CN201833490U - Solar silicon chip cutting main roller - Google Patents

Solar silicon chip cutting main roller Download PDF

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Publication number
CN201833490U
CN201833490U CN2010205390468U CN201020539046U CN201833490U CN 201833490 U CN201833490 U CN 201833490U CN 2010205390468 U CN2010205390468 U CN 2010205390468U CN 201020539046 U CN201020539046 U CN 201020539046U CN 201833490 U CN201833490 U CN 201833490U
Authority
CN
China
Prior art keywords
solar silicon
silicon chip
main roller
cutting
chip cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205390468U
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Chinese (zh)
Inventor
王图强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd filed Critical SHANGHAI SCINFO ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN2010205390468U priority Critical patent/CN201833490U/en
Application granted granted Critical
Publication of CN201833490U publication Critical patent/CN201833490U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model provides a solar silicon chip cutting main roller belonging to the technical field of cutting of solar silicon chips and relating to a solar silicon chip cutting main roller. The solar silicon chip cutting main roller comprises a solar silicon chip cutting main roller body, and the width of the solar silicon chip cutting main roller is widened from the original 300mm to 400mm. The solar silicon chip cutting main roller body is provided with a sawtoothed cutting blade for cutting the solar silicon chips. The two sides of the solar silicon chip cutting main roller are widened by 100mm, therefore, more solar silicon chips can be cut each time, the solar silicon chip cutting efficiency can be further greatly improved, and the breakthrough seems simple, but unexpected effects are achieved, therefore, great convenience is brought for cutting the solar silicon chips.

Description

A kind of solar silicon wafers cutting home roll
Technical field
The utility model belongs to solar silicon wafers cutting technique field, relates to a kind of solar silicon wafers cutting home roll.
Background technology
At present, the solar level cell silicon chip is square silicon single crystal rod to be thinly sliced form, and domestic silicon wafer material is rare, cost an arm and a leg, and along with the extensive use of regenerative resource, the market demand of solar energy-level silicon wafer is increasing.So how to enhance productivity, promptly the yield rate of silicon materials gets a promotion in the unit interval, shortens the time of cutting, raises the efficiency, and has become the pattern that each enterprise is pursued.
Wafer cutter sweep commonly used is to use the high speed pneumatic rotating shaft to drive the cutting mode of diamond blade.But because the silicon chip that pneumatic rotating shaft drove cutting home roll, width is limited, can only cut out a spot of solar silicon wafers at every turn, can't satisfy the demand to solar silicon wafers.In this case, just need to improve the structure of home roll, make that the efficient of silicon chip cutting is improved greatly.
The utility model content
The purpose of this utility model is to have overcome the low problem of present solar silicon wafers cutting efficiency, and a kind of solar silicon wafers cutting home roll is provided.
A kind of solar silicon wafers cutting home roll, it includes solar silicon wafers cutting home roll body, and the width that solar silicon wafers is cut home roll is widened to 400mm-600mm by original 300mm.
Further, described a kind of solar silicon wafers cutting home roll also has following technical characterictic:
On described solar silicon wafers cutting home roll body, be provided with the zigzag cutting blade that is used to cut solar silicon wafers.
Advantage of the present utility model: this solar silicon wafers cutting home roll described in the utility model, with compared both sides originally and increased 100mm, thereby can cut out more solar silicon wafers at every turn, further improved the cutting efficiency of solar silicon wafers greatly, the breakthrough of this respect, though seem very simple, but realized beyond thought effect, for the solar silicon wafers cutting has brought great convenience.
Description of drawings
Below with reference to accompanying drawing,, do more detailed introduction to a kind of solar silicon wafers cutting home roll described in the utility model:
Structural representation when Fig. 1-1 does not widen for a kind of solar silicon wafers cutting home roll described in the utility model.
Fig. 1-2 is the structural representation after a kind of solar silicon wafers cutting home roll described in the utility model is widened.
Fig. 2 is the structural representation of zigzag cutting blade above a kind of solar silicon wafers cutting home roll described in the utility model.
The specific embodiment
For further disclosing the technical solution of the utility model, convenient your auditor's censorship is described with reference to the accompanying drawings embodiment of the present utility model now:
The explanation of Fig. 1-1 and 1-2:
Shown in ginseng Fig. 1-1, showed the structural representation that a kind of solar silicon wafers cutting home roll described in the utility model is not broadened.In Fig. 1-2, home roll 100 has been broadened, and joins shown in Figure 2ly, is provided with zigzag cutting blade 110 on home roll 100, and home roll 100 cuts by 110 pairs of solar silicon wafers of this zigzag cutting blade.From Fig. 1-1 and Fig. 1-2 more as can be seen, the home roll 100 after the improvement is in the same time, the solar silicon wafers that can cut is more, efficient is higher.The simple improvement but improved efficient greatly.
For example and without limitation, in the utility model home roll 100 is widened to 400mm-600mm by original 300mm, widens 100mm but be preferably in the practice, its scope of specifically widening does not limit, and specifically widens according to actual conditions.
More than, basic design of the present utility model and basic principle have been set forth by description of listed embodiment.But the utility model never is limited to above-mentioned listed embodiment, and every equivalent variations, improvement and deliberately of inferior quality behavior of doing based on the technical solution of the utility model of change all should belong to protection domain of the present utility model.

Claims (2)

1. a solar silicon wafers cuts home roll, and it includes solar silicon wafers cutting home roll body, it is characterized in that the width that solar silicon wafers is cut home roll is widened to 400mm-600mm by original 300mm.
2. a kind of solar silicon wafers cutting home roll according to claim 1 is characterized in that, on described solar silicon wafers cutting home roll body, is provided with the zigzag cutting blade that is used to cut solar silicon wafers.
CN2010205390468U 2010-09-21 2010-09-21 Solar silicon chip cutting main roller Expired - Fee Related CN201833490U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205390468U CN201833490U (en) 2010-09-21 2010-09-21 Solar silicon chip cutting main roller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205390468U CN201833490U (en) 2010-09-21 2010-09-21 Solar silicon chip cutting main roller

Publications (1)

Publication Number Publication Date
CN201833490U true CN201833490U (en) 2011-05-18

Family

ID=44003584

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205390468U Expired - Fee Related CN201833490U (en) 2010-09-21 2010-09-21 Solar silicon chip cutting main roller

Country Status (1)

Country Link
CN (1) CN201833490U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624885A (en) * 2013-11-07 2014-03-12 镇江大成新能源有限公司 Modification method of main roller of slicing machine in order to increase cutting rod length
CN104149214A (en) * 2014-06-13 2014-11-19 镇江环太硅科技有限公司 Lengthened guide wheel
CN104802220A (en) * 2015-04-27 2015-07-29 深圳市远达明反光器材有限公司 Machining method of flexible solar panel, equipment and solar spike
CN105058600A (en) * 2015-07-31 2015-11-18 江苏奥能光电科技有限公司 Master roll of silicon block slicing machine

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103624885A (en) * 2013-11-07 2014-03-12 镇江大成新能源有限公司 Modification method of main roller of slicing machine in order to increase cutting rod length
CN104149214A (en) * 2014-06-13 2014-11-19 镇江环太硅科技有限公司 Lengthened guide wheel
CN104149214B (en) * 2014-06-13 2016-06-29 镇江环太硅科技有限公司 A kind of lengthening directive wheel
CN104802220A (en) * 2015-04-27 2015-07-29 深圳市远达明反光器材有限公司 Machining method of flexible solar panel, equipment and solar spike
CN105058600A (en) * 2015-07-31 2015-11-18 江苏奥能光电科技有限公司 Master roll of silicon block slicing machine

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110518

Termination date: 20120921