SG10201402301RA - Semiconductor device and method of formingpad layout for flipchip semiconductor die - Google Patents

Semiconductor device and method of formingpad layout for flipchip semiconductor die

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Publication number
SG10201402301RA
SG10201402301RA SG10201402301RA SG10201402301RA SG10201402301RA SG 10201402301R A SG10201402301R A SG 10201402301RA SG 10201402301R A SG10201402301R A SG 10201402301RA SG 10201402301R A SG10201402301R A SG 10201402301RA SG 10201402301R A SG10201402301R A SG 10201402301RA
Authority
SG
Singapore
Prior art keywords
formingpad
layout
flipchip
semiconductor device
semiconductor die
Prior art date
Application number
SG10201402301RA
Other languages
English (en)
Inventor
Rajendra D Pendse
Original Assignee
Stats Chippac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stats Chippac Ltd filed Critical Stats Chippac Ltd
Publication of SG10201402301RA publication Critical patent/SG10201402301RA/en

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  • Engineering & Computer Science (AREA)
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SG10201402301RA 2010-12-03 2011-01-20 Semiconductor device and method of formingpad layout for flipchip semiconductor die SG10201402301RA (en)

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