material system as main photoelectric cell layer by the amorphous silicon of resin-encapsulate
Into bottom plate on.Flexible solar plate can arbitrarily be bent to curved or any irregular shape.It can be placed in streamlined
So as to abundant on the roofs and wall face of building such as top, sailing boat, racing boat, the cabin surface of motor boat and the house of automobile
Using abundant solar energy and convert it into electric current.This electric current can be stored in battery to produce power or as energy
Source.
Fig. 1 is refer to, is the structural representation of flexible solar plate, flexible solar plate includes flexible base board 10, and hands over
Fork is arranged in the crystal silicon 20 of the multiple lines and multiple rows of flexible base board upper surface, is neatly arranged in not by row or by row due to crystal silicon 20
On flexible base board 10, but row row between, crystal silicon 20 between the column and the column between each other exist intersect.Therefore using tradition
Cutting, line cut, laser high-speed cutting the methods of by flexible solar plate cut off separate when, crystal silicon 20 can be destroyed, thereby resulted in
The short circuit of solar panels both positive and negative polarities, percent defective are high.
The content of the invention
The application provides a kind of flexible solar plate processing method, equipment and solar energy spike, to realize to the flexible sun
Energy plate is processed, and is applied to solar energy spike.
According in a first aspect, provide a kind of flexible solar plate processing method in a kind of embodiment, flexible solar plate bag
Include flexible base board, and the spherical crystal silicon of arranged crosswise multiple lines and multiple rows of end face on flexible substrates；Processing method includes：
Configuration step, by the configuration of flexible solar plate on workbench；Setting steps, punch die is arranged on solar panels
Gap between spherical crystal silicon；Punch steps, pressure is applied to punch die, with stamping flexible solar panels, makes flexible solar plate
In the gap separation set by punch die.
According to second aspect, a kind of flexible solar board processing device is provided in a kind of embodiment, for processing flexibility too
It is positive can plate, flexible solar plate includes flexible base board, and the spherical crystalline substance of arranged crosswise multiple lines and multiple rows of end face on flexible substrates
Silicon；Process equipment includes：
Workbench, for providing processing site for flexible solar plate；Punch die, its stamping surface are between spherical crystal silicon
The zigzag that gap is engaged；Drive module, for providing punching press power source to punch die.
According to the third aspect, a kind of flexible solar plate is provided in a kind of embodiment, is process by above-mentioned processing method.
According to fourth aspect, a kind of solar energy spike is provided in a kind of embodiment, including：
The containment vessel of road is embedded in for putting；It is arranged on the PC shells on containment vessel top；There is sky between containment vessel and PC shells
Chamber, the setting signal indicator lamp in cavity；Above-mentioned flexible solar plate, the flexible solar plate connect with signal designation modulating signal
Connect, for providing power supply for signal lamp.
According to the processing method and equipment of above-described embodiment, because punch die is arranged between flexible solar cricket shape crystal silicon
Gap so as to punch die apply pressure make flexible solar plate separate when, reduce the destruction to solar panels crystal silicon, drop
Low percent defective.
According to the solar energy spike of above-described embodiment, electricity is provided for signal lamp as a result of flexible solar plate
Source so that solar energy spike can active illumination, the warning to driver and guiding function are improved, further, since solar panels
For flexible solar plate, therefore, there is more preferable resistance to compression, shock resistance, more conducively set out of doors, extend solar energy spike
Service life.
Brief description of the drawings
Fig. 1 is a kind of flexible solar plate schematic top plan view；
Fig. 2 is a kind of flexible solar board processing device principle schematic diagram disclosed in embodiment one；
Fig. 3 is a kind of structural representation in die punch face disclosed in embodiment one；
Fig. 4 is a kind of flexible solar plate processing method flow chart disclosed in this implementation one；
Fig. 5 is a kind of solar energy spike structural representation disclosed in the present embodiment two.
Embodiment
The present invention is described in further detail below by embodiment combination accompanying drawing.
Embodiment one：
Present embodiment discloses a kind of flexible solar board processing device, for processing flexibility solar panels, figure refer to
1, flexible solar plate includes flexible base board 10, and the spherical crystal silicon of arranged crosswise multiple lines and multiple rows of end face on flexible substrates
20.Fig. 2 is refer to, is included for a kind of solar panels process equipment principle schematic diagram, process equipment disclosed in the present embodiment：
Workbench 51, punch die 52 and drive module 53, wherein,
Workbench 51 is used to for flexible solar plate provide processing site, and in a particular embodiment, workbench can be with
Realized using existing punch press, in other embodiments, can also be by other platforms that can fix flexible solar plate
To provide.
The stamping surface of punch die 52 is the zigzag that gap is engaged between spherical crystal silicon, refer to Fig. 3, is the present embodiment
The structural representation in die punch face, in Fig. 3, broken circle is the signal of spherical crystal silicon, and stamping surface is the gap between spherical crystal silicon
The zigzag being engaged, each spherical crystal silicon can be accommodated in each female ends of sawtooth, as indicated by a broken line in fig. 1, so as to prevent
Spherical crystal silicon is stamped destruction.In a particular embodiment, the stamping surface of punch die 52 can be one, or it is multiple, can be with
Determine as needed.
Drive module 53 is used to provide punching press power source to punch die, and in one embodiment, drive module can be hydraulic pressure
Driving or air pressure driving, can also be that motor drives.In a particular embodiment, as long as drive module can be to punch die
Punching press power is provided.
In a preferred embodiment, ultrasonic oscillation device can also be included, for entering to the flexible solar after separation
Row ultrasonic vibration cleans.
The flexible solar board processing device provided according to above-described embodiment, the present embodiment also disclose a kind of flexible sun
Can plate processing method, refer to Fig. 4, be flexible solar plate processing method flow chart disclosed in this implementation, specific processing method
Comprise the following steps：
Step S51, configure, by the configuration of flexible solar plate on workbench.
Step S52, set, punch die is arranged on the gap between the spherical crystal silicon of solar panels.Because punch die is arranged on too
Gap between positive energy cricket shape crystal silicon, as indicated by a broken line in fig. 1, therefore, it is possible to effectively reduce destruction of the punch die to spherical crystal silicon.
Step S53, punching press, pressure is applied to punch die, with punching press solar panels, makes flexible solar plate set by punch die
Gap separation.It is arranged on the gap between the spherical crystal silicon of solar panels due to punch die, therefore, punch die is applied in drive module
During plus-pressure, punch die can apply pressure to flexible base board, and in the case where pressure is sufficiently large, flexible solar plate is just in punch die
Set gap separation.
In a preferred embodiment, flexible solar plate is disposed with the one side of spherical crystal silicon towards workbench, punch die from
The another side (no crystal silicon one side) of flexible solar plate is arranged on the gap between solar panels crystal silicon, now, is applied to punch die
During plus-pressure punching press solar panels, punch die then carries out punching press since the another side of solar panels to solar panels.
After step S53 is performed, there may be chip and remain in solar panels, thus can also trigger showing for short circuit
As occurring, therefore, in a preferred embodiment, after step S53 is performed, can further include：
Step S54, clean, ultrasonic vibration cleaning is carried out to the solar energy after separation using supersonic wave cleaning machine.Specific
In embodiment, it can be cleaned using existing cleaning way, the chip remained in solar panels is cleaned up,
Effectively prevent the solar panels short circuit because of caused by chip.
The present embodiment also discloses a kind of flexible solar plate, and is process using above-mentioned process equipment/processing method.
Embodiment two：
Fig. 5 is refer to, is a kind of solar energy spike disclosed in the present embodiment, including：The containment vessel of road is embedded in for putting
1, the PC shells 2 on the top of containment vessel 1 are arranged on, there is cavity, the setting signal indicator lamp in cavity between containment vessel 1 and PC shells 2
3, the solar panels 6 being process using above-mentioned process equipment and processing method, solar panels are connected with the signal of signal lamp 3
Connect, for providing power supply for signal lamp 3.In a particular embodiment, can be in series by polylith solar panels 6, with up to
To suitable voltage.In the present embodiment, the solar panels 6 of flexibility are used come for the offer power supply of signal lamp 3, on the one hand,
Solar recharging can be effectively utilized；On the other hand, because solar panels 6 use flexible substrate to be prepared, possess curved
Qu Gongneng, therefore, it is possible to preferably antidetonation, resistance to compression, shock resistance, so as to extend the working life of solar energy spike.
It is different from the material of the negative electrode of signal lamp 3 because the negative pole end material of flexible solar plate 6 is aluminium, too
The negative pole end fusing point of positive energy plate 6 is higher than the negative electrode fusing point of signal lamp 3, and when using scolding tin welding, tin aluminium can not be abundant
Fusion, easily causes dry joint.Therefore, in a preferred embodiment, the negative pole end of solar panels 6 is connected to by aluminium nickel composite tape
The negative electrode of signal lamp 3.The one side of aluminium and the negative pole end of flexible solar plate 6 weld in aluminium nickel composite band, a kind of real
Apply in example, can be welded using ultrasonic technique；The one side of nickel and the negative electrode of signal lamp 3 weld in aluminium nickel composite band
Connect, in a particular embodiment, conventional welding manner can be used to be welded, for example directly weld or pass through other first devices
Part is welded indirectly.
In order to prevent being come off caused by not prison welding, so as to cause flexible solar plate 6 to be contacted not with signal lamp 3
It is good, in a preferred embodiment, the negative pole end 6 of solar panels and the negative electrode of signal lamp 3 by multi-point welding, for example,
Can there are two, the local company in parallel of three or more between the negative pole end 6 of solar panels and the negative electrode of signal lamp 3
Connect.Certainly, the positive electrode of the positive terminal of solar panels and signal lamp 3 can also pass through multi-point welding.So as to strengthen electricity
Welding between pole.
Use above specific case is illustrated to the present invention, is only intended to help and is understood the present invention, not limiting
The system present invention.For those skilled in the art, according to the thought of the present invention, can also make some simple
Deduce, deform or replace.
Claims (9)
1. a kind of flexible solar plate processing method, it is characterised in that the flexible solar plate includes flexible base board, and intersects
It is arranged in the spherical crystal silicon of the multiple lines and multiple rows of flexible base board upper surface；The processing method includes：
Configuration step, by the configuration of flexible solar plate on workbench；
Setting steps, punch die is arranged on the gap between flexible solar cricket shape crystal silicon, the stamping surface of the punch die be with
The zigzag that gap is engaged between spherical crystal silicon, so that each female ends of the sawtooth can accommodate each spherical crystal silicon；
Punch steps, pressure is applied to punch die, with stamping flexible solar panels, makes flexible solar plate in the seam set by punch die
Gap separates.
2. flexible solar plate processing method as claimed in claim 1, it is characterised in that
In the configuration step, flexible solar plate has the one side of spherical crystal silicon towards workbench；
In the setting steps, the another side of punch die from flexible solar plate is arranged between flexible solar cricket shape crystal silicon
Gap.
3. flexible solar plate processing method as claimed in claim 1 or 2, it is characterised in that after the punch steps,
Also include：
Cleaning step, ultrasonic vibration cleaning is carried out to the flexible solar after separation using supersonic wave cleaning machine.
A kind of 4. flexible solar board processing device, for processing flexibility solar panels, it is characterised in that the flexible solar
Plate includes flexible base board, and the spherical crystal silicon of arranged crosswise multiple lines and multiple rows of end face on flexible substrates；The process equipment bag
Include：
Workbench, for providing processing site for flexible solar plate；
Punch die, its stamping surface are the zigzag that gap is engaged between crystal silicon；
Drive module, for providing punching press power source to punch die.
5. flexible solar board processing device as claimed in claim 4, it is characterised in that also include：
Ultrasonic oscillation device, for carrying out ultrasonic vibration cleaning to the flexible solar after separation.
6. a kind of flexible solar plate, it is characterised in that be process by any one of the claim 1-3 processing methods.
A kind of 7. solar energy spike, it is characterised in that including：
The containment vessel (1) of road is embedded in for putting；
It is arranged on the PC shells (2) on containment vessel (1) top；
There is cavity, setting signal indicator lamp (3) in cavity between containment vessel (1) and PC shells (2)；
Flexible solar plate as claimed in claim 6, the flexible solar plate are connected with signal lamp (3) signal, are used
In for signal lamp (3) provide power supply.
8. solar energy spike as claimed in claim 7, it is characterised in that the negative pole end material of the flexible solar plate is
Aluminium, the negative pole end of the flexible solar plate are connected to the negative electrode of signal lamp (3) by aluminium nickel composite tape.
9. solar energy spike as claimed in claim 7 or 8, it is characterised in that the negative pole end and letter of the flexible solar plate
The negative electrode of number indicator lamp (3) by multi-point welding, and/or the positive terminal of the solar panels with signal lamp (3) just
Electrode passes through multi-point welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204405.1A CN104802220B (en) | 2015-04-27 | 2015-04-27 | Flexible solar plate processing method, equipment and solar energy spike |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204405.1A CN104802220B (en) | 2015-04-27 | 2015-04-27 | Flexible solar plate processing method, equipment and solar energy spike |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104802220A CN104802220A (en) | 2015-07-29 |
| CN104802220B true CN104802220B (en) | 2017-11-21 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510204405.1A Active CN104802220B (en) | 2015-04-27 | 2015-04-27 | Flexible solar plate processing method, equipment and solar energy spike |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108963022B (en) * | 2018-08-21 | 2024-06-25 | 深圳市远达明反光器材有限公司 | Flexible solar panel packaging structure and solar spike |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2446156Y (en) * | 2000-09-28 | 2001-09-05 | 大连金威太阳能产品开发有限公司 | Solar track spike |
| CN201115006Y (en) * | 2007-05-18 | 2008-09-10 | 邢振凯 | Flexible circuit board cutter |
| CN201098923Y (en) * | 2007-11-27 | 2008-08-13 | 李敏 | Die cutting tool for flexible circuit board |
| JP4462353B2 (en) * | 2008-01-11 | 2010-05-12 | セイコーエプソン株式会社 | Flexible substrate manufacturing method and flexible substrate punching apparatus |
| CN201833490U (en) * | 2010-09-21 | 2011-05-18 | 上海信富电子科技有限公司 | Solar silicon chip cutting main roller |
| CN202241372U (en) * | 2011-07-29 | 2012-05-30 | 珈伟太阳能(武汉)有限公司 | Solar rear plate cutting table |
| CN103085176B (en) * | 2011-11-03 | 2015-03-25 | 奇景光电股份有限公司 | Wafer cutting method |
| CN103137731A (en) * | 2011-12-02 | 2013-06-05 | 罗程 | Crystalline silicon flexible solar panel and manufacturing process |
| CN202841725U (en) * | 2012-09-26 | 2013-03-27 | 东莞市五株电子科技有限公司 | Printed circuit board processing equipment |
| CN102873715A (en) * | 2012-10-26 | 2013-01-16 | 昆山特力伯传动科技有限公司 | Tooth-shaped joint cutting machine for conveyer belts |
| CN203192816U (en) * | 2012-12-04 | 2013-09-11 | 杜邦公司 | Assembly used for back contact type photovoltaic module, photovoltaic module and integrated backplane |
| CN203254487U (en) * | 2013-04-22 | 2013-10-30 | 江苏省常州技师学院 | Solar module film automatic cutting device |
| DE102013219468B4 (en) * | 2013-09-26 | 2015-04-23 | Siltronic Ag | A method of simultaneously separating a plurality of slices from a workpiece |
| CN103692564A (en) * | 2013-11-28 | 2014-04-02 | 国电兆晶光电科技江苏有限公司 | Method for reducing cutting thickness of solar polycrystalline silicon chip |
| CN203818174U (en) * | 2014-04-08 | 2014-09-10 | 常州回天新材料有限公司 | Enhanced solar cell back film cutter |
| CN204800764U (en) * | 2015-04-27 | 2015-11-25 | 深圳市远达明反光器材有限公司 | Flexible solar panel and processing equipment and solar road stud thereof |
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