CN202293063U - Main cutting roller for solar silicon chips - Google Patents
Main cutting roller for solar silicon chips Download PDFInfo
- Publication number
- CN202293063U CN202293063U CN2011203614100U CN201120361410U CN202293063U CN 202293063 U CN202293063 U CN 202293063U CN 2011203614100 U CN2011203614100 U CN 2011203614100U CN 201120361410 U CN201120361410 U CN 201120361410U CN 202293063 U CN202293063 U CN 202293063U
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- utility
- home roll
- solar silicon
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Abstract
The utility model relates to a main cutting roller for solar silicon chips, comprising a main roller body, wherein the main roller body is provided with cutting line containing grooves with the groove distance being 0.310mm-0.312mm. According to the cutting main roller, the groove distance of the cutting line containing grooves is shortened from 0.315mm to 0.310mm-0.312mm, the quantity of the cutting line containing grooves is increased on the main roller body with the same length, and the chip yield at unit kilogram of silicon rods is improved, so that the yield can be improved, and the cost can be saved.
Description
Technical field
The utility model relates to solar silicon wafers cutting technique field, particularly a kind of solar silicon wafers cutting home roll.
Background technology
The solar level cell silicon chip is square silicon single crystal rod to be thinly sliced form; But because the silicon wafer material price is expensive; Especially at home silicon wafer material and rare, the cost that therefore how to reduce solar silicon wafers is most important to the competitiveness of traditional energy for improving solar energy.
For being the photovoltaic cell of substrate with the silicon chip, crystalline silicon (c-Si) raw material and cutting cost have occupied the best part in the battery totle drilling cost.The photovoltaic cell manufacturer can reduce cost through save silicon raw material in slicing processes.Reduce kerf loss and can reach this effect, kerf loss is main relevant with the line of cut diameter, is the significant loss that cutting process itself is produced.The line of cut diameter has been reduced to the 140-100 μ m that generally uses at present from original 180-160 μ m.Reducing the line of cut diameter can also cut out more silicon chip under same silico briquette length, promote board output.
Our demand side mainly focuses on the productivity of scroll saw to multinomial challenge in the silicon chip cutting technique, the silicon chip quantity of just producing in the unit interval.What many lines of cut were parallel to each other is wrapped on the solar silicon wafers cutting home roll, forms the line of cut " net " of a level.Motor drives solar silicon wafers cutting home roll makes whole cutting gauze move with the speed of 5 to 25 meters of per seconds.The slot pitch of solar silicon wafers cutting home roll in the market is 0.315mm.The solar silicon wafers certain in length cuts the line of cut holding tank limited amount on the home roll, restricting the piece rate of silicon rod unit's kilogram number.
The utility model content
The purpose of the utility model is to provide a kind of solar silicon wafers cutting home roll, so that further improve when the cutting silicon rod piece rate of silicon rod unit's kilogram number.
To achieve these goals, the technical scheme of the utility model is following:
Solar silicon wafers cutting home roll is characterized in that comprise the home roll body, said home roll body is provided with the line of cut holding tank, and the slot pitch of said line of cut holding tank is 0.310mm-0.312mm.
In an embodiment of the utility model, the slot pitch of said line of cut holding tank is 0.310mm.
The solar silicon wafers cutting home roll of the utility model; With the slot pitch of line of cut holding tank by original 0.315mm; Be reduced into 0.310mm-0.312mm, on equal length home roll body, the quantity of line of cut holding tank increases; Improve the piece rate of silicon rod unit's kilogram number, can improve output like this and practice thrift cost.
The utility model can reduce production cost, improves silicon rod unit's kilogram slice quantity, and silicon chip can be cut thinlyyer.
The characteristics of the utility model can consult this case graphic and below better embodiment detailed description and obtain to be well understood to.
Description of drawings
Fig. 1 is the structural representation of the utility model.
The specific embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and be easy to understand understanding with effect, further set forth the utility model below in conjunction with specific embodiment.
As shown in Figure 1, solar silicon wafers cutting home roll comprises home roll body 100, and home roll body 100 is provided with line of cut holding tank 110, and what line of cut was parallel to each other is wrapped on the solar silicon wafers cutting home roll, forms the line of cut " net " of a level.Motor drives solar silicon wafers cutting home roll makes whole cutting gauze move with the speed of 5 to 25 meters of per seconds.
The slot pitch A of line of cut holding tank 110 is 0.310mm-0.312mm.
In this preferred embodiment, the slot pitch of line of cut holding tank is 0.310mm.
The solar silicon wafers cutting home roll of the utility model; With the slot pitch of line of cut holding tank by original 0.315mm; Be reduced into 0.310mm-0.312mm, on equal length home roll body, the quantity of line of cut holding tank increases; Improve the piece rate of silicon rod unit's kilogram number, can improve output like this and practice thrift cost.
More than show and described the advantage of basic principle, principal character and the utility model of the utility model.The technical staff of the industry should understand; The utility model is not restricted to the described embodiments; The just principle of describing in the foregoing description and the specification of the utility model; The utility model also has various changes and modifications under the prerequisite that does not break away from the utility model spirit and scope, and these variations and improvement all fall in the scope of the utility model that requires protection.The protection domain that the utility model requires is defined by appending claims and equivalent thereof.
Claims (2)
1. solar silicon wafers cutting home roll is characterized in that comprise the home roll body, said home roll body is provided with the line of cut holding tank, and the slot pitch of said line of cut holding tank is 0.310mm-0.312mm.
2. solar silicon wafers cutting home roll according to claim 1 is characterized in that the slot pitch of said line of cut holding tank is 0.310mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203614100U CN202293063U (en) | 2011-09-23 | 2011-09-23 | Main cutting roller for solar silicon chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203614100U CN202293063U (en) | 2011-09-23 | 2011-09-23 | Main cutting roller for solar silicon chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202293063U true CN202293063U (en) | 2012-07-04 |
Family
ID=46362034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203614100U Expired - Fee Related CN202293063U (en) | 2011-09-23 | 2011-09-23 | Main cutting roller for solar silicon chips |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202293063U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624885A (en) * | 2013-11-07 | 2014-03-12 | 镇江大成新能源有限公司 | Modification method of main roller of slicing machine in order to increase cutting rod length |
| CN105058604A (en) * | 2015-07-24 | 2015-11-18 | 山东大学 | Multi-wire sawing machine roller for cutting SiC single crystals with different diameters and use method of multi-wire sawing machine roller |
| CN111516160A (en) * | 2020-05-11 | 2020-08-11 | 福建晶安光电有限公司 | Multi-wire cutting machine |
-
2011
- 2011-09-23 CN CN2011203614100U patent/CN202293063U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103624885A (en) * | 2013-11-07 | 2014-03-12 | 镇江大成新能源有限公司 | Modification method of main roller of slicing machine in order to increase cutting rod length |
| CN105058604A (en) * | 2015-07-24 | 2015-11-18 | 山东大学 | Multi-wire sawing machine roller for cutting SiC single crystals with different diameters and use method of multi-wire sawing machine roller |
| CN111516160A (en) * | 2020-05-11 | 2020-08-11 | 福建晶安光电有限公司 | Multi-wire cutting machine |
| CN111516160B (en) * | 2020-05-11 | 2022-06-17 | 福建晶安光电有限公司 | Multi-wire cutting machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20120923 |