NL1011929C2 - Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen. - Google Patents

Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen. Download PDF

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Publication number
NL1011929C2
NL1011929C2 NL1011929A NL1011929A NL1011929C2 NL 1011929 C2 NL1011929 C2 NL 1011929C2 NL 1011929 A NL1011929 A NL 1011929A NL 1011929 A NL1011929 A NL 1011929A NL 1011929 C2 NL1011929 C2 NL 1011929C2
Authority
NL
Netherlands
Prior art keywords
electronic components
adhesive
film
adhesive layer
integrated circuits
Prior art date
Application number
NL1011929A
Other languages
English (en)
Dutch (nl)
Inventor
Johannes Bernardus De Vrught
Johannes Bernardus Pet Janssen
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19769109&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL1011929(C2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Priority to NL1011929A priority Critical patent/NL1011929C2/nl
Priority to JP2000615207A priority patent/JP2002543604A/ja
Priority to SG200306435A priority patent/SG121813A1/en
Priority to PCT/NL2000/000280 priority patent/WO2000066340A1/en
Priority to EP00927946A priority patent/EP1175290B1/en
Priority to KR1020017013870A priority patent/KR100701720B1/ko
Priority to AU46249/00A priority patent/AU4624900A/en
Priority to EP03076641A priority patent/EP1338397A3/en
Priority to AT00927946T priority patent/ATE258846T1/de
Priority to DE60008093T priority patent/DE60008093T2/de
Publication of NL1011929C2 publication Critical patent/NL1011929C2/nl
Application granted granted Critical
Priority to US10/021,455 priority patent/US6613607B2/en
Priority to HK02105587A priority patent/HK1044737A1/xx
Priority to US10/612,201 priority patent/US6921682B2/en
Priority to JP2004261963A priority patent/JP3744927B2/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
NL1011929A 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen. NL1011929C2 (nl)

Priority Applications (14)

Application Number Priority Date Filing Date Title
NL1011929A NL1011929C2 (nl) 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen.
AU46249/00A AU4624900A (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronical components
AT00927946T ATE258846T1 (de) 1999-04-29 2000-05-01 Verfahren zur herstellung von eingebetteten elektronischen bauteilen
PCT/NL2000/000280 WO2000066340A1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronical components
EP00927946A EP1175290B1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronical components
KR1020017013870A KR100701720B1 (ko) 1999-04-29 2000-05-01 밀봉형 전자부품을 제조하는 방법
JP2000615207A JP2002543604A (ja) 1999-04-29 2000-05-01 カプセル化電子部品の製造方法
EP03076641A EP1338397A3 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronic components
SG200306435A SG121813A1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronic components, particularly integrated circuits
DE60008093T DE60008093T2 (de) 1999-04-29 2000-05-01 Verfahren zur herstellung von eingebetteten elektronischen bauteilen
US10/021,455 US6613607B2 (en) 1999-04-29 2001-10-29 Method for manufacturing encapsulated electronic components, particularly integrated circuits
HK02105587A HK1044737A1 (en) 1999-04-29 2002-07-30 Method for manufacturing encapsulated electronicalcomponents.
US10/612,201 US6921682B2 (en) 1999-04-29 2003-07-02 Method for manufacturing encapsulated electronic components, particularly integrated circuits
JP2004261963A JP3744927B2 (ja) 1999-04-29 2004-09-09 カプセル化電子部品、特に集積回路の製造方法

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NL1011929A NL1011929C2 (nl) 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen.

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AU (1) AU4624900A (ko)
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US6921682B2 (en) 2005-07-26
DE60008093T2 (de) 2004-09-09
EP1338397A2 (en) 2003-08-27
KR100701720B1 (ko) 2007-03-29
KR20020000883A (ko) 2002-01-05
JP2004349728A (ja) 2004-12-09
WO2000066340A1 (en) 2000-11-09
US20020064926A1 (en) 2002-05-30
EP1175290B1 (en) 2004-02-04
US6613607B2 (en) 2003-09-02
SG121813A1 (en) 2006-05-26
EP1338397A3 (en) 2004-03-24
JP2002543604A (ja) 2002-12-17
JP3744927B2 (ja) 2006-02-15
US20040005737A1 (en) 2004-01-08
EP1175290A1 (en) 2002-01-30
HK1044737A1 (en) 2002-11-01
DE60008093D1 (de) 2004-03-11
AU4624900A (en) 2000-11-17
ATE258846T1 (de) 2004-02-15

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