SG121813A1 - Method for manufacturing encapsulated electronic components, particularly integrated circuits - Google Patents

Method for manufacturing encapsulated electronic components, particularly integrated circuits

Info

Publication number
SG121813A1
SG121813A1 SG200306435A SG200306435A SG121813A1 SG 121813 A1 SG121813 A1 SG 121813A1 SG 200306435 A SG200306435 A SG 200306435A SG 200306435 A SG200306435 A SG 200306435A SG 121813 A1 SG121813 A1 SG 121813A1
Authority
SG
Singapore
Prior art keywords
electronic components
integrated circuits
electrically conducting
encapsulated electronic
adhesive film
Prior art date
Application number
SG200306435A
Other languages
English (en)
Inventor
Johannes Bernardus Pet Janssen
De Johannes Bernardus Vrught
Original Assignee
3P Licensing Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=19769109&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SG121813(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 3P Licensing Bv filed Critical 3P Licensing Bv
Publication of SG121813A1 publication Critical patent/SG121813A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561Batch processing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
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    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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    • H01L2924/3025Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Reverberation, Karaoke And Other Acoustics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
SG200306435A 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronic components, particularly integrated circuits SG121813A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1011929A NL1011929C2 (nl) 1999-04-29 1999-04-29 Werkwijze voor het inkapselen van elektronische componenten, in het bijzonder geintegreerde schakelingen.

Publications (1)

Publication Number Publication Date
SG121813A1 true SG121813A1 (en) 2006-05-26

Family

ID=19769109

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200306435A SG121813A1 (en) 1999-04-29 2000-05-01 Method for manufacturing encapsulated electronic components, particularly integrated circuits

Country Status (11)

Country Link
US (2) US6613607B2 (ko)
EP (2) EP1175290B1 (ko)
JP (2) JP2002543604A (ko)
KR (1) KR100701720B1 (ko)
AT (1) ATE258846T1 (ko)
AU (1) AU4624900A (ko)
DE (1) DE60008093T2 (ko)
HK (1) HK1044737A1 (ko)
NL (1) NL1011929C2 (ko)
SG (1) SG121813A1 (ko)
WO (1) WO2000066340A1 (ko)

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US6908791B2 (en) * 2002-04-29 2005-06-21 Texas Instruments Incorporated MEMS device wafer-level package
NL1020594C2 (nl) 2002-05-14 2003-11-17 Fico Bv Werkwijze voor het met behulp van een folielaag omhullen van een elektronische component.
TW560026B (en) * 2002-08-27 2003-11-01 Uni Tek System Inc Singulation method of the array-type work piece to be singulated having metal layer singulation street, and the array-type work piece to be singulated applying the method
US7759775B2 (en) * 2004-07-20 2010-07-20 Alpha And Omega Semiconductor Incorporated High current semiconductor power device SOIC package
US7238551B2 (en) * 2004-11-23 2007-07-03 Siliconix Incorporated Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys
US7394150B2 (en) * 2004-11-23 2008-07-01 Siliconix Incorporated Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys
US20060180579A1 (en) * 2005-02-11 2006-08-17 Towa Intercon Technology, Inc. Multidirectional cutting chuck
US20070130759A1 (en) * 2005-06-15 2007-06-14 Gem Services, Inc. Semiconductor device package leadframe formed from multiple metal layers
GB0516625D0 (en) * 2005-08-15 2005-09-21 Eurocut Ltd Orthopaedic surgical instrument
JP4782522B2 (ja) * 2005-09-27 2011-09-28 ソニーケミカル&インフォメーションデバイス株式会社 光機能素子パッケージ及びその製造方法
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HK1044737A1 (en) 2002-11-01
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US20040005737A1 (en) 2004-01-08
EP1338397A3 (en) 2004-03-24
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AU4624900A (en) 2000-11-17
EP1175290A1 (en) 2002-01-30
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JP2004349728A (ja) 2004-12-09
US20020064926A1 (en) 2002-05-30
WO2000066340A1 (en) 2000-11-09
KR20020000883A (ko) 2002-01-05
ATE258846T1 (de) 2004-02-15
EP1175290B1 (en) 2004-02-04
US6613607B2 (en) 2003-09-02
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US6921682B2 (en) 2005-07-26
DE60008093D1 (de) 2004-03-11

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