HK1213690A1 - 半導體器件及其製造方法 - Google Patents

半導體器件及其製造方法

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Publication number
HK1213690A1
HK1213690A1 HK16101419.3A HK16101419A HK1213690A1 HK 1213690 A1 HK1213690 A1 HK 1213690A1 HK 16101419 A HK16101419 A HK 16101419A HK 1213690 A1 HK1213690 A1 HK 1213690A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
manufacturing same
manufacturing
same
semiconductor
Prior art date
Application number
HK16101419.3A
Other languages
English (en)
Inventor
藤澤敦
Original Assignee
Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of HK1213690A1 publication Critical patent/HK1213690A1/zh

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    • H—ELECTRICITY
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
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