CN201235584Y - Silicon slice wire cutting apparatus - Google Patents
Silicon slice wire cutting apparatus Download PDFInfo
- Publication number
- CN201235584Y CN201235584Y CNU2008201265584U CN200820126558U CN201235584Y CN 201235584 Y CN201235584 Y CN 201235584Y CN U2008201265584 U CNU2008201265584 U CN U2008201265584U CN 200820126558 U CN200820126558 U CN 200820126558U CN 201235584 Y CN201235584 Y CN 201235584Y
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- guide wheel
- slot pitch
- fluting
- steel wire
- wire
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Abstract
The utility model discloses a silicon chip linear cutting device which mainly comprises guiding wheels with line grooves and steel wire nets which are wound on the guiding wheels. The silicon chip line cutting device is mainly characterized in that the notching groove distances on the guiding wheels are different, the different notching groove distances are orderly reduced along the length directions of the guiding wheels from the steel wire winding the guiding wheels, and the abrasion of the reduced notching groove distances and the steel wires is adapted with each other in a cutting process. Because the groove distances are reduced, under the condition that the notching length of the prior guiding wheel is unchanged, the quantity of the line grooves is increased, the steel wire nets which are correspondingly wound on the guiding wheels are thicken, the quantity of silicon chips which are cut once is increased, and the economic benefit is obvious.
Description
Technical field
The utility model relates to a kind of silicon single crystal bar and adopts the line diced system to come the silicon chip wire-electrode cutting device of machine silicon section.
Background technology
At present, still adopt inside diameter slicer to carry out cutting processing mostly to the minor diameter silicon single crystal bar, its blade is to be embedded on the inner periphery of the thin substrate of circular metal, and the cylindrical of blade is fixed on the rotating shaft.It is compared with the cylindrical knive-edge slicer of early stage employing, it can use more thin blade, and (diameter of looking required processing is different and select cutter head and the blade that adapts for use, for example cutting diameter 200mm silicon single crystal bar need use the 34in cutter head, its thickness of knife edge is about 380 μ m, the metal substrate thickness of cutter is less than 200 μ m), so can adopt smaller cutting consumption, less allowance and higher precision to cut out thinner wafer.
Continuous development along with IC technology, technology, in order to improve silicon machining accuracy of cutting into slices and the loss that reduces the otch material and to enhance productivity, at present, in the silicon slice processing of diameter greater than 100mm, especially in diameter is processed greater than the silicon single crystal bar chips more than the 200mm, extensively adopt the line diced system to come the machine silicon section.
Line cutting technology is meant and adopts on wire-electrode cutting device by a steel wire (being typically 120 μ m), order is twined 2 or 4 guide wheels and is formed " steel wire gauze " (being carved with accurate wire casing on the guide wheel), the mortar nozzle of monocrystal rod both sides is sprayed on the mortar cutting fluid on " steel wire gauze ", high speed rotation driving " steel wire gauze " by guide wheel is taken mortar in the monocrystal rod to, steel wire is pressed on abrasive sand the cutting of carrying out abrading type on the surface of monocrystal rod, monocrystal rod is down moved at a slow speed simultaneously and is pushed over " steel wire gauze ", grinding cutting processing through several hrs can make this root silicon single crystal bar one cutter once be cut into the silicon chip of many same thickness.
As Fig. 1, Fig. 2 and shown in Figure 3, wire-electrode cutting device mainly comprises the guide wheel 1 that is carved with wire casing, is wrapped in the steel wire gauze 2 on the guide wheel 1, the workbench 3 of carrying silicon single crystal bar 5, mortar nozzle 4.
The employing line cutting technology carries out its production efficiency height of slice processing, the joint-cutting loss is little, surface damage is little, Surface Machining precision height (angularity can reach Warp＜10 μ m), so be more suitable for the slice processing of large diameter silicon monocrystal.
With processing diameter 200mm silicon single crystal is example, slice thickness is 800 μ m, per kilogram monocrystalline slice is about 13.4, every of its cutting cost is about dollar, the output of wire cutting machine is more than 5 times of inner circle cutting machine approximately, and the cutting operating cost of wire cutting machine can be lower than more than 20% of inner circle cutting machine operating cost.
But the wire casing that is carved with on the described guide wheel of above-mentioned line diced system is equally distributed, and this has just determined that the steel wire gauze that is twined on this guide wheel also is equally distributed, and the spacing of steel wire is changeless.Like this, in silicon chip line cutting process,, the diameter of steel wire is diminished gradually because steel wire is in continuous wearing and tearing, generally once impose uniformity without examining individual cases cut finish a silicon single crystal bar after, the steel wire diameter will reduce by 20 μ m at least.Because reducing of steel wire diameter, the loss of its joint-cutting diminishes, the part of cutting less just has been added on the thickness of section, with respect to section, the thickness of section is also with regard to inevitable diminishing gradually and increase gradually with steel wire diameter, make the material of this saving not obtain utilizing because steel wire attenuates, joint-cutting diminishes, but wasted on the thickness of section, and cause the thickness of the every section that a cutter once cuts into inequality, and having bigger thickness deviation, the processing quantity of its silicon chip also is changeless.
Therefore, the silicon chip wire-electrode cutting device is needed to improve.
In view of this, special the utility model that proposes.
The utility model content
The technical problems to be solved in the utility model is to overcome the deficiencies in the prior art, a kind of improved silicon chip wire-electrode cutting device is provided, diameter with the steel wire minimizing, diminish by the slotting guide roller slot pitch, guarantee silicon single crystal bar one cutter once is cut into the identical silicon chip of several thickness, improve number of sections, increase economic benefit.
For solving the problems of the technologies described above, the utility model adopts the basic design of technical scheme to be: a kind of silicon chip wire-electrode cutting device, mainly comprise the guide wheel that has wire casing, be wrapped in the steel wire gauze on the guide wheel, it is characterized in that: the fluting slot pitch on the described guide wheel is unequal fluting slot pitch, this unequal fluting slot pitch is to twine guide wheel from steel wire to begin, along reducing successively on the length direction of guide wheel.
Fluting slot pitch on the described guide wheel is unequal, be along on the guide wheel length direction, begin around first wire casing on the guide wheel from steel wire, the fluting slot pitch of adjacent two wire casings reduces successively, and slot pitch that this reduces and the steel wire diameter after its last wire casing wearing and tearing adapts.Perhaps,
Fluting slot pitch on the described guide wheel is unequal, be along on the guide wheel length direction, segmentation is provided with unequal fluting slot pitch, its number of fragments is more than two sections, the wire casing that on each section, has several fluting slot pitches to equate, and the fluting slot pitch on adjacent two sections reduces around first section beginning on the guide wheel successively from steel wire, and every section fluting slot pitch that reduces and the steel wire diameter after its wearing and tearing the last period adapts.
Fluting slot pitch on the described guide wheel is unequal, be along on the guide wheel length direction, divide 3 sections unequal fluting slot pitches, the fluting slot pitch on adjacent two sections, reduce the wire casing that on each section, has several fluting slot pitches to equate successively around first section beginning on the guide wheel from steel wire.
Fluting slot pitch on the described guide wheel is unequal, be along on the guide wheel length direction, divide 8 sections unequal fluting slot pitches, the fluting slot pitch on adjacent two sections, reduce the wire casing that on each section, has several fluting slot pitches to equate successively around the 1st section beginning on the guide wheel from steel wire.
After adopting technique scheme, the utility model compared with prior art has following beneficial effect.
A kind of silicon chip wire-electrode cutting device of the utility model, since utilized steel wire in cutting process wearing and tearing and principle that diameter diminishes, change the wire casing on the guide wheel into unequal fluting slot pitch, this fluting slot pitch is along reducing successively on the guide wheel length direction, make under the constant condition of slotting guide roller length, because reducing of fluting slot pitch, just increased the quantity of wire casing, the wire reticular density that is wrapped on the guide wheel also increases thereupon, adopt the steel wire gauze of this encryption to implement the line cutting, obviously increase the quantity of cutting silicon chip than prior art, when improving output, also increased economic benefit.Because improvement to fluting slot pitch on the guide wheel, the slot pitch that reduces gradually and the wear extent of steel wire are adapted, that is to say that the encryption quanta that makes the steel wire gauze has compensated that diameter after the wearing and tearing of invar line reduces and the recruitment that causes being cut silicon wafer thickness, not only can improve number of sections, increase economic benefit, also can improve chipping qualities, make silicon single crystal bar one cutter once be cut into the identical silicon chip of several thickness.
For example, use existing 2 the Switzerland MEYER BURGER DS265 molded lines cutting machines of the applicant, because the silicon chip cutting groove of guide wheel is after improvement, slot pitch divides 3 sections to reduce successively, one cutter once every machine can be cut 6 more, press 58 yuan of calculating for every, every month cuts the silicon chip number more is 1080, can increase by 62640 yuan of total revenues.
Use existing 12 the Switzerland MEYER BURGER DS264 molded lines cutting machines of the applicant, guided wheel slot reduces successively apart from dividing 8 sections, and a cutter once every machine can be cut 26 more, and every by 58 yuan of calculating, cut the silicon chip number in every month is 28080 more, can increase by 1628640 yuan of total revenues.
In a word, the utility model silicon chip wire-electrode cutting device to the improvement of slotting guide roller slot pitch, changes unequal slot pitch into by slot pitch such as original, this slot pitch is along reducing successively on the guide wheel length direction, wire casing quantity is increased, and the encryption of wire casing on the guide wheel correspondingly makes the steel wire gauze on the guide wheel encrypt, the silicon chip wire-electrode cutting device that adopts this steel wire gauze to encrypt, silicon single crystal bar is carried out the line cutting, compared with prior art obviously improved number of sections and quality, economic benefit is very remarkable.
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail.
Description of drawings
Fig. 1 is a prior art steel wire cutting silicon single crystal bar schematic diagram;
Fig. 2 is a schematic diagram before the cutting of prior art silicon chip cutter sweep;
Fig. 3 is a prior art silicon chip cutter sweep cutting back schematic diagram;
Fig. 4 is that the utility model silicon chip cutting guided wheel slot is apart from an improved embodiment schematic diagram;
Fig. 5 is that the utility model silicon chip cutting guided wheel slot is apart from improved another embodiment schematic diagram.
The specific embodiment
As Fig. 1, Fig. 2, Fig. 3, Fig. 4 and shown in Figure 5, a kind of silicon chip wire-electrode cutting device of the utility model is on the basis of existing apparatus, utilizes the wearing and tearing in the online cutting process of steel wire and principle that diameter diminishes, mainly its guide wheel is improved, make it to adapt to the requirement that the steel wire gauze is encrypted.This device mainly comprises the guide wheel 1 that has wire casing, be wrapped in the steel wire gauze 2 on the guide wheel 1, the fluting slot pitch is originally equidistant on this guide wheel 1, principal character of the present utility model is to change the fluting slot pitch on the described guide wheel 1 into unequal fluting slot pitch, this unequal fluting slot pitch is to twine guide wheel from steel wire to begin, along reducing successively on the length direction of guide wheel, thereby the steel wire gauze that is wrapped on this guide wheel wire casing is encrypts shape gradually, reduce and cause being cut the recruitment of silicon wafer thickness in order to the diameter after the wearing and tearing of compensation invar line.Unequal fluting slot pitch on the guide wheel there are following two kinds of embodiments:
First kind of embodiment, unequal fluting slot pitch on the described guide wheel 1 is along on the guide wheel length direction, begins around first wire casing on the guide wheel 1 from steel wire, the fluting slot pitch of adjacent two wire casings reduces successively, and slot pitch that this reduces and the steel wire diameter after its last wire casing wearing and tearing adapts.
Second kind of embodiment, unequal fluting slot pitch on the described guide wheel 1, be unequal fluting slot pitch to be set along segmentation on the guide wheel length direction, its number of fragments is more than two sections, the wire casing that on each section, has several fluting slot pitches to equate, and the fluting slot pitch on adjacent two sections reduces around first section beginning on the guide wheel 1 successively from steel wire, and every section fluting slot pitch that reduces and the steel wire diameter after its wearing and tearing the last period adapts.This second kind of embodiment is the utility model optimized technical scheme.
In second kind of embodiment, segmentation is provided with unequal fluting slot pitch on guide wheel, also has following two specific embodiments, to illustrate further in the silicon chip wire-electrode cutting device improvement and the beneficial effect to the guided wheel slot distance.
Embodiment one
As shown in Figure 4, the fluting slot pitch on the described guide wheel 1 is unequal, is along on the guide wheel length direction, divide 3 sections unequal fluting slot pitches, fluting slot pitch on adjacent two sections reduces around first section beginning on the guide wheel 1 successively from steel wire, the wire casing that has several fluting slot pitches to equate on each section.As shown in Figure 4, on the length direction of guide wheel 1, be divided into 3 sections unequal fluting slot pitches, i.e. the fluting slot pitch of first section A by slotting length L1〉the fluting slot pitch of second section B〉the fluting slot pitch of the 3rd section C.Fluting slot pitch on the 1st section A, the 2nd section B, the 3rd section C equates respectively.
The applicant improves on the silicon chip wire-electrode cutting device of following model according to above-mentioned technical characterictic:
A. existing Switzerland MEYER BURGER DS265 type machine guided wheel slot is apart from structure:
Slotting length L1=310mm, several 925 of total groove, fluting slot pitch 0.335mm.
B. increase slot pitch quantity through improving
Use Switzerland MEYER BURGER DS265 type machine, under the condition of slotting length L1=310mm, grooving method divides 3 sections flutings, the slot pitch that each section gone up fluting equates respectively, the 1st section A fluting slot pitch is 0.335mm, and the 2nd section B fluting slot pitch is 0.333mm, and the 3rd section C fluting slot pitch is 0.33mm.Because the fluting slot pitch divides 3 sections to reduce successively, makes the bus duct number be increased to 932, increases several 6 of slot pitch, thereby increase by 6 of number of sections.The slice thickness deviation is corresponding to be reduced.
C. economic benefit
Use a Switzerland MEYER BURGER DS265 molded lines cutting machine, the quantity that a cutter once cuts silicon chip has had more 6 of silicon chips, and having more a slice increases by 58 yuan of benefits, and promptly a cutter once increases by 348 yuan of benefits, can increase benefit and be at least 31320 yuan in every month.
Calculate by existing two the Switzerland MEYER BURGER DS265 molded lines cutting machines of the applicant, can cut out 1080 slice in every month more, the increase total revenue was 62640 yuan in every month.
Embodiment two
As shown in Figure 5, the fluting slot pitch on the described guide wheel 1 is unequal, is along on the guide wheel length direction, divide 8 sections unequal fluting slot pitches, fluting slot pitch on adjacent two sections reduces around the 1st section beginning on the guide wheel 1 successively from steel wire, the wire casing that has several fluting slot pitches to equate on each section.
The applicant improves on the silicon chip wire-electrode cutting device of following model according to above-mentioned technical characterictic:
A. existing Switzerland MEYER BURGER DS264 type machine guided wheel slot is apart from structure:
Slotting length L2=820mm, several 2448 of total groove, fluting slot pitch 0.335mm.
B. increase slot pitch quantity through improving:
Use Switzerland MEYER BURGER DS264 type machine, under the condition of slotting length L2=820mm, consult Fig. 5, grooving method divides 8 sections flutings, the slot pitch of each section fluting equates respectively, the 1st section A fluting slot pitch is 0.335mm, the 2nd section B fluting slot pitch is 0.334mm, the 3rd section C fluting slot pitch is 0.333mm, the 4th section D fluting slot pitch is 0.332mm, and the 5th section E fluting slot pitch is 0.331mm, and the 6th section F fluting slot pitch is 0.33mm, the 7th section G fluting slot pitch is 0.329mm, and the 8th section H fluting slot pitch is 0.328mm.Because the fluting slot pitch divides 8 sections to reduce successively, makes the bus duct number be increased to 2475, increases several 26 of slot pitch, thereby increase by 26 of number of sections.The slice thickness deviation is corresponding to be reduced.
C. economic benefit
Use a Switzerland MEYER BURGER DS264 molded lines cutting machine, the quantity that a cutter once cuts silicon chip has had more 26 of silicon chips, and having more a slice increases by 58 yuan of benefits, and promptly a cutter once increases by 1508 yuan of benefits, but at least 135720 yuan of every month additional incomes.
By existing 12 the Switzerland MEYER BURGER DS264 type computer of the applicant, cut several 28080 of silicon chip in every month more, every month increases total revenue is 1628640 yuan.
Generally speaking, above-mentioned the utility model silicon chip wire-electrode cutting device, having now under the constant condition of slotting guide roller length, structure to the slotting guide roller slot pitch, after improving, utilize steel wire in cutting process wearing and tearing and principle that diameter diminishes, by the equally distributed equidistant slot pitch on the prior art guide wheel, change the unequal fluting slot pitch of uneven distribution into, this fluting slot pitch reduces on the length direction of guide wheel successively, wire casing quantity is increased, the encryption of wire casing correspondingly makes the steel wire gauze that is wrapped on the guide wheel encrypt on the guide wheel, and the silicon chip wire-electrode cutting device that adopts this steel wire gauze to encrypt gradually carries out the line cutting to silicon single crystal bar, improved the quality and quantity of section effectively, remarkable in economical benefits is improved.
Claims (5)
1. silicon chip wire-electrode cutting device, mainly comprise the guide wheel (1) that has wire casing, be wrapped in the steel wire gauze (2) on the guide wheel (1), it is characterized in that: the fluting slot pitch on the described guide wheel (1) is unequal fluting slot pitch, this unequal fluting slot pitch is to twine guide wheel from steel wire to begin, along reducing successively on the length direction of guide wheel.
2. according to the described a kind of silicon chip wire-electrode cutting device of claim 1, it is characterized in that: the fluting slot pitch on the described guide wheel (1) is unequal, be along on the guide wheel length direction, begin around first wire casing on the guide wheel (1) from steel wire, the fluting slot pitch of adjacent two wire casings reduces successively, and slot pitch that this reduces and the steel wire diameter after its last wire casing wearing and tearing adapts.
3. according to the described a kind of silicon chip wire-electrode cutting device of claim 1, it is characterized in that: the fluting slot pitch on the described guide wheel (1) is unequal, be along on the guide wheel length direction, segmentation is provided with unequal fluting slot pitch, its number of fragments is more than two sections, the wire casing that on each section, has several fluting slot pitches to equate, and the fluting slot pitch on adjacent two sections, reduce successively around first section beginning on the guide wheel (1) from steel wire, every section fluting slot pitch that reduces and the steel wire diameter after its wearing and tearing the last period adapts.
4. according to claim 1 or 3 described a kind of silicon chip wire-electrode cutting devices, it is characterized in that: the fluting slot pitch on the described guide wheel (1) is unequal, be along on the guide wheel length direction, divide 3 sections unequal fluting slot pitches, fluting slot pitch on adjacent two sections, reduce the wire casing that on each section, has several fluting slot pitches to equate successively around first section beginning on the guide wheel (1) from steel wire.
5. according to claim 1 or 3 described a kind of silicon chip wire-electrode cutting devices, it is characterized in that: the fluting slot pitch on the described guide wheel (1) is unequal, be along on the guide wheel length direction, divide 8 sections unequal fluting slot pitches, fluting slot pitch on adjacent two sections, reduce the wire casing that on each section, has several fluting slot pitches to equate successively around the 1st section beginning on the guide wheel (1) from steel wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201265584U CN201235584Y (en) | 2008-07-01 | 2008-07-01 | Silicon slice wire cutting apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008201265584U CN201235584Y (en) | 2008-07-01 | 2008-07-01 | Silicon slice wire cutting apparatus |
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| CN201235584Y true CN201235584Y (en) | 2009-05-13 |
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| CNU2008201265584U Expired - Lifetime CN201235584Y (en) | 2008-07-01 | 2008-07-01 | Silicon slice wire cutting apparatus |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2010000169A1 (en) * | 2008-07-01 | 2010-01-07 | 内蒙古晟纳吉光伏材料有限公司 | A device for cutting wafers by wire and its method |
| CN101879757A (en) * | 2010-04-01 | 2010-11-10 | 浙江硅宏电子科技有限公司 | Installation method of crystal bars in multi-wire cutting machine |
| CN102133775A (en) * | 2011-01-14 | 2011-07-27 | 江西赛维Ldk太阳能高科技有限公司 | Method for installing crystalline silicon briquettes |
| CN102229214A (en) * | 2010-12-31 | 2011-11-02 | 浙江昱辉阳光能源有限公司 | Nozzle for production of silicon chip and silicon chip production system |
| CN102950660A (en) * | 2011-08-26 | 2013-03-06 | 昆山中辰矽晶有限公司 | Wire cutting device, main wheel structure thereof and method for manufacturing main wheel structure |
| CN103496043A (en) * | 2013-10-16 | 2014-01-08 | 内蒙古中环光伏材料有限公司 | Linear cutting sheave for solar silicon wafers |
| CN104511975A (en) * | 2013-09-26 | 2015-04-15 | 硅电子股份公司 | Method for simultaneously cutting a multiplicity of wafers from a workpiece |
| CN110978304A (en) * | 2019-12-25 | 2020-04-10 | 无锡荣能半导体材料有限公司 | Silicon rod cutting method for reducing wire breakage rate of fine-lined wire mesh and prolonging service life of guide wheel |
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- 2008-07-01 CN CNU2008201265584U patent/CN201235584Y/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2010000169A1 (en) * | 2008-07-01 | 2010-01-07 | 内蒙古晟纳吉光伏材料有限公司 | A device for cutting wafers by wire and its method |
| CN101879757A (en) * | 2010-04-01 | 2010-11-10 | 浙江硅宏电子科技有限公司 | Installation method of crystal bars in multi-wire cutting machine |
| CN102229214A (en) * | 2010-12-31 | 2011-11-02 | 浙江昱辉阳光能源有限公司 | Nozzle for production of silicon chip and silicon chip production system |
| CN102133775A (en) * | 2011-01-14 | 2011-07-27 | 江西赛维Ldk太阳能高科技有限公司 | Method for installing crystalline silicon briquettes |
| CN102950660B (en) * | 2011-08-26 | 2015-04-08 | 昆山中辰矽晶有限公司 | Wire cutting device, main wheel structure thereof and method for manufacturing main wheel structure |
| CN102950660A (en) * | 2011-08-26 | 2013-03-06 | 昆山中辰矽晶有限公司 | Wire cutting device, main wheel structure thereof and method for manufacturing main wheel structure |
| CN104511975A (en) * | 2013-09-26 | 2015-04-15 | 硅电子股份公司 | Method for simultaneously cutting a multiplicity of wafers from a workpiece |
| US9333673B2 (en) | 2013-09-26 | 2016-05-10 | Siltronic Ag | Method for simultaneously cutting a multiplicity of wafers from a workpiece |
| CN103496043A (en) * | 2013-10-16 | 2014-01-08 | 内蒙古中环光伏材料有限公司 | Linear cutting sheave for solar silicon wafers |
| CN110978304A (en) * | 2019-12-25 | 2020-04-10 | 无锡荣能半导体材料有限公司 | Silicon rod cutting method for reducing wire breakage rate of fine-lined wire mesh and prolonging service life of guide wheel |
| EP3943265A1 (en) * | 2020-07-21 | 2022-01-26 | Siltronic AG | Method and device for simultaneously separating a plurality of plates from a workpiece |
| WO2022017803A1 (en) * | 2020-07-21 | 2022-01-27 | Siltronic Ag | Method and device for simultaneously separating a plurality of discs from a workpiece |
| CN113145670A (en) * | 2021-05-17 | 2021-07-23 | 山东绿钢环保科技股份有限公司 | Metal plate belt grinding descaling system |
| CN113145670B (en) * | 2021-05-17 | 2022-04-08 | 山东绿钢环保科技股份有限公司 | Metal plate belt grinding descaling system |
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Granted publication date: 20090513 |