CN205588495U - Cutting steel wire and cutting steel wire former - Google Patents
Cutting steel wire and cutting steel wire former Download PDFInfo
- Publication number
- CN205588495U CN205588495U CN201620146607.5U CN201620146607U CN205588495U CN 205588495 U CN205588495 U CN 205588495U CN 201620146607 U CN201620146607 U CN 201620146607U CN 205588495 U CN205588495 U CN 205588495U
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- steel wire
- cutting steel
- wave
- cutting
- sawtooth
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Abstract
The utility model discloses a cutting steel wire of silicon chip cutting, cutting steel wire are continuous wave configuration, and the wave configuration who just cuts the steel wire is the sawtooth partial wave, the ripple form design that to cut the steel wire is continuous sawtooth partial wave, because the preceding half -wave of sawtooth partial wave is inequality with the length of back half -wave, the sawtooth partial wave is difficult is flare -outed, sine wave with the same wavelength and wave height is compared, the preceding half -wave of sawtooth partial wave and the contained angle that afterwards forms between the half -wave can carry more abrasive materials, has stronger cutting ability, consequently, can effectively improve cutting speed and cutting efficiency, abrasive materials a large amount of in addition can effectively reduce the direct contact who cuts steel wire and silicon chip, low heat generation falls. The utility model also discloses a cutting steel wire former.
Description
Technical field
This utility model relates to silicon chip cutting field, particularly relates to a kind of cutting steel wire for silicon chip cutting.Additionally, this utility model further relates to a kind of cutting steel wire molding device.
Background technology
Silicon chip cutting is one of key component of photovoltaic generation industry, and it drives the cutting abrasive material being attached on steel wire to rub silicon rod mainly by the cutting steel wire of high-speed motion, thus reaches cutting effect.
Cutting steel wire is as the carrier of cutting abrasive material, and cutting steel wire directly affects cutting speed and the cutting efficiency of silicon chip to the carrying capacity of abrasive material.It mostly is circular for the wire cross-section face of silicon chip cutting, and in axial direction in straight line style, this cutting steel wire is during silicon chip cuts, skid serious, and carry the ability cutting abrasive material, and causing too much directly the contacting of cutting steel wire and silicon chip, caloric value is high and cutting efficiency is low.
In order to solve the problems referred to above, occur in that a kind of corrugated cutting steel wire, refer to the structural representation that Fig. 1 and Fig. 2, Fig. 1 are a kind of cutting steel wire of the prior art, Fig. 2 be a kind of cutting steel wire of the prior art carry abrasive material view.Corrugated cutting steel wire 1 of the prior art is the sinusoidal wave-like configuration that straight steel wire is processed into continuously smooth, what wavy texture can increase cutting steel wire 1 within the specific limits takes material ability, but in silicon chip cutting process, sinuous cutting steel wire 1 is easily straightened, the serious cutting steel wire 1 that reduces carries the ability of abrasive material, directly affects silicon chip cutting efficiency.
The most how to make cutting steel wire have a bigger abrasive material ability of carrying and higher cutting efficiency is that those skilled in the art are presently required and solve the technical problem that.
Utility model content
The purpose of this utility model is to provide a kind of cutting steel wire for silicon chip cutting so that it is have bigger abrasive material ability of carrying and higher cutting efficiency.Another object of the present utility model is to provide a kind of cutting steel wire molding device.
For solving above-mentioned technical problem, this utility model provides a kind of cutting steel wire for silicon chip cutting, and described cutting steel wire is continuous print wavy texture, and the wavy texture of described cutting steel wire is sawtooth partial wave.
Preferably, described cutting steel wire is continuous and uniform sawtooth partial wave shape structure distribution.
Preferably, wave height is its wavelength 1/2～1/3 times of described sawtooth partial wave.
Preferably, the outer surface of described cutting steel wire is provided with ormolu coating.
This utility model also provides for a kind of cutting steel wire molding device, and including for processing cutting steel wire and the gear being arranged in pairs, described tooth-formation of gear is sawtooth partial wave shape.
Preferably, the tooth pitch of described gear is 1/2～1/3 times of the facewidth.
The cutting steel wire for silicon chip cutting that this utility model provides, cutting steel wire is the inclined wavy texture of continuous print sawtooth.The corrugations of cutting steel wire is designed as continuous print sawtooth partial wave, owing to the front half-wave of sawtooth partial wave differs with the length of rear half-wave, sawtooth partial wave is difficult to be straightened, with phase co-wavelength is compared with the sine wave of wave height, the angle formed between front half-wave and the rear half-wave of sawtooth partial wave can carry more abrasive material, there is higher cutting power, therefore, it is possible to be effectively improved cutting speed and cutting efficiency；The most substantial amounts of abrasive material can effectively reduce cutting steel wire and contact with the direct of silicon chip, reduces caloric value.
Straight cutting steel wire can be processed into the cutting steel wire in sawtooth partial wave shape structure distribution by the cutting steel wire molding device that this utility model provides.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of cutting steel wire of the prior art；
Fig. 2 be a kind of cutting steel wire of the prior art carry abrasive material view；
Fig. 3 is the structural representation of a kind of detailed description of the invention of cutting steel wire provided by the utility model；
Fig. 4 be a kind of detailed description of the invention of cutting steel wire provided by the utility model carry abrasive material view；
Fig. 5 is the working state schematic representation of a kind of detailed description of the invention of cutting steel wire molding device provided by the utility model.
Detailed description of the invention
Core of the present utility model is to provide a kind of cutting steel wire for silicon chip cutting so that it is have bigger abrasive material ability of carrying and higher cutting efficiency.Another core of the present utility model is to provide a kind of cutting steel wire molding device.
In order to make those skilled in the art be more fully understood that this utility model scheme, the utility model is described in further detail with detailed description of the invention below in conjunction with the accompanying drawings.
Refer to the structural representation of a kind of detailed description of the invention that Fig. 3 to Fig. 4, Fig. 3 are cutting steel wire provided by the utility model；Fig. 4 be a kind of detailed description of the invention of cutting steel wire provided by the utility model carry abrasive material view.
This utility model detailed description of the invention provides a kind of cutting steel wire for silicon chip cutting, and cutting steel wire 1 is continuous print wavy texture, and the wavy texture of cutting steel wire 1 is sawtooth partial wave.
The corrugations of cutting steel wire 1 is designed as continuous print sawtooth partial wave, owing to the front half-wave of sawtooth partial wave and the length of rear half-wave differ, sawtooth partial wave is difficult to be straightened, with phase co-wavelength L compares with the sine wave of wave height h, the angle β formed between front half-wave and the rear half-wave of sawtooth partial wave can carry more abrasive material, there is higher cutting power, therefore, it is possible to be effectively improved cutting speed and cutting efficiency；The most substantial amounts of abrasive material can effectively reduce cutting steel wire 1 and contact with the direct of silicon chip, reduces caloric value.
This utility model detailed description of the invention provides a kind of cutting steel wire for silicon chip cutting, and cutting steel wire 1 can be in continuous and uniform sawtooth partial wave shape structure distribution；The inclined wavy texture of sawtooth of continuous uniform, not only makes cutting steel wire 1 remain linear stable in silicon chip cutting process, improves cutting stability, moreover it is possible to improves the cutting efficiency of cutting steel wire 1, is also convenient for processing simultaneously.Certainly, the concrete structure of cutting steel wire 1 is not limited to that, it would however also be possible to employ the inclined wavy texture of sawtooth etc. of uneven distribution, all within protection domain of the present utility model.
Furthermore it is possible to wave height h of sawtooth partial wave to be set to 1/2～1/3 times of its wavelength L, the feeding rate of silicon rod when cutting steel wire 1 cuts silicon crystal can be improved further, and then improve cutting efficiency.With existing sinusoidal wave shape cutting steel wire 1 is compared; the wavelength L of sawtooth partial wave and wave height h can keep constant; the concrete numerical value of wavelength L and wave height h can also adjust, all within protection domain of the present utility model according to parameters such as the production efficiencys of the diameter of cutting steel wire 1 or silicon chip.
On the basis of above-mentioned each detailed description of the invention, ormolu coating can also be provided with at the outer surface of cutting steel wire 1, ormolu coating can play the most antirust, lubrication and wear-resisting effect, it is also possible to increases the surface toughness of cutting steel wire 1, reduces the probability of silicon chip working process interrupt line.Brass coating etc. can also be selected, if the cutting of beneficially silicon chip, all within protection domain of the present utility model.
Refer to the working state schematic representation of a kind of detailed description of the invention that Fig. 5, Fig. 5 are cutting steel wire molding device provided by the utility model.
Except above-mentioned cutting steel wire 1, detailed description of the invention of the present utility model also provides for a kind of cutting steel wire molding device, this cutting steel wire molding device includes the gear 2 being arranged in pairs, and after the gear 2 through being arranged in pairs rolls, the most straight cutting steel wire 1 can be processed to the cutting steel wire 1 of corrugations.The profile of tooth of the gear 2 being arranged in pairs is sawtooth partial wave shape, so as to process the cutting steel wire 1 of sawtooth partial wave shape；Additionally, the tooth pitch of gear 2 is specifically as follows 1/2～1/3 times of its facewidth so that wave height h of the cutting steel wire 1 processed is 1/2～1/3 times of its wavelength L.The structure of these cutting steel wire other each several parts of molding device refer to prior art, repeats no more herein.
Above cutting steel wire provided by the utility model and cutting steel wire molding device are described in detail.Principle of the present utility model and embodiment are set forth by specific case used herein, and the explanation of above example is only intended to help to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; on the premise of without departing from this utility model principle, it is also possible to this utility model is carried out some improvement and modification, these improve and modification also falls in this utility model scope of the claims.
Claims (6)
1., for a cutting steel wire for silicon chip cutting, described cutting steel wire is continuous print wavy texture, it is characterised in that the wavy texture of described cutting steel wire is sawtooth partial wave.
Cutting steel wire the most according to claim 1, it is characterised in that described cutting steel wire is continuous and uniform sawtooth partial wave shape structure distribution.
Cutting steel wire the most according to claim 2, it is characterised in that wave height is its wavelength 1/2～1/3 times of described sawtooth partial wave.
Cutting steel wire the most according to claim 1, it is characterised in that the outer surface of described cutting steel wire is provided with ormolu coating.
5. a cutting steel wire molding device, including for processing cutting steel wire and the gear being arranged in pairs, it is characterised in that described tooth-formation of gear is sawtooth partial wave shape.
Cutting steel wire molding device the most according to claim 5, it is characterised in that the tooth pitch of described gear is 1/2～1/3 times of the facewidth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620146607.5U CN205588495U (en) | 2016-02-26 | 2016-02-26 | Cutting steel wire and cutting steel wire former |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620146607.5U CN205588495U (en) | 2016-02-26 | 2016-02-26 | Cutting steel wire and cutting steel wire former |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205588495U true CN205588495U (en) | 2016-09-21 |
Family
ID=56928014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620146607.5U Expired - Fee Related CN205588495U (en) | 2016-02-26 | 2016-02-26 | Cutting steel wire and cutting steel wire former |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205588495U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938505A (en) * | 2017-04-17 | 2017-07-11 | 江西赛维Ldk太阳能高科技有限公司 | It is a kind of that there is diamond wire of double waveform configurations and preparation method thereof |
-
2016
- 2016-02-26 CN CN201620146607.5U patent/CN205588495U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106938505A (en) * | 2017-04-17 | 2017-07-11 | 江西赛维Ldk太阳能高科技有限公司 | It is a kind of that there is diamond wire of double waveform configurations and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160921 Termination date: 20190226 |