CN201516649U - Wire cutting machine home roll - Google Patents
Wire cutting machine home roll Download PDFInfo
- Publication number
- CN201516649U CN201516649U CN2009202173283U CN200920217328U CN201516649U CN 201516649 U CN201516649 U CN 201516649U CN 2009202173283 U CN2009202173283 U CN 2009202173283U CN 200920217328 U CN200920217328 U CN 200920217328U CN 201516649 U CN201516649 U CN 201516649U
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- home roll
- slot pitch
- cutting machine
- wire cutting
- roll
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Abstract
The utility model discloses a wire cutting machine home roll, including a cylindrical home roll, wherein a plurality of grooves are opened at the excircle surface of the home roll, the flute pitch of the grooves are descended in sequence from left to right to adapt to the steel wire abrasion trend, and the degressive fixed value is the value of the difference value of the inlet flute pitch and outlet dividedly evenly by all home roll flute pitches, thereby realizing the wire cutting machining silicon wafer thickness consistency in the solar energy field, to further improve the yield and product quality of the monocrystalline silicon bar and to reduce production costs.
Description
Technical field
The utility model relates to a kind of home roll, produces the home roll for line cutting machine structure of silicon chip in particularly a kind of field of solar energy.
Background technology
In the solar energy industry in the widely used digital control wire-electrode cutting equipment, there is a kind of steel wire that is used for to twine and make steel wire line up the auxiliary cut workpiece of gauze in order, be commonly called as home roll; The thickness of cutting silicon chip is exactly that slot pitch by home roll is determined.In multi-thread cutting processing silicon chip process, the accurate roller that the macromolecule resin material that home roll is applied by iron core and its outside is formed, it is the critical component of control silicon wafer thickness, be carved with the groove with certain width and degree of depth that is formed by high-accuracy lathe in machining on its surperficial macromolecule resin, the slot pitch of groove, steel wire diameter and abrasive size have determined the thickness size of silicon chip.For a long time, owing to be subjected to its traditional habit influence when Japan introduces high-accuracy numerically controlled lathe, fluting is the processing method that adopts constant slot pitch always.This has just brought a problem, because multi-line cutting machine is in cutting process, as the cut vector steel wire from silicon rod one end to from the other end inevitably since the ablation that is subjected to diamond dust be tapered, maximum can arrive 6 microns, causing under the constant situation of slot pitch and abrasive material that the silicon chip that cuts is corresponding can progressive additive, and thickness can increase by 6 microns at most, so not only cause the waste of material, and silicon wafer thickness also can become uneven, directly influenced the raising of yield rate.
Chinese patent 20082016654.3 discloses a kind of home roll for line cutting machine, have several grooves on its home roll from left to right, about groove is distributed in two zones, the slot pitch that is positioned at the left field inner groovy is greater than the slot pitch that is positioned at the right side area inner groovy, but about the slot pitch equalization of each groove in the zone.Although the problem that adopts segmentation to successively decrease and to avoid silicon wafer thickness to differ greatly, but a small amount of thin and thick sheet can appear, this is to change because the steel wire wearing and tearing are linear rule, and successively decreasing of home roll slot pitch is that the segmentation scalariform is successively decreased, present discontinuity, therefore still there is certain difference, can not guarantees the uniformity of silicon wafer thickness.
The utility model content
The utility model has overcome the defective of prior art, and a kind of home roll for line cutting machine is provided, and realizes the uniformity of silicon wafer thickness, and improves piece rate.
For solving the problems of the technologies described above, technical solution adopted in the utility model is:
A kind of home roll for line cutting machine comprises roll body, has some grooves on the periphery of roll body, and the slot pitch of described groove is from left to right successively decreased successively.
The further improvement of described groove is: the slot pitch of groove reduces according to fixed value equal difference.
The further improvement of described groove also is: described fixed value is divided numerical value between the fluted distance of home roll equally by the difference of incoming line slot pitch and line outlet slot pitch.
Owing to adopted above technical scheme, the obtained technological progress of the utility model is:
Structure of the present utility model is with respect to even fluting science more, change original constant slot pitch into the variation slot pitch, the home roll slot pitch is changed to be consistent with the wear trend of steel wire, present decline trend, thereby realize the uniformity of silicon wafer thickness, further improve the piece rate and the product quality of silicon single crystal rod, reduce production costs.Adopt automatic control equipment that home roll is slotted, only need initial values such as input incoming line slot pitch, line outlet slot pitch and fixed value, can realize that slot pitch reduces the purpose of slotting successively according to fixed value; Also avoided simultaneously each slot pitch is carried out loaded down with trivial details calculating, and simple operation, increased the accuracy of calculating and the stability of work, improved operating efficiency greatly.
Description of drawings
Fig. 1: the structural representation of the home roll groove of a kind of embodiment of the utility model.
Wherein: 1. roll body, 2. groove, 3. incoming line slot pitch, 4. line outlet slot pitch, 5. main roller slotting length.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in more detail.
A kind of home roll for line cutting machine as shown in Figure 1 comprises cylindrical roll body 1, and some the grooves 2 that have successively from left to right on the periphery of roll body 1, and the slot pitch of groove 2 is successively decreased successively according to fixed value N.
At first calculating incoming line slot pitch 3 is 334 microns, deducts the steel wire attrition value again and is 6 microns and calculate line outlet slot pitch 4 and be the 334-6=328 micron; Go out average slot pitch according to the mean value calculation of incoming line slot pitch and line outlet slot pitch then and be (334+328) ÷ 2=331 micron; Be 320 millimeters according to main roller slotting length 5 again and calculate several 320 * 1000 ÷ of total groove 331 ≈ 967, at last the attrition value of steel wire is shared that to calculate the fixed value of successively decreasing in total groove number be 6 ÷ 967=0.006204 microns for 6 microns divided by average slot pitch.
Aforementioned calculation result's parameters such as incoming line slot pitch, line outlet slot pitch and fixed value are input in the automatic control equipment, and the necking tool of automatic control equipment can be slotted to home roll from initial position.At first open first groove according to the incoming line slot pitch in the incoming line starting point; Move to the next position by incoming line slot pitch distance again and open second groove, the slot pitch of second groove is the 334-0.006204=333.993796 micron; Move to next position according to the slot pitch of second groove again and remove out the 3rd groove, the slot pitch of the 3rd groove is the 333.993796-0.006204=333.987592 micron; By that analogy, till ending last line outlet groove, the slot pitch of line outlet groove is 328 millimeters.
In the process that adopts automatic control equipment that home roll is slotted, can also radially feed distance, home roll rotating speed, lathe tool length feed speed improve the fineness of silicon chip surface by the adjustment form facing.In when fluting, reduce home roll rotating speed and lathe tool length feed speed, with original once radially feed be decomposed into twice feed, can so that the fineness of workpiece coating surface improve greatly, thereby further improve the quality of silicon chip.
Claims (3)
1. a home roll for line cutting machine comprises roll body, has some grooves on the roll body periphery, and it is characterized in that: the slot pitch of described adjacent grooves is from left to right successively decreased successively.
2. a kind of home roll for line cutting machine according to claim 1 is characterized in that: the slot pitch of described groove reduces according to fixed value equal difference.
3. a kind of home roll for line cutting machine according to claim 2 is characterized in that: described fixed value is divided numerical value between the fluted distance of home roll equally by the difference of incoming line slot pitch and line outlet slot pitch.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202173283U CN201516649U (en) | 2009-09-28 | 2009-09-28 | Wire cutting machine home roll |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009202173283U CN201516649U (en) | 2009-09-28 | 2009-09-28 | Wire cutting machine home roll |
Publications (1)
Publication Number | Publication Date |
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CN201516649U true CN201516649U (en) | 2010-06-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2009202173283U Expired - Fee Related CN201516649U (en) | 2009-09-28 | 2009-09-28 | Wire cutting machine home roll |
Country Status (1)
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CN (1) | CN201516649U (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102275233A (en) * | 2011-09-06 | 2011-12-14 | 太仓协鑫光伏科技有限公司 | Method for cutting 170-micrometer silicon wafers |
CN111516160A (en) * | 2020-05-11 | 2020-08-11 | 福建晶安光电有限公司 | Multi-wire cutting machine |
CN112008902A (en) * | 2019-05-29 | 2020-12-01 | 信越半导体株式会社 | Method for cutting ingot |
EP3943265A1 (en) | 2020-07-21 | 2022-01-26 | Siltronic AG | Method and device for simultaneously separating a plurality of plates from a workpiece |
-
2009
- 2009-09-28 CN CN2009202173283U patent/CN201516649U/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102275233A (en) * | 2011-09-06 | 2011-12-14 | 太仓协鑫光伏科技有限公司 | Method for cutting 170-micrometer silicon wafers |
CN112008902A (en) * | 2019-05-29 | 2020-12-01 | 信越半导体株式会社 | Method for cutting ingot |
CN111516160A (en) * | 2020-05-11 | 2020-08-11 | 福建晶安光电有限公司 | Multi-wire cutting machine |
CN111516160B (en) * | 2020-05-11 | 2022-06-17 | 福建晶安光电有限公司 | Multi-wire cutting machine |
EP3943265A1 (en) | 2020-07-21 | 2022-01-26 | Siltronic AG | Method and device for simultaneously separating a plurality of plates from a workpiece |
WO2022017803A1 (en) | 2020-07-21 | 2022-01-27 | Siltronic Ag | Method and device for simultaneously separating a plurality of discs from a workpiece |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Ningjin Songgong Electronic Material Co., Ltd. Assignor: Jinglong Industry Group Co., Ltd. Contract record no.: 2010130000094 Denomination of utility model: Wire cutting machine home roll Granted publication date: 20100630 License type: Exclusive License Record date: 20100831 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100630 Termination date: 20150928 |
|
EXPY | Termination of patent right or utility model |