CN1728414A - Secondary battery - Google Patents
Secondary battery Download PDFInfo
- Publication number
- CN1728414A CN1728414A CNA2005100888841A CN200510088884A CN1728414A CN 1728414 A CN1728414 A CN 1728414A CN A2005100888841 A CNA2005100888841 A CN A2005100888841A CN 200510088884 A CN200510088884 A CN 200510088884A CN 1728414 A CN1728414 A CN 1728414A
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- China
- Prior art keywords
- secondary cell
- terminal board
- projection
- terminal
- protuberance
- Prior art date
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 57
- 239000002184 metal Substances 0.000 claims description 57
- 238000004049 embossing Methods 0.000 claims description 33
- 238000003466 welding Methods 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 26
- 229910045601 alloy Inorganic materials 0.000 claims description 23
- 239000000956 alloy Substances 0.000 claims description 23
- 230000000712 assembly Effects 0.000 claims description 22
- 238000000429 assembly Methods 0.000 claims description 22
- 229910001374 Invar Inorganic materials 0.000 claims description 20
- 239000011159 matrix material Substances 0.000 claims description 11
- 150000002815 nickel Chemical class 0.000 claims description 5
- 238000009413 insulation Methods 0.000 description 24
- 239000003792 electrolyte Substances 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000012856 packing Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 229910018095 Ni-MH Inorganic materials 0.000 description 1
- 229910018477 Ni—MH Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/172—Arrangements of electric connectors penetrating the casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/04—Construction or manufacture in general
- H01M10/0431—Cells with wound or folded electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/147—Lids or covers
- H01M50/148—Lids or covers characterised by their shape
- H01M50/15—Lids or covers characterised by their shape for prismatic or rectangular cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/531—Electrode connections inside a battery casing
- H01M50/538—Connection of several leads or tabs of wound or folded electrode stacks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
A secondary battery includes: an electrode assembly having positive and negative electrode plates, a separator, and positive and negative electrode tabs respectively attached to the positive and negative electrode plates; and a cap assembly having a cap plate, an electrode terminal, and a terminal plate. The terminal plate has a protrusion arranged between a side thereof having a terminal through-hole contained therein to which the electrode terminal is attached and the other side.
Description
Technical field
The present invention relates to secondary cell, more specifically, relate to secondary cell with the projection on the terminal board that is formed on cap assemblies, so as with negative pole contact pin contact process in increase contact resistance, and be easy to weld this negative pole contact pin.
Background technology
Along with the portable mobile wireless application apparatus that comprises video camera, portable phone and portable computer is being incorporated the multi-purpose weight that also is tending towards reducing simultaneously into, the secondary cell as the driving power of these equipment has been carried out big quantity research.For example, secondary cell comprises nickel-cadmium cell, Ni-MH battery, nickel-zinc cell and lithium secondary battery.Wherein, because lithium secondary battery can be recharged, have the high-energy-density that the jumbo while can make tight size, have high working voltage and Unit Weight, so they are widely used in the most advanced and sophisticated field of electronic devices.
Secondary cell is by electrode assemblie being placed in the jar with electrode and forming with the open top of cap assemblies airtight container, and wherein electrode assemblie comprises positive and negative secondary pole plate and dividing plate.
Electrode assemblie is by reeling positive and negative pole plate and place the dividing plate between them to form.Positive plate has the anodal contact pin that is connected and gives prominence to from the upper end of electrode assemblie with it.Negative plate has the negative pole contact pin that is connected and gives prominence to from the upper end of electrode assemblie with it.Positive and negative electrode contact pin is the space preset distance in electrode assemblie, and is isolated with electricity between them.Positive and negative electrode contact pin is formed by nickel based metal usually.
Cap assemblies comprises cover plate, insulation board, terminal board and electrode terminal.Cap assemblies is connected to the open top and the hermetically sealed can of jar after being connected to the insulation shell of separation.
Cover plate is formed by the corresponding metallic plate of open-topped shape, size of shape, size and jar.Cover plate has the first terminal through hole that is formed on its center, and electrode terminal is inserted into by this first terminal through hole.When electrode terminal was inserted into the first terminal through hole, cast packing ring pipe connected and insertion with the outer surface of electrode assemblie, so that electrode terminal and cover plate mutually insulated.Cover plate has the electrolyte injecting hole that is formed on the one side.After cap assemblies was mounted to the open top of jar, electrolyte was injected into by electrolyte injecting hole, and this electrolyte injecting hole separated sealing device then seals.
Electrode terminal is connected in the anodal contact pin of the negative pole contact pin of negative plate or positive plate, and as negative or plus end.
Insulation board is made of the megohmite insulant such as packing ring, and is connected to the lower surface of cover plate 140.Insulation board has formation second terminal through-hole thereon, and second terminal through-hole is arranged to corresponding with the first terminal through hole of cover plate, so that electrode terminal can insert wherein.Insulation board has the corresponding resettlement groove of the size that is formed on its lower surface, size and terminal board, thereby terminal board can be settled on it.
Terminal board is formed by the invar alloy that belongs to nickel-base alloy (invar alloy) (nickel of 34-37%, remainder is an iron), and terminal board is placed on the lower surface of insulation board.Terminal board has formation the 3rd terminal through-hole thereon, and the 3rd terminal through-hole is arranged to corresponding with the first terminal through hole of cover plate, thereby electrode terminal can be inserted wherein.Terminal board is electrically connected to electrode terminal and insulate mutually with cover plate, and this is because electrode terminal is insulated by the packing ring pipe when its first terminal through hole that passes cover plate extends.
The negative pole contact pin that is connected to negative plate is soldered to a side of terminal board, and the anodal contact pin that is connected to positive plate is soldered to the opposite side of terminal board.Negative, positive utmost point contact pin can connect by resistance welded or laser welding, and is preferably resistance welded.
According to the method recently that is used to reduce the secondary cell internal resistance, each element all forms by having low-resistance metal.In other words, reduce the internal resistance of secondary cell to avoid the electrical loss of inside battery.Though terminal board forms by having high-resistance invar alloy, but being had low-resistance nickel-base alloy, its quilt substitutes, with the electrical loss of avoiding being caused by high resistance.
But when terminal board was formed by nickel based metal, the contact resistance between terminal board and the negative pole contact pin reduced, and is difficult to weld negative pole contact pin.Thus, the weldability between terminal board and the negative pole contact pin reduces, and the welding meeting is carried out between negative pole contact pin and welding rod.
Summary of the invention
Therefore, the present invention is devoted to address the above problem and makes, the purpose of this invention is to provide a kind of secondary cell with the projection on the terminal board that is formed on cap assemblies, thus with negative pole contact pin contact process in increase contact resistance, and be easy to weld negative pole contact pin.
For realizing this purpose, a kind of secondary cell is provided, comprising: electrode assemblie and cap assemblies, this electrode assemblie have positive/negative plate, dividing plate and are connected respectively to the both positive and negative polarity contact pin of described positive/negative plate; This cap assemblies has cover plate, electrode terminal and terminal board, and wherein this terminal board has projection, between the side and opposite side of the terminal through-hole that this projection arrangement is included in wherein having of this terminal board, is connected with this electrode terminal.
This negative pole contact pin preferably is connected on this projection by welding.
This projection preferably includes and is arranged in a side with the terminal through-hole that is included in wherein, is connected with this electrode terminal and at least one protuberance between the opposite side.
Perhaps, this projection preferably includes at least one protuberance of this terminal through-hole dislocation of mind-set from this terminal board.
This protuberance or preferably comprise at least one embossing that forms by the rear surface of pushing this terminal board.The length of this protuberance preferably is at least 50% of this terminal board length.The shape of protuberance is preferably circle, ellipse or polygon.The width of this protuberance is preferably less than 30% of this negative pole blade width.Perhaps, the width of this protuberance is preferably less than 25% of this negative pole blade width.The width of this protuberance is preferably 1.0mm or littler.This protuberance preferably includes at least two embossings that are arranged to straight line or matrix array.
The distance of space is preferably greater than the width of described at least one embossing between described at least two embossings.Preferred space 1.0mm at least between described at least two embossings.Described at least two embossings are preferably placed mutually contiguously.
This protuberance preferably includes the conductive junction point of the front surface that is connected to this terminal board.This conductive junction point preferably comprises the high metal of resistance of resistance ratio nickel based metal.This conductive junction point preferably comprises invar alloy.The diameter of conductive junction point is preferably 1.0mm or littler.
This projection preferably includes the conduction graining board of the front surface that is connected to this terminal board.This graining board preferably comprises the high metal of resistance of resistance ratio nickel based metal.This graining board preferably comprises invar alloy.The diameter of the embossing of this graining board is preferably 1.0mm or littler, and the interval between the embossing is at least 1.0mm.
Alternatively, this projection preferably includes at least one rod.Perhaps, this projection preferably includes two two rods that are parallel to each other and arrange.This projection or preferably form by the rear surface of pushing this terminal board.The length of this projection preferably is at least 50% of this terminal board length.The width of the rod of this projection is preferably 1.0mm or littler.The preferred space of the rod of this projection is 1.0mm at least.
Alternatively, this projection preferably includes the conductor wire of the front surface that is connected to this terminal board.This conductor wire preferably comprises the high metal of resistance of resistance ratio nickel based metal.This conductor wire preferably comprises invar alloy.The width of this conductor wire is preferably 1.0mm or littler.
Alternatively, this projection preferably comprises the web plate of the front surface that is connected to this terminal board.This web plate preferably comprises the high metal of resistance of resistance ratio nickel based metal.This web plate preferably comprises invar alloy.It is 1.0mm or littler conductor wire that this web plate preferably comprises diameter, and wherein the interval of conductor wire is at least 1.0mm.
Description of drawings
Also with reference to following detailed description, the present invention may be better understood, and more complete understanding of the present invention and many attendant advantages will be become clearly in conjunction with the accompanying drawings.Wherein, identical reference marker is represented identical or similar elements, wherein:
Fig. 1 is the decomposition diagram of secondary cell;
Fig. 2 is the decomposition diagram of secondary cell according to an embodiment of the invention;
Fig. 3 a is the upward view of terminal board according to an embodiment of the invention;
Fig. 3 b is the sectional view of making along Fig. 3 a line A-A;
Fig. 4 is the upward view of terminal board according to another embodiment of the present invention;
Fig. 5 is the upward view of terminal board according to another embodiment of the present invention;
Fig. 6 is the upward view of terminal board according to another embodiment of the present invention;
Fig. 7 a is the upward view of terminal board according to another embodiment of the present invention;
Fig. 7 b is the sectional view of making along Fig. 7 a line B-B;
Fig. 8 is the upward view of terminal board according to another embodiment of the present invention;
Fig. 9 a is the upward view of terminal board according to another embodiment of the present invention;
Fig. 9 b is the sectional view of making along Fig. 9 a line C-C;
Figure 10 is the upward view of terminal board according to another embodiment of the present invention;
Figure 11 a is the upward view of terminal board according to another embodiment of the present invention;
Figure 11 b is the sectional view of making along Figure 11 a line D-D;
Figure 12 is the upward view of terminal board according to another embodiment of the present invention;
Figure 13 a is the upward view of terminal board according to another embodiment of the present invention;
Figure 13 b is the sectional view of making along Figure 13 a line E-E;
Figure 14 a is the upward view of terminal board according to another embodiment of the present invention;
Figure 14 b is the sectional view of making along Figure 14 a line F-F;
Figure 15 is according to one embodiment of the invention, negative pole contact pin and comprise the assembling front view of the terminal board of projection.
Embodiment
Fig. 1 is the decomposition diagram of secondary cell.
Secondary cell is by electrode assemblie 112 being placed in jars 110 with electrode and forming with the open top 110a of cap assemblies 120 airtight containers 110, and wherein electrode assemblie 112 comprises positive and negative secondary pole plate 113 and 115 and dividing plate 114.
The negative pole contact pin 117 that is connected to negative plate 115 is soldered to a side of terminal board 160, and the anodal contact pin 116 that is connected to positive plate 113 is soldered to the opposite side of terminal board 160.Negative, positive utmost point contact pin 117 can be connected by resistance welded or laser welding with 116, and is preferably resistance welded.
Below, describe one exemplary embodiment of the present invention with reference to the accompanying drawings.Be described below with accompanying drawing in, therefore identical reference number is represented same or analogous parts, omits being repeated in this description these same or similar elements.
Fig. 2 is the decomposition diagram according to the secondary cell of the embodiment of the invention; Fig. 3 a is the upward view according to the terminal board of the embodiment of the invention; Fig. 3 b is the sectional view of making along Fig. 3 a line A-A; Fig. 4 is the upward view of terminal board according to another embodiment of the present invention; Fig. 5 is the upward view of terminal board according to another embodiment of the present invention; Fig. 6 is the upward view of terminal board according to another embodiment of the present invention; Fig. 7 a is the upward view of terminal board according to another embodiment of the present invention; Fig. 7 b is the sectional view of making along Fig. 7 a line B-B; Fig. 8 is the upward view of terminal board according to another embodiment of the present invention; Fig. 9 a is the upward view of terminal board according to another embodiment of the present invention; Fig. 9 b is the sectional view of making along Fig. 9 a line C-C; Figure 10 is the upward view of terminal board according to another embodiment of the present invention; Figure 11 a is the upward view of terminal board according to another embodiment of the present invention; Figure 11 b is the sectional view of making along Figure 11 a line D-D; Figure 12 is the upward view of terminal board according to another embodiment of the present invention; Figure 13 a is the upward view of terminal board according to another embodiment of the present invention; Figure 13 b is the sectional view of making along Figure 13 a line E-E; Figure 14 a is the upward view of terminal board according to another embodiment of the present invention; Figure 14 b is the sectional view of making along Figure 14 a line F-F; Figure 15 is according to the embodiment of the invention, negative pole contact pin and comprise the assembling front view of the terminal of projection.
With reference to Fig. 2, secondary cell according to the present invention comprises jars 210, be contained in electrode assemblie 212 in jars 210, be used for the cap assemblies 220 of the open top 210a of hermetically sealed can 210.
With reference to Fig. 3 a and Fig. 3 b, terminal board 260 is formed by nickel based metal, and is connected to the resettlement groove 252 of insulation board 250.Terminal board 260 have the 6th terminal through-hole 261, the six terminal through-hole 261 that are formed on the one side be placed with corresponding with the 4th terminal through-hole 241 of cover plate 240, thereby electrode terminal 230 can be inserted wherein.
The width of the protuberance 266 of projection 265 or diameter can be 1.0mm or littler.As mentioned above, have low-resistance nickel based metal by use and form terminal board 260, negative pole contact pin 217 resistance welded low resistance occurred and are being difficult for welding in the process of terminal board 260.Therefore, the contact area that projection 265 reduces between terminal board 260 and the negative pole contact pin 217 increases the resistance in the contact area and is more prone to welding.Each swells 266 preferable width or diameter is 1.0mm or littler, and to reduce the contact area between terminal board 260 and the negative pole contact pin 217, this is because the welding rod and the welding portion general diameter that use in the resistance welded are at least 1.0mm.
The distance of each protuberance between 266 can be 1mm at least.This is because negative pole contact pin 217 is preferably located to be welded on the terminal board 260 and the diameter of welding portion is at least 1.0mm at 2.
When protuberance 266 when smaller, become enough little with the contact area of negative pole contact pin 217, thereby arrange mutually contiguously and swell 266.
Fig. 4 is the upward view of terminal board according to another embodiment of the present invention.
Fig. 5 is the upward view of terminal board according to another embodiment of the present invention.
With reference to Fig. 5, terminal board 260b has projection 265b, and projection 265b comprises the protuberance 266b as the matrix array form as the embossing between the opposite side that is formed on the 6th terminal through-hole 261 and terminal board 260b, a plurality of.Particularly, be arranged at least two row and columns and form projection 265b by swelling 266b.When protuberance 266b formed with the matrix array form, negative pole contact pin 217 can be soldered to big zone, and can carry out welding process more easily.Protuberance 266b is preferably formed and is width or the diameter embossing less than 1.0mm.The necessary space of protuberance 266b is 1.0mm at least.Otherwise, be not easy to select negative pole contact pin 217 to arrive the welding position of projection 265b, because the weld size that is produced by resistance welded is at least 1.0mm as mentioned above.
Fig. 6 is the upward view of terminal board according to another embodiment of the present invention
With reference to Fig. 6, terminal board 260c has projection 265c, and projection 265c comprises and a plurality ofly forms the protuberance 266c of embossing with the matrix array form, and protuberance 266c is mind-set the 6th terminal through-hole 261 from terminal board 260c by dislocation.Particularly, be arranged at least two row and columns and form projection 265c by swelling 266c.When protuberance 266c formed with the matrix array form, negative pole contact pin 217 can be soldered to big zone, and can carry out welding process more easily.Width or the diameter of protuberance 266c are preferably 1.0mm or littler.Protuberance 266c space is 1.0mm at least.
Fig. 7 a and Fig. 7 b are the upward view and the sectional views of terminal board according to another embodiment of the present invention.
With reference to Fig. 7 a and Fig. 7 b, terminal board 260d has projection 265d, and projection 265d comprises that at least one forms the protuberance 266d of conductive junction point between the opposite side of the 6th terminal through-hole 261 and terminal board 260d.Negative pole contact pin 217 is soldered on the projection 265d by resistance welded.Particularly, projection 265d comprises by conductive junction point being connected to a plurality of protuberance 266d that terminal board 260d upward forms.Conductive junction point 266d is formed by the conductive materials that is shaped as ball, oval ball or sheet, and width or diameter are preferably 1.0mm or littler.Conductive junction point 266d is connected on the terminal board 260d by punching press, welding or soldering.Conductive junction point 266d is preferably formed by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy (invar alloy).But be not limited to this kind metal.When conductive junction point 266d was formed by the high metal of the resistance of resistance ratio nickel based metal, this nickel based metal constituted terminal board 260d, and when the contact pin 217 of conductive junction point 266d contact negative pole, contact resistance further increases.This has just improved resistance welded.
Protuberance in the terminal board can be the conductive junction point with the formation of matrix array form as shown in Figure 5.The preferred space of conductive junction point is 1.0mm at least.
Fig. 8 is the upward view of terminal board according to another embodiment of the present invention.
With reference to Fig. 8, terminal board 260e has projection 265e, and projection 265e comprises by the mode with the 6th terminal hole of mind-set from terminal board 260e 261 dislocations and connects the formed protuberance of at least one conductive junction point 266e.Negative pole contact pin 217 is soldered to projection 265e by resistance welded.Conductive junction point 266e is formed by the conductive materials that is shaped as ball, oval ball or plate, and width or diameter are preferably 1.0mm or littler.Conductive junction point 266e is connected on the terminal board 260e by punching press, welding or soldering.Conduction tip 266e is preferably made by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy.But be not limited thereto metal types.When conductive junction point 266e was formed by the high metal of the resistance of resistance ratio nickel based metal, this nickel based metal constituted terminal board 260e, and when the contact pin 217 of conductive junction point 266e contact negative pole, contact resistance further increases.This has just improved resistance welded.
Protuberance in the terminal board can be the conductive junction point that forms with the matrix array form as shown in Figure 6.The preferred space of conductive junction point is 1.0mm at least.
Fig. 9 a and Fig. 9 b are the upward view and the sectional views of terminal board according to another embodiment of the present invention.
With reference to Fig. 9 a and Fig. 9 b, terminal board 260f has projection 265f, forms projection 265f by connect graining board 266f between the opposite side of the 6th terminal through-hole 261 and terminal board 260f.Negative pole contact pin 217 is soldered on the upper surface of projection 265f by resistance welded.Graining board 266f has the thin plate that is formed on its lip-deep a plurality of embossing 267f with straight line or matrix array form.The width of embossing 267f or diameter are preferably 1.0mm or littler.The preferred space of embossing 267f is 1.0mm at least.Graining board 266f is preferably formed by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy, but is not limited thereto metal types.When graining board 266f was made by the high metal of the resistance of resistance ratio nickel based metal, this nickel based metal was formed terminal board 260f, and when the contact pin 217 of graining board 266f contact negative pole, contact resistance further increases.This has just improved resistance welded.Embossing 266f is connected to the lower surface of terminal board 260f by welding, soldering or stickup.
Figure 10 is the upward view of terminal board according to another embodiment of the present invention.
With reference to Figure 10, terminal board 260g has projection 265g, and the mode by the 6th terminal through-hole of mind-set from terminal board 260g 261 dislocation graining board 266f connects graining board 266f, to form projection 265g.Negative pole contact pin 217 is soldered on the upper surface of graining board 266g by resistance welded.Graining board 266g has the thin plate that is formed on its lip-deep a plurality of embossing 267g with straight line or matrix array form.The width of embossing 267g or diameter are preferably 1.0mm or littler.The preferred space of embossing 267g is 1.0mm at least.Graining board 266g is preferably formed by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy, but is not limited thereto metal types.Graining board 266g is connected to the lower surface of terminal board 260g by welding, soldering or stickup.
Figure 11 a and Figure 11 b are the upward view and the sectional views of terminal board according to another embodiment of the present invention.
With reference to Figure 11 a and Figure 11 b, terminal board 260h has projection 265h, and projection 265h comprises the excellent 266h that at least one extends between the opposite side of the 6th terminal through-hole 261 and terminal board 260h.Negative pole contact pin 217 is soldered on the projection 265h.Rod 266h can be formed by the rear surface of press-side daughter board 260h.Rod 266h length is preferably corresponding at least 50% of terminal board 260h length, thereby can easily arrange negative pole contact pin 217 in welding.If the length of excellent 266h less than 50% of terminal board 260h length, in the time that welding prolongs, must be arranged negative pole contact pin 217 exactly in welding.If arrange inaccurately, welding condition may reduce.Projection 265h preferably width is 1.0mm or littler clavate, thereby the contact area between terminal board 260h and the negative pole contact pin 217 reduces, increase the resistance in the contact area, and be easy to welding, because the welding rod general diameter that uses in resistance welded is at least 1.0mm.
Figure 12 is the upward view of terminal board according to another embodiment of the present invention.
With reference to Figure 12, terminal board 260i has projection 265i, and projection 265i preferably includes two excellent 266i that extend between the opposite side of the 6th terminal through-hole 261 and terminal board 260i.Rear surface by press-side daughter board 260i forms excellent 266i.When projection 265i comprised two excellent 266i, negative pole contact pin 217 can be soldered to bigger zone and welding becomes easy.Rod 266i preferable width is 1.0mm or littler, and space 1.0mm and being arranged in parallel at least.Because the size of welding portion is at least 1.0mm as mentioned above, the necessary space of excellent 266i is 1.0mm at least, reduces from the welding contact area, and can easily select the welding position of negative pole contact pin 217 with respect to excellent 266i.
Figure 13 a and 13b are the upward view and the sectional views of terminal board according to another embodiment of the present invention.
With reference to Figure 13 a and Figure 13 b, terminal board 260j has projection 265j, and projection 265j comprises the conductor wire 266j that at least one extends between another example of the 6th terminal through-hole 261 and terminal board 260j.Negative pole contact pin 217 is soldered on the projection 265j.Conductor wire 266j is that cross sectional shape is circular or square excellent type or template electric conductor, and preferable width or diameter are 1.0mm or littler.Conductor wire 266j is by welding, soldering or bonding being connected on the terminal board 260d.Conductor wire 266j is preferably made by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy, but is not limited thereto metal types.When conductor wire 266j was formed by the high metal of the resistance of resistance ratio nickel based metal, this nickel based metal constituted terminal board 260j, and when the contact pin 217 of conductor wire 266j contact negative pole, contact resistance further increases, and the increase of internal resistance minimizes.This has just improved resistance welded.
Figure 14 a and 14b are the upward view and the sectional views of terminal board according to another embodiment of the present invention.
With reference to Figure 14 a and Figure 14 b, terminal board 260k has projection 265k, forms projection 265k by connect web plate 266k between the opposite side of the 6th terminal through-hole 261 and terminal board 260k.Negative pole contact pin 217 is soldered on the projection 265k.Web plate 266k is made of the conductor wire that is shaped as twine, and the width of conductor wire or diameter are preferably 1.0mm or littler.The preferred space of conductor wire is 1.0mm at least.Web plate 266k is by welding, soldering or bonding being connected on the terminal board 260k.Web plate 266k is preferably made by the high metal of the resistance of resistance ratio nickel based metal, such as invar alloy, but is not limited thereto metal types.
Describe below according to the present invention, comprise the operation of the secondary cell of terminal board with formation projection thereon.
Figure 15 is the front view that has the secondary cell of the negative pole contact pin that is welded to the terminal board with formation projection thereon according to of the present invention.
When the conductive junction point that is formed by the high metal of the resistance of resistance ratio nickel based metal or conduction graining board when forming projection 265, the contact resistance between terminal board 260 and the negative pole contact pin 217 increases, and has improved weldability.
To it will be apparent to one skilled in the art that, though describe the operation of secondary cell with reference to terminal board 260 according to the present invention with projection 265, wherein by coming press-side daughter board 260 to form projection 265 with the shape of point, this description also can be applied to the embodiment that other have the projection of different structure equally.
According to secondary cell of the present invention, terminal board has formation projection thereon, and negative pole contact pin contact is to be soldered on the projection.Thereby reduce contact area but the resistance increase.This has just improved resistance welded.
Although for the purpose of description the preferred embodiment of the present invention is illustrated, it should be appreciated by those skilled in the art that the present invention can have various variants, increase and replacement under the situation that does not deviate from the spirit and scope that claims of the present invention narrate.
Claims (49)
1, a kind of secondary cell comprises:
Electrode assemblie has positive/negative plate, dividing plate and is connected respectively to the both positive and negative polarity contact pin of described positive/negative plate; With
Cap assemblies has cover plate, electrode terminal and terminal board;
Wherein this terminal board has projection, between the side and opposite side of the terminal through-hole that this projection arrangement is included in wherein having of this terminal board, is connected with this electrode terminal.
2, secondary cell as claimed in claim 1, wherein this negative pole contact pin is connected on this projection by welding.
3, secondary cell as claimed in claim 1, wherein this projection comprises and is arranged in described have a side of the terminal through-hole that is included in wherein, is connected with this electrode terminal and at least one protuberance between the opposite side.
4, secondary cell as claimed in claim 1, wherein this projection comprises at least one protuberance of this terminal through-hole dislocation of mind-set from this terminal board.
5, secondary cell as claimed in claim 3, wherein this protuberance comprises at least one embossing that is formed by the rear surface of pushing this terminal board.
6, secondary cell as claimed in claim 4, wherein this protuberance comprises at least one embossing that is formed by the rear surface of pushing this terminal board.
7, secondary cell as claimed in claim 4, wherein the length of this protuberance is at least 50% of this terminal board length.
8, secondary cell as claimed in claim 5, wherein this protuberance is shaped as circle, ellipse or polygon.
9, secondary cell as claimed in claim 5, wherein the width that should swell is less than 30% of this negative pole blade width.
10, secondary cell as claimed in claim 5, wherein the width that should swell is less than 25% of this negative pole blade width.
11, secondary cell as claimed in claim 5, wherein the width of this protuberance is 1.0mm or littler.
12, secondary cell as claimed in claim 5, wherein this protuberance comprises at least two embossings that are arranged to straight line or matrix array.
13, secondary cell as claimed in claim 12, the distance of space is greater than the width of described at least one embossing between wherein said at least two embossings.
14, secondary cell as claimed in claim 12, space 1.0mm at least between wherein said at least two embossings.
15, secondary cell as claimed in claim 12, wherein said at least two embossings are placed mutually contiguously.
16, secondary cell as claimed in claim 3, wherein this protuberance comprises the conductive junction point of the front surface that is connected to this terminal board.
17, secondary cell as claimed in claim 4, wherein this protuberance comprises the conductive junction point of the front surface that is connected to this terminal board.
18, secondary cell as claimed in claim 16, wherein this conductive junction point comprises the high metal of resistance of resistance ratio nickel based metal.
19, secondary cell as claimed in claim 16, wherein this conductive junction point comprises invar alloy.
20, secondary cell as claimed in claim 16, wherein the diameter of this conductive junction point is 1.0mm or littler.
21, secondary cell as claimed in claim 1, wherein this projection comprises the conduction graining board of the front surface that is connected to this terminal board.
22, secondary cell as claimed in claim 21, wherein this graining board comprises the high metal of resistance of resistance ratio nickel based metal.
23, secondary cell as claimed in claim 21, wherein this graining board comprises invar alloy.
24, secondary cell as claimed in claim 21, wherein the diameter of each embossing of this graining board is 1.0mm or littler, and the interval between the described embossing is at least 1.0mm.
25, secondary cell as claimed in claim 1, wherein this projection comprises at least one rod.
26, secondary cell as claimed in claim 25, wherein this projection comprises two rods that are parallel to each other and arrange.
27, secondary cell as claimed in claim 25, wherein this projection is formed by the rear surface of pushing this terminal board.
28, secondary cell as claimed in claim 25, wherein the length of this projection is at least 50% of this terminal board length.
29, secondary cell as claimed in claim 25, wherein the width of the rod of this projection is 1.0mm or littler.
30, secondary cell as claimed in claim 26, wherein space 1.0mm at least between the rod of this projection.
31, secondary cell as claimed in claim 25, wherein this projection comprises the conductor wire of the front surface that is connected to this terminal board.
32, secondary cell as claimed in claim 31, wherein this conductor wire comprises the high metal of resistance of this nickel based metal of resistance ratio.
33, secondary cell as claimed in claim 31, wherein this conductor wire comprises invar alloy.
34, secondary cell as claimed in claim 34, wherein the width of this conductor wire is 1.0mm or littler.
35, secondary cell as claimed in claim 1, wherein this projection comprises the web plate of the front surface that is connected to this terminal board.
36, secondary cell as claimed in claim 35, wherein this web plate comprises the high metal of resistance of resistance ratio nickel based metal.
37, secondary cell as claimed in claim 35, wherein this web plate comprises invar alloy.
38, secondary cell as claimed in claim 35, wherein this web plate comprises that diameter is 1.0mm or littler conductor wire, and the interval between the described conductor wire is at least 1.0mm.
39, secondary cell as claimed in claim 6, wherein this protuberance is shaped as circle, ellipse or polygon.
40, secondary cell as claimed in claim 6, wherein the width that should swell is less than 30% of this negative pole blade width.
41, secondary cell as claimed in claim 6, wherein the width that should swell is less than 25% of this negative pole blade width.
42, secondary cell as claimed in claim 6, wherein the width of this protuberance is 1.0mm or littler.
43, secondary cell as claimed in claim 6, wherein this protuberance comprises at least two embossings that are arranged to straight line or matrix array.
44, secondary cell as claimed in claim 43, the distance of space is greater than the width of described at least one embossing between wherein said at least two embossings.
45, secondary cell as claimed in claim 43, space 1.0mm at least between wherein said at least two embossings.
46, secondary cell as claimed in claim 43, wherein said at least two embossings are placed mutually contiguously.
47, secondary cell as claimed in claim 17, wherein this conductive junction point comprises the high metal of resistance of resistance ratio nickel based metal.
48, secondary cell as claimed in claim 17, wherein this conductive junction point comprises invar alloy.
49, secondary cell as claimed in claim 17, wherein the diameter of this conductive junction point is 1.0mm or littler.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20040060086 | 2004-07-30 | ||
| KR1020040060084A KR100601522B1 (en) | 2004-07-30 | 2004-07-30 | Lithium Ion Secondary battery |
| KR20040060087 | 2004-07-30 | ||
| KR20040060084 | 2004-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1728414A true CN1728414A (en) | 2006-02-01 |
| CN100438131C CN100438131C (en) | 2008-11-26 |
Family
ID=35927539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100888841A Expired - Fee Related CN100438131C (en) | 2004-07-30 | 2005-07-29 | Secondary battery |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100601522B1 (en) |
| CN (1) | CN100438131C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097611A (en) * | 2009-12-15 | 2011-06-15 | 三星Sdi株式会社 | Secondary battery |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100709872B1 (en) * | 2005-12-29 | 2007-04-20 | 삼성에스디아이 주식회사 | Secondary battery |
| KR101002542B1 (en) | 2008-10-08 | 2010-12-17 | 삼성에스디아이 주식회사 | Secondary battery with terminal plate |
| US9461295B2 (en) | 2012-05-04 | 2016-10-04 | Samsung Sdi Co., Ltd. | Rechargeable battery including terminal portion having auxiliary plate for reducing current flow along short circuit current path |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0447666A (en) * | 1990-06-11 | 1992-02-17 | Yuasa Corp | Manufacture of ni electrode plate |
| JPH0982332A (en) * | 1995-09-12 | 1997-03-28 | Furukawa Battery Co Ltd:The | Electrode plate for battery and manufacture thereof |
| KR970077783A (en) * | 1996-05-14 | 1997-12-12 | 손욱 | BATTERY PLATE FOR BATTERY AND MANUFACTURING METHOD |
| KR19990027311A (en) * | 1997-09-29 | 1999-04-15 | 손욱 | 켑 assembly of square battery |
| JP2002008623A (en) * | 2000-06-19 | 2002-01-11 | Matsushita Electric Ind Co Ltd | Battery |
| KR100859683B1 (en) * | 2002-02-05 | 2008-09-23 | 삼성에스디아이 주식회사 | Cap Assembly and Secondary Battery Therewith |
| KR100449763B1 (en) * | 2002-09-11 | 2004-09-22 | 삼성에스디아이 주식회사 | Cap assembly and secondary battery applying the same |
-
2004
- 2004-07-30 KR KR1020040060084A patent/KR100601522B1/en active IP Right Grant
-
2005
- 2005-07-29 CN CNB2005100888841A patent/CN100438131C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097611A (en) * | 2009-12-15 | 2011-06-15 | 三星Sdi株式会社 | Secondary battery |
| CN102097611B (en) * | 2009-12-15 | 2014-08-20 | 三星Sdi株式会社 | Secondary battery |
| US8999559B2 (en) | 2009-12-15 | 2015-04-07 | Samsung Sdi Co., Ltd. | Secondary battery |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100438131C (en) | 2008-11-26 |
| KR100601522B1 (en) | 2006-07-19 |
| KR20060011311A (en) | 2006-02-03 |
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Granted publication date: 20081126 |