CN201833490U - Solar silicon chip cutting main roller - Google Patents
Solar silicon chip cutting main roller Download PDFInfo
- Publication number
- CN201833490U CN201833490U CN2010205390468U CN201020539046U CN201833490U CN 201833490 U CN201833490 U CN 201833490U CN 2010205390468 U CN2010205390468 U CN 2010205390468U CN 201020539046 U CN201020539046 U CN 201020539046U CN 201833490 U CN201833490 U CN 201833490U
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- solar silicon
- silicon chip
- main roller
- cutting
- chip cutting
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Abstract
The utility model provides a solar silicon chip cutting main roller belonging to the technical field of cutting of solar silicon chips and relating to a solar silicon chip cutting main roller. The solar silicon chip cutting main roller comprises a solar silicon chip cutting main roller body, and the width of the solar silicon chip cutting main roller is widened from the original 300mm to 400mm. The solar silicon chip cutting main roller body is provided with a sawtoothed cutting blade for cutting the solar silicon chips. The two sides of the solar silicon chip cutting main roller are widened by 100mm, therefore, more solar silicon chips can be cut each time, the solar silicon chip cutting efficiency can be further greatly improved, and the breakthrough seems simple, but unexpected effects are achieved, therefore, great convenience is brought for cutting the solar silicon chips.
Description
Technical field
The utility model belongs to solar silicon wafers cutting technique field, relates to a kind of solar silicon wafers cutting home roll.
Background technology
At present, the solar level cell silicon chip is square silicon single crystal rod to be thinly sliced form, and domestic silicon wafer material is rare, cost an arm and a leg, and along with the extensive use of regenerative resource, the market demand of solar energy-level silicon wafer is increasing.So how to enhance productivity, promptly the yield rate of silicon materials gets a promotion in the unit interval, shortens the time of cutting, raises the efficiency, and has become the pattern that each enterprise is pursued.
Wafer cutter sweep commonly used is to use the high speed pneumatic rotating shaft to drive the cutting mode of diamond blade.But because the silicon chip that pneumatic rotating shaft drove cutting home roll, width is limited, can only cut out a spot of solar silicon wafers at every turn, can't satisfy the demand to solar silicon wafers.In this case, just need to improve the structure of home roll, make that the efficient of silicon chip cutting is improved greatly.
The utility model content
The purpose of this utility model is to have overcome the low problem of present solar silicon wafers cutting efficiency, and a kind of solar silicon wafers cutting home roll is provided.
A kind of solar silicon wafers cutting home roll, it includes solar silicon wafers cutting home roll body, and the width that solar silicon wafers is cut home roll is widened to 400mm-600mm by original 300mm.
Further, described a kind of solar silicon wafers cutting home roll also has following technical characterictic:
On described solar silicon wafers cutting home roll body, be provided with the zigzag cutting blade that is used to cut solar silicon wafers.
Advantage of the present utility model: this solar silicon wafers cutting home roll described in the utility model, with compared both sides originally and increased 100mm, thereby can cut out more solar silicon wafers at every turn, further improved the cutting efficiency of solar silicon wafers greatly, the breakthrough of this respect, though seem very simple, but realized beyond thought effect, for the solar silicon wafers cutting has brought great convenience.
Description of drawings
Below with reference to accompanying drawing,, do more detailed introduction to a kind of solar silicon wafers cutting home roll described in the utility model:
Structural representation when Fig. 1-1 does not widen for a kind of solar silicon wafers cutting home roll described in the utility model.
Fig. 1-2 is the structural representation after a kind of solar silicon wafers cutting home roll described in the utility model is widened.
Fig. 2 is the structural representation of zigzag cutting blade above a kind of solar silicon wafers cutting home roll described in the utility model.
The specific embodiment
For further disclosing the technical solution of the utility model, convenient your auditor's censorship is described with reference to the accompanying drawings embodiment of the present utility model now:
The explanation of Fig. 1-1 and 1-2:
Shown in ginseng Fig. 1-1, showed the structural representation that a kind of solar silicon wafers cutting home roll described in the utility model is not broadened.In Fig. 1-2, home roll 100 has been broadened, and joins shown in Figure 2ly, is provided with zigzag cutting blade 110 on home roll 100, and home roll 100 cuts by 110 pairs of solar silicon wafers of this zigzag cutting blade.From Fig. 1-1 and Fig. 1-2 more as can be seen, the home roll 100 after the improvement is in the same time, the solar silicon wafers that can cut is more, efficient is higher.The simple improvement but improved efficient greatly.
For example and without limitation, in the utility model home roll 100 is widened to 400mm-600mm by original 300mm, widens 100mm but be preferably in the practice, its scope of specifically widening does not limit, and specifically widens according to actual conditions.
More than, basic design of the present utility model and basic principle have been set forth by description of listed embodiment.But the utility model never is limited to above-mentioned listed embodiment, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on the technical solution of the utility model of change all should belong to protection domain of the present utility model.
Claims (2)
1. a solar silicon wafers cuts home roll, and it includes solar silicon wafers cutting home roll body, it is characterized in that the width that solar silicon wafers is cut home roll is widened to 400mm-600mm by original 300mm.
2. a kind of solar silicon wafers cutting home roll according to claim 1 is characterized in that, on described solar silicon wafers cutting home roll body, is provided with the zigzag cutting blade that is used to cut solar silicon wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205390468U CN201833490U (en) | 2010-09-21 | 2010-09-21 | Solar silicon chip cutting main roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205390468U CN201833490U (en) | 2010-09-21 | 2010-09-21 | Solar silicon chip cutting main roller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201833490U true CN201833490U (en) | 2011-05-18 |
Family
ID=44003584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205390468U Expired - Fee Related CN201833490U (en) | 2010-09-21 | 2010-09-21 | Solar silicon chip cutting main roller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201833490U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624885A (en) * | 2013-11-07 | 2014-03-12 | 镇江大成新能源有限公司 | Modification method of main roller of slicing machine in order to increase cutting rod length |
| CN104149214A (en) * | 2014-06-13 | 2014-11-19 | 镇江环太硅科技有限公司 | Lengthened guide wheel |
| CN104802220A (en) * | 2015-04-27 | 2015-07-29 | 深圳市远达明反光器材有限公司 | Machining method of flexible solar panel, equipment and solar spike |
| CN105058600A (en) * | 2015-07-31 | 2015-11-18 | 江苏奥能光电科技有限公司 | Master roll of silicon block slicing machine |
-
2010
- 2010-09-21 CN CN2010205390468U patent/CN201833490U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624885A (en) * | 2013-11-07 | 2014-03-12 | 镇江大成新能源有限公司 | Modification method of main roller of slicing machine in order to increase cutting rod length |
| CN104149214A (en) * | 2014-06-13 | 2014-11-19 | 镇江环太硅科技有限公司 | Lengthened guide wheel |
| CN104149214B (en) * | 2014-06-13 | 2016-06-29 | 镇江环太硅科技有限公司 | A kind of lengthening directive wheel |
| CN104802220A (en) * | 2015-04-27 | 2015-07-29 | 深圳市远达明反光器材有限公司 | Machining method of flexible solar panel, equipment and solar spike |
| CN105058600A (en) * | 2015-07-31 | 2015-11-18 | 江苏奥能光电科技有限公司 | Master roll of silicon block slicing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20120921 |